# US 12,224,481 B2 · Semiconductor device package and method of manufacturing the same

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- Number: US 12,224,481 B2
- Document ID: US12224481B2
- Status: Granted
- Kind: B2
- Application number: 18/118,738
- Filed: 2023-03-07
- Published: 2023-07-13
- Granted: 2025-02-11
- Earliest claimed: 2019-07-09
- Assignees: Advanced Semiconductor Engineering, Inc.
- Applicants: Advanced Semiconductor Engineering, Inc.
- Inventors: Cheng-Lin Ho; Chih-Cheng Lee; Chun Chen Chen; Yuanhao Yu
- Web page: https://patentgrep.com/patent/US12224481B2

## CPC

- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H10P 72/74: {using temporarily an auxiliary support}
- H01Q 1/40: Radiating elements coated with or embedded in protective material
- H01Q 1/526: {Electromagnetic shields}
- H01Q 21/0093: {Monolithic arrays}
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H01Q 21/061: {Two dimensional planar arrays}
- H10P 72/7424: {used as a support during the manufacture of self-supporting substrates}
- H10P 72/743: {used as a support during manufacture of interconnect decals or build up layers}
- H10W 44/248: {for antennas}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.

## Claims

### Claim 1

A semiconductor device package, comprising:
a substrate; and
an antenna module disposed over the substrate, the antenna module comprising:
a supporting element;
an antenna pattern disposed over the supporting element;
a pad;
a conductive pillar penetrating the supporting element and electrically connecting the antenna pattern to the pad;
a first dielectric layer disposed below the supporting element and having an opening; and
an electrical contact partially disposed within the opening of the first dielectric layer, and connecting the pad and the substrate,
wherein a lower surface of the pad is exposed from the opening of the first dielectric layer, and the pad directly contacts the conductive pillar and the electrical contact.

### Claim 2 (depends on 1)

The semiconductor device package of claim 1, wherein the antenna module includes a second dielectric layer in contact with lateral surfaces of the antenna pattern, wherein the second dielectric layer includes a portion vertically overlapping the antenna pattern in a cross-sectional view, wherein a thickness of the portion of the second dielectric layer is less than a thickness of antenna pattern.

### Claim 3 (depends on 1)

The semiconductor device package of claim 1, wherein the antenna pattern includes a first portion and a second portion separated from the first portion by a third dielectric layer, wherein a width of the first portion is different from a width of the second portion in a cross-sectional view.

### Claim 4 (depends on 3)

The semiconductor device package of claim 3, wherein the antenna pattern further includes a third portion separated from the first portion and the second portion by the third dielectric layer, wherein the first portion is between the second portion and the third portion, and wherein the width of the first portion is different from a width of the third portion.

### Claim 5 (depends on 4)

The semiconductor device package of claim 4, wherein a horizontal distance between the first portion and the second portion of the antenna pattern is different from a horizontal distance between the first portion and the third portion of the antenna pattern.

### Claim 6 (depends on 3)

The semiconductor device package of claim 3, further comprising an electronic component disposed under the substrate and vertically overlapping the first portion and the second portion of the antenna pattern.

### Claim 7

A semiconductor device package, comprising:
a substrate;
a first antenna module disposed over the substrate, the first antenna module including:
a supporting element;
an antenna pattern disposed over the supporting element, wherein the antenna pattern has a first lateral surface non-perpendicular to a top surface of the substrate in a cross-sectional view;
a conductive pillar within the supporting element; and
a conductive layer disposed between the antenna pattern and the supporting element and connecting the conductive pillar to the antenna pattern; and
a second antenna module disposed over the substrate and spaced apart from the first antenna module.

### Claim 8 (depends on 7)

The semiconductor device package of claim 7, wherein the antenna pattern has a second lateral surface opposite to and non-parallel to the first lateral surface.

### Claim 9 (depends on 7)

The semiconductor device package of claim 7, wherein a first width of the antenna pattern at a first elevation is less than a second width of the antenna pattern at a second elevation in a cross-sectional view, wherein the second elevation is lower than the first elevation with respect to the substrate.

### Claim 10 (depends on 7)

The semiconductor device package of claim 7, wherein the conductive pillar is electrically connected to a feeding point of the antenna pattern for signal transmission.