# US 12,224,255 B2 · Electronic package including lead frame having multiple conductive posts

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- Number: US 12,224,255 B2
- Document ID: US12224255B2
- Status: Granted
- Kind: B2
- Application number: 18/607,815
- Filed: 2024-03-18
- Published: 2024-09-26
- Granted: 2025-02-11
- Earliest claimed: 2020-04-09
- Assignees: Siliconware Precision Industries Co., Ltd.
- Applicants: Siliconware Precision Industries Co., Ltd.
- Inventors: Chih-Hsien Chiu; Wen-Jung Tsai
- Web page: https://patentgrep.com/patent/US12224255B2

## CPC

- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 42/273: {the arrangements being between laterally adjacent chips, e.g. walls between chips}
- H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation}
- H10W 70/479: {on or in insulating or insulated package substrates, interposers, or redistribution layers}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 74/01: Manufacture or treatment
- H10W 74/114: {by a substrate and the encapsulations}
- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H10W 44/248: {for antennas}
- H10W 70/688: {Flexible insulating substrates}
- H10W 72/072: {of bump connectors}
- H10W 72/073: {of die-attach connectors}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/10: characterised by their shape or disposition
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/726: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)

## Abstract

An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.

## Claims

### Claim 1

A method for fabricating an electronic package, comprising:
providing a carrier structure having an antenna function;
disposing and electrically connecting at least one electronic element and at least one lead frame onto the carrier structure, wherein the at least one lead frame has a plurality of conductive posts separated from one another; and
forming an encapsulant on the carrier structure for encapsulating the at least one electronic element and the at least one lead frame, wherein the encapsulant is defined with a first encapsulating portion and a second encapsulating portion that are integrally formed with one another, wherein the at least one electronic element is positioned in the first encapsulating portion and the plurality of conductive posts are positioned in the second encapsulating portion, wherein a height of the first encapsulating portion is greater than a height of the second encapsulating portion, and wherein end surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion to electrically connect to a connector, and
wherein the at least one lead frame further has at least one conductive wall embedded in the encapsulant, and wherein the at least one conductive wall is separated from the plurality of conductive posts and exposed from the second encapsulating portion.

### Claim 2 (depends on 1)

The method of claim 1, wherein formation of the encapsulant comprises forming an encapsulating material encapsulating the at least one electronic element and the at least one lead frame and then removing a portion of the encapsulating material and a portion of the at least one lead frame to form the encapsulant having the first encapsulating portion and the second encapsulating portion, and wherein the end surfaces of the plurality of conductive posts are exposed from the surface of the second encapsulating portion.

### Claim 3 (depends on 1)

The method of claim 1, wherein the carrier structure comprises a circuit board and an antenna board stacked on one another.

### Claim 4 (depends on 1)

The method of claim 1, further comprising covering the at least one electronic element with a shielding structure.

### Claim 5 (depends on 4)

The method of claim 4, further comprising forming the shielding structure on portions of surfaces of the encapsulant to cover the at least one electronic element and not in contact with the plurality of conductive posts.

### Claim 6 (depends on 5)

The method of claim 5, wherein the at least one conductive wall is connected to the shielding structure.

### Claim 7 (depends on 5)

The method of claim 5, wherein the at least one lead frame further has at least one conductive block embedded in the encapsulant, and wherein the at least one conductive block is separated from the plurality of conductive posts, exposed from the first encapsulating portion and connected to the shielding structure.

### Claim 8 (depends on 1)

The method of claim 1, further comprising disposing the connector on the plurality of conductive posts.

### Claim 9 (depends on 1)

The method of claim 1, further comprising disposing an adapter configured with the connector on the plurality of conductive posts.

### Claim 10 (depends on 9)

The method of claim 9, wherein the adapter is a flexible circuit board.

### Claim 11 (depends on 1)

The method of claim 1, wherein the second encapsulating portion is disposed on one side of the carrier structure.

### Claim 12 (depends on 1)

The method of claim 1, wherein the second encapsulating portion is disposed at a corner of the carrier structure.

### Claim 13 (depends on 1)

The method of claim 1, wherein the encapsulant has a plurality of second encapsulating portions, and wherein the first encapsulating portion is positioned between two of the second encapsulating portions.

### Claim 14 (depends on 1)

The method of claim 1, wherein the encapsulant has a plurality of first encapsulating portions, and wherein the second encapsulating portion is positioned between two of the first encapsulating portions.