# US 12,224,390 B2 · Electronic component mounting substrate and electronic device

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,224,390 B2
- Document ID: US12224390B2
- Status: Granted
- Kind: B2
- Application number: 17/914,031
- Filed: 2021-03-23
- Published: 2023-04-20
- Granted: 2025-02-11
- Earliest claimed: 2020-03-27
- Assignees: KYOCERA Corporation
- Applicants: KYOCERA Corporation
- Inventors: Kouichirou Sugai; Kazuki Nishimoto
- Web page: https://patentgrep.com/patent/US12224390B2

## CPC

- H10H 20/8583: {not being in contact with the bodies}
- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- H01S 5/02315: Support members, e.g. bases or carriers
- H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)}
- H10F 77/60: Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
- H01S 5/02469: {Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC}
- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- H05K 1/181: associated with surface mounted components
- H05K 2201/10106: Light emitting diode [LED]
- H10H 20/858: Means for heat extraction or cooling
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION

## Abstract

An electronic component mounting substrate includes: a metal substrate including a first surface, an insulation substrate including a second surface on which a first metal layer having a frame shape is provided, and a bonding material that bonds the first surface and the first metal layer. The bonding material is located in a region that includes the first metal layer and that is surrounded by the first metal layer in a plane perspective.

## Claims

### Claim 1

An electronic component mounting substrate, comprising: a metal substrate comprising a first surface; an insulation substrate comprising a second surface having at least one metal layer having a thickness projecting therefrom that covers a portion of the second surface such that the second surface is divided into an area covered by the at least one metal layer and an area uncovered by any metal layer the at least one metal layer including a first metal layer having a frame shape disposed proximate a perimeter of the insulation substrate second surface and surrounding a portion of the uncovered area; and a layer of bonding material that bonds the first surface and the first metal layer that extends beneath the first metal layer and the area the first metal layer surrounds and that extends upwardly in the portion of the uncovered area that is surrounded by the frame shape less than the projecting thickness of the first metal layer whereby the bonding layer absorbs stress due to differential heat expansion characteristics between the metal substrate and the insulation substrate.

### Claim 2 (depends on 1)

The electronic component mounting substrate according to claim 1, wherein
the insulation substrate comprises a second metal layer located inside the first metal layer in a front view of the second surface.

### Claim 3 (depends on 2)

The electronic component mounting substrate according to claim 2, wherein
the second metal layer is separated from the first metal layer in the front view.

### Claim 4 (depends on 2)

The electronic component mounting substrate according to claim 2, wherein
the second metal layer is connected to the first metal layer in the front view.

### Claim 5 (depends on 1)

An electronic device, comprising:
the electronic component mounting substrate of claim 1; and
an electronic component mounted on the electronic component mounting substrate.

### Claim 6 (depends on 1)

The electronic component mounting substrate according to claim 1, wherein the portion of the uncovered area surrounded by the first metal layer is substantially larger than the area covered by any metal layer.