# US 12,224,366 B2 · Manufacturing method and manufacturing apparatus for interconnection member > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,224,366 B2 - Document ID: US12224366B2 - Status: Granted - Kind: B2 - Application number: 18/023,518 - Filed: 2020-11-23 - Published: 2023-08-31 - Granted: 2025-02-11 - Earliest claimed: 2020-08-31 - Assignees: Longi Solar Technology (Taizhou) Co., Ltd. - Applicants: Longi Solar Technology (Taizhou) Co., Ltd. - Inventors: Hua Li; Yong Wang; Peng Chen; Debao Zhao; Jun Chen; Jiyu Liu - Web page: https://patentgrep.com/patent/US12224366B2 ## CPC - H10F 19/904: {characterised by the shapes of the structures} - H10F 19/908: {for back-contact photovoltaic cells} - H10F 19/906: {characterised by the materials of the structures} - H10F 77/937: {Busbar structures for modules} - Y02E 10/50: Photovoltaic [PV] energy - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract The present disclosure discloses a manufacturing method and a manufacturing device for an interconnection piece. The manufacturing method comprises providing a solder strip, and performing forming treatment on the solder strip to obtain a plurality of structural solder strips; and providing a flexible insulating substrate, and compounding the plurality of structural solder strips on the flexible insulating substrate at intervals to obtain the interconnection piece. Each structural solder strip is provided with two soldering portions and a connecting portion located between the two soldering portions, and the connecting portion is respectively connected to the two soldering portions; at least a part of the connecting portion is located on the flexible insulating substrate, and the two soldering portions extend out of the flexible insulating substrate. ## Claims ### Claim 1 An interconnection piece applied to back-contact cell interconnection, wherein the interconnection piece comprises: a flexible insulating substrate and a plurality of structural solder strips arranged on the flexible insulating substrate at intervals; and a material of the flexible insulating substrate comprises an insulating polymer material, wherein the insulating polymer material comprises at least one of polyvinyl butyral (PVB), polyolefin (POE) and ethylene-vinyl acetate copolymer (EVA); and each structural solder strip is provided with two soldering portions and a connecting portion located between the two soldering portions, wherein the flexible insulating substrate is internally provided with a conducting layer, and the connecting portion of each structural solder strip is positioned on the conducting layer and directly electrically contacts the conducting layer. ### Claim 2 (depends on 1) The interconnection piece according to claim 1, wherein the connecting portion is provided with a hollow structure for releasing stress, and the hollow structure comprises at least one through hole; wherein a pattern of each through hole is a closed pattern; and/or the pattern of each through hole is a polygonal pattern, a circular pattern, an elliptical pattern or a special-shaped pattern. ### Claim 3 (depends on 2) The interconnection piece according to claim 2, wherein the hollow structure comprises m rows of through holes, and m is an integer greater than or equal to 1; and each row of through holes comprises at least one through hole, and the first row of through holes and the m-th row of through holes are formed in the connecting portion along any direction parallel to the connecting portion; and when m is an integer greater than or equal to 2, two adjacent rows of through holes are distributed in a staggered manner. ### Claim 4 (depends on 3) The interconnection piece according to claim 3, wherein central axes of the two soldering portions are collinear; and/or a width of each soldering portion is smaller than a maximum width of the connecting portion, and each soldering portion is connected to the connecting portion in an arc transition mode. ### Claim 5 (depends on 1) The interconnection piece according to claim 1, wherein the flexible insulating substrate is a light-shielding flexible insulating substrate; or at least one surface of the flexible insulating substrate is partially or completely provided with a shielding coating; or the flexible insulating substrate is a single-sided adhesive tape or a double-sided adhesive tape; or a surface of the connecting portion of each structural solder strip away from the flexible insulating substrate is exposed; or at least a part of the connecting portion of each structural solder strip is wrapped in the flexible insulating substrate. ### Claim 6 (depends on 1) A solar cell assembly, comprising the interconnection piece according to claim 1.