# US 12,224,272 B2 · Manufacturing micro-LED displays to reduce subpixel crosstalk

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,224,272 B2
- Document ID: US12224272B2
- Status: Granted
- Kind: B2
- Application number: 17/701,599
- Filed: 2022-03-22
- Published: 2022-09-29
- Granted: 2025-02-11
- Earliest claimed: 2021-03-25
- Assignees: Applied Materials, Inc.
- Applicants: Applied Materials, Inc.
- Inventors: Lisong Xu; Byung Sung Kwak; Mingwei Zhu; Hou T. Ng; Nag B. Patibandla; Christopher Dennis Bencher
- Web page: https://patentgrep.com/patent/US12224272B2

## CPC

- H10W 90/00: Package configurations
- H10H 20/01: Manufacture or treatment
- H10H 20/034: {of coatings}
- H10H 20/814: having reflecting means, e.g. semiconductor Bragg reflectors
- H10H 20/835: {Reflective materials}
- H10H 20/841: Reflective coatings, e.g. dielectric Bragg reflectors
- H10H 20/8506: {Containers}
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10H 20/856: Reflecting means
- H10H 20/036: {of packages}
- H10H 20/0362: {of encapsulations}
- H10H 20/0363: {of optical field-shaping means}
- H10H 20/825: containing nitrogen, e.g. GaN
- H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings
- H10H 20/853: characterised by their shape
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

A method for manufacturing micro-LED displays includes depositing a first material over a substrate having a plurality of micro-LEDs such that the plurality of micro-LEDs are covered by the first material and the first material fills gaps laterally separating the micro-LEDs, removing a portion of the first material from the gaps that laterally separate the plurality of micro-LEDs to form trenches that extend to or below light-emitting layers of the micro-LEDs, depositing a second material over the substrate such that the second material covers the first material and extends into the trenches, and removing a portion of the first and second material over the plurality of micro-LEDs to expose top surfaces of the plurality of micro-LEDs and such that isolation walls positioned in the gaps between the plurality of micro-LEDs extend vertically higher than the top surface of the first material.

## Claims

### Claim 1

A method for manufacturing micro-LED displays, comprising:
depositing a first material over a substrate having a plurality of micro-LEDs that emit light in a first wavelength range such that the plurality of micro-LEDs are covered by the first material and the first material fills gaps laterally separating the micro-LEDs;
removing a portion of the first material from the gaps that laterally separate the plurality of micro-LEDs to form trenches in the first material that extend to or below light-emitting layers of the micro-LEDs;
depositing a second material over the substrate such that the second material covers the first material and extends into the trenches in the first material;
removing a portion of the first and second materials over the plurality of micro-LEDs to form wells over each the plurality of micro-LEDs and such that a plurality of walls of the second material positioned in the gaps between the plurality of micro-LEDs extend vertically higher than a top surface of the first material;
depositing a third material that conformally coats bottoms of the wells and surfaces of the walls of the second material to form isolation walls between the plurality of micro-LEDs, wherein the third material has higher opacity than the second material and has transmittance less than 1% of light in the first wavelength range; and
removing a portion of the third material over the micro-LEDs at the bottoms of the wells.

### Claim 2 (depends on 1)

The method of claim 1, wherein the first material is a photoresist material, or a redistribution layer material.

### Claim 3 (depends on 1)

The method of claim 1, wherein removing the portion of the first and second materials over the micro-LEDs includes removal of the portion of the second material over the micro-LEDs until top surfaces of the micro-LEDs are exposed.

### Claim 4 (depends on 1)

The method of claim 1, wherein removing the portion of the first and second materials over the micro-LEDs includes removal of the second material across regions over the micro-LEDs and over gaps between the micro-LEDs until the first material is exposed.

### Claim 5 (depends on 1)

The method of claim 1, the method further comprising:
depositing a fourth material over the third material such that the third material is covered and an area between the isolation walls of the second material coated in the third material are filled; and
removing a portion of the fourth material over the micro-LEDs to expose top surfaces of the micro-LEDs.

### Claim 6 (depends on 5)

The method of claim 5, wherein the third material is a metal.

### Claim 7 (depends on 6)

The method of claim 6, wherein the fourth material is a photoresist material.

### Claim 8 (depends on 7)

The method of claim 7, wherein the fourth material provides a mask over the isolation walls during removal of the third material over the micro-LEDs.

### Claim 9 (depends on 1)

The method of claim 1, wherein the first material is a photoresist.

### Claim 10 (depends on 1)

The method of claim 1, wherein the first materials blocks at least a portion of the light emitted by the micro-LEDs.

### Claim 11 (depends on 1)

The method of claim 1, wherein the second material has greater than 95% transmission to the first wavelength range.

### Claim 12 (depends on 1)

The method of claim 1, wherein the second material is a photoresist.

### Claim 13 (depends on 12)

The method of claim 12, wherein the second materials is a negative photoresist.

### Claim 14 (depends on 1)

The method of claim 1, wherein the third material is a metal.

### Claim 15 (depends on 1)

The method of claim 1, further comprising depositing color conversion layers into the wells over each micro-LED to convert ultraviolet light from the micro-LED to a visible light.
