# US 12,224,479 B2 · Electronic device comprising an antenna and microphone > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,224,479 B2 - Document ID: US12224479B2 - Status: Granted - Kind: B2 - Application number: 18/107,176 - Filed: 2023-02-08 - Published: 2023-06-22 - Granted: 2025-02-11 - Earliest claimed: 2021-09-03 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Cheungwon Ryu; Wondo Ki; Seongkyoo Byeon; Junyoung Yang; Bonam Lee - Web page: https://patentgrep.com/patent/US12224479B2 ## CPC - H01Q 1/22: by structural association with other equipment or articles - H01Q 1/243: {with built-in antennas} - H01Q 5/314: using frequency dependent circuits or components, e.g. trap circuits or capacitors - H01Q 5/335: at the feed, e.g. for impedance matching - H01Q 21/28: Combinations of substantially independent non-interacting antenna units or systems {(multiple beam H01Q25/00)} - H04M 1/02: Constructional features of telephone sets - H04M 1/03: Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets - H04R 1/04: Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) - H04R 1/083: {Special constructions of mouthpieces} - H05K 1/0243: {Printed circuits associated with mounted high frequency components} - H04R 2499/11: Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H04M: TELEPHONIC COMMUNICATION (circuits for controlling other apparatus via a telephone cable and not involving telephone switching apparatus G08) - H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract According to an embodiment, an electronic device includes: a housing forming an inner space of the electronic device; a printed circuit board (PCB) disposed in the inner space and including a ground; a microphone module including a microphone housing disposed at a point on the PCB adjacent to a side surface of the housing, the microphone housing being electrically connected with the ground; a conductive member comprising a conductive material disposed, spaced apart from a surface of the microphone housing by a specified distance or less, and overlapping at least part of the microphone housing with reference to a first direction in which a rear surface of the electronic device faces, the conductive member being coupled and electrically connected with the microphone housing; and a wireless communication circuit disposed on the PCB, and the wireless communication circuit is configured to transmit and/or receive a signal of a specified frequency band, based on an electrical path including the conductive member and the microphone housing, by feeding the conductive member. ## Claims ### Claim 1 An electronic device comprising: a housing forming an inner space of the electronic device; a printed circuit board (PCB) disposed in the inner space and including a ground; a microphone module comprising a microphone housing disposed at a point on the PCB adjacent to a side surface of the housing, the microphone housing being electrically connected with the ground; a conductive member comprising a conductive material disposed, spaced apart from a surface of the microphone housing by a specified distance or less, and overlapping at least part of the microphone housing with reference to a first direction in which a rear surface of the electronic device faces, the conductive member being coupled and electrically connected with the microphone housing; and a wireless communication circuit disposed on the PCB, wherein the wireless communication circuit is configured to transmit and/or receive a signal of a specified frequency band, based on an electrical path comprising the conductive member and the microphone housing, by feeding the conductive member. ### Claim 2 (depends on 1) The electronic device of claim 1, wherein the specified distance is within 0.3 mm. ### Claim 3 (depends on 1) The electronic device of claim 1, wherein the conductive member comprises a laser direct structuring (LDS) antenna. ### Claim 4 (depends on 1) The electronic device of claim 1, wherein a conductive portion corresponding to a part of the housing is electrically connected with the conductive member, and wherein the wireless communication circuit is configured to transmit and/or receive a signal of a specified frequency band, based on the electrical path further comprising the conductive portion, by feeding at the conductive portion of the housing. ### Claim 5 (depends on 1) The electronic device of claim 1, wherein the wireless communication circuit is configured to transmit and/or receive a signal of a first frequency band by feeding at a first point of the conductive member, and wherein the wireless communication circuit is configured to transmit and/or receive a signal of a second frequency band by feeding at a second point of the conductive member, different from the first point. ### Claim 6 (depends on 5) The electronic device of claim 5, wherein the first frequency band has a frequency band of a first size, and wherein the second frequency band has a second frequency band of a second size smaller than the first size. ### Claim 7 (depends on 1) The electronic device of claim 1, wherein the microphone housing is electrically connected with the ground through a conductive path, and wherein the electronic device further comprises a capacitor disposed on the conductive path. ### Claim 8 (depends on 1) The electronic device of claim 1, wherein the microphone module is disposed at a point on the PCB adjacent to a first side surface at an upper end of the electronic device among side surfaces of the housing. ### Claim 9 (depends on 1) The electronic device of claim 1, wherein the conductive member is configured to operate as a diversity antenna. ### Claim 10 (depends on 1) The electronic device of claim 1, wherein the PCB comprises a plurality of conductive layers, and wherein the ground is formed on a first layer among the plurality of conductive layers of the PCB. ### Claim 11 (depends on 1) The electronic device of claim 1, further comprising a switching module comprising a switch at least one lumped element electrically connected with the microphone housing. ### Claim 12 (depends on 11) The electronic device of claim 11, wherein the wireless communication circuit is configured to control the switching module to perform impedance matching in response to the designated frequency band. ### Claim 13 (depends on 1) The electronic device of claim 1, wherein the microphone housing comprises at least one hole formed inside the microphone housing to face in a second direction opposite to the first direction, and wherein a sound is input to the microphone module through the at least one hole. ### Claim 14 (depends on 1) The electronic device of claim 1, further comprising a universal serial bus (USB) connector disposed on the side surface of the housing, wherein the microphone housing is disposed adjacent to the USB connector. ### Claim 15 (depends on 1) The electronic device of claim 1, wherein the specified frequency band comprises a frequency band within a range from 2,375 MHz to 2,600 MHz. ### Claim 16 An electronic device comprising: a housing forming an inner space of the electronic device, a part of the housing comprising a conductive member; a printed circuit board (PCB) disposed in the inner space and including a ground; a microphone module comprising a microphone housing disposed at a point on the PCB adjacent to a side surface of the housing, the microphone housing being electrically connected with the ground; and a wireless communication circuit disposed on the PCB, wherein the conductive member is disposed, spaced apart from a surface of the microphone housing by a specified distance or less, and overlapping at least part of the microphone housing with reference to a second direction perpendicular to a first direction in which a rear surface of the electronic device faces, wherein the conductive member and the microphone housing are coupled and electrically connected, wherein the wireless communication circuit is configured to transmit and/or receive a signal of a specified frequency band, based on an electrical path comprising the conductive member and the microphone housing, by feeding the conductive member. ### Claim 17 (depends on 16) The electronic device of claim 16, wherein the specified distance is within 0.3 mm. ### Claim 18 (depends on 16) The electronic device of claim 16, wherein the wireless communication circuit is configured to transmit and/or receive a signal of a first frequency band by feeding at a first point of the conductive member, and to transmit and/or receive a signal of a second frequency band by feeding at a second point of the conductive member, different from the first point. ### Claim 19 (depends on 18) The electronic device of claim 18, wherein the first frequency band has a frequency band of a first size, and wherein the second frequency band has a second frequency band of a second size smaller than the first size. ### Claim 20 (depends on 16) The electronic device of claim 16, wherein the microphone housing is electrically connected with the ground through a conductive path, and wherein the electronic device further comprises a capacitor disposed on the conductive path.