# US 12,224,254 B2 · Millimeter-wave antenna chip and terminal device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,224,254 B2 - Document ID: US12224254B2 - Status: Granted - Kind: B2 - Application number: 17/855,358 - Filed: 2022-06-30 - Published: 2022-10-20 - Granted: 2025-02-11 - Earliest claimed: 2019-12-31 - Assignees: Huawei Technologies Co., Ltd. - Applicants: Huawei Technologies Co., Ltd. - Inventors: Weixi Zhou; Liangsheng Liu; Guowen Liu - Web page: https://patentgrep.com/patent/US12224254B2 ## CPC - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 1/243: {with built-in antennas} - H01Q 1/422: {comprising two or more layers of dielectric material (H01Q1/425 takes precedence)} - H01Q 1/526: {Electromagnetic shields} - H01Q 9/065: {Microstrip dipole antennas (patch antenna H01Q9/0407)} - H01Q 21/067: {using endfire radiating aerial units transverse to the plane of the array} - H01Q 21/08: the units being spaced along or adjacent to a rectilinear path {(waveguide fed H01Q21/0037)} - H05K 1/0243: {Printed circuits associated with mounted high frequency components} - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - H05K 2201/042: Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other - H10W 44/209: {Vertical interconnections, e.g. vias} - H10W 44/216: {Waveguides, e.g. strip lines} - H10W 44/248: {for antennas} - H10W 44/255: {for operation at multiple different frequencies} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract The disclosure provides a millimeter-wave antenna chip including a package substrate, at least one subunit, and a radio frequency chip. Each subunit includes an end-fire antenna disposed on an upper surface of the package substrate. The end-fire antenna is electrically connected to the radio frequency chip through a feed line. The radio frequency chip is located on a lower surface of the package substrate. ## Claims ### Claim 1 A millimeter-wave antenna chip, comprising: a package substrate, at least one subunit, and a radio frequency chip, wherein: each subunit comprises an end-fire antenna and a metalized fence, and the end-fire antenna is disposed on an upper surface of the package substrate; the end-fire antenna is electrically connected to the radio frequency chip through a feed line, and the feed line is located between the metalized fence and the end-fire antenna; and the radio frequency chip is located on a lower surface of the package substrate. ### Claim 2 (depends on 1) The millimeter-wave antenna chip according to claim 1, wherein: the metalized fence comprises a plurality of metal through holes extending from the upper surface of the package substrate to the lower surface, and a metal patch electrically connected to the plurality of metal through holes; and a distance between any two of the plurality of metal through holes that are adjacent in a horizontal direction is less than one tenth of a wavelength corresponding to a resonance frequency of the end-fire antenna. ### Claim 3 (depends on 2) The millimeter-wave antenna chip according to claim 2, wherein a distance between the metalized fence and the end-fire antenna is a quarter of the wavelength corresponding to the resonance frequency of the end-fire antenna. ### Claim 4 (depends on 2) The millimeter-wave antenna chip according to claim 2, wherein each subunit further comprises a broadside antenna, and the metalized fence is located between the broadside antenna and the end-fire antenna. ### Claim 5 (depends on 4) The millimeter-wave antenna chip according to claim 4, wherein the metalized fence is located around the broadside antenna. ### Claim 6 (depends on 1) The millimeter-wave antenna chip according to claim 1, wherein the feed line comprises: a first horizontal feed line, a second horizontal feed line, a first metal via hole feed line, and a second metal via hole feed line, wherein: one end of the first metal via hole feed line is electrically connected to the end-fire antenna at a first feeding point through the first horizontal feed line, and the other end of the first metal via hole feed line is electrically connected to the radio frequency chip; and two ends of the second metal via hole feed line are electrically connected to the end-fire antenna at a second feeding point through the second horizontal feed line, and the other end of the second metal via hole feed line is electrically connected to the radio frequency chip. ### Claim 7 (depends on 6) The millimeter-wave antenna chip according to claim 6, wherein the end-fire antenna is a dipole antenna. ### Claim 8 (depends on 7) The millimeter-wave antenna chip according to claim 7, wherein a phase difference between an electrical signal at the first feeding point and an electrical signal at the second feeding point is 180°. ### Claim 9 (depends on 6) The millimeter-wave antenna chip according to claim 6, wherein the first metal via hole feed line and the second metal via hole feed line extend from the upper surface of the package substrate to the lower surface in an inverted V shape. ### Claim 10 (depends on 1) The millimeter-wave antenna chip according to claim 1, wherein the end-fire antenna comprises a parasitic element located on a side that is of the end-fire antenna and that is not adjacent to the feed line. ### Claim 11 A terminal device, comprising at least one millimeter-wave antenna chip, wherein the at least one millimeter-wave antenna chip comprises a package substrate, at least one subunit, and a radio frequency chip, wherein: each subunit comprises an end-fire antenna and a metalized fence, and the end-fire antenna is disposed on an upper surface of the package substrate; the end-fire antenna is electrically connected to the radio frequency chip through a feed line, and the feed line is located between the metalized fence and the end-fire antenna; and the radio frequency chip is located on a lower surface of the package substrate. ### Claim 12 (depends on 11) The terminal device according to claim 11, wherein the metalized fence comprises a plurality of metal through holes extending from the upper surface of the package substrate to the lower surface, and a metal patch electrically connected to the plurality of metal through holes; and a distance between any two of the plurality of metal through holes that are adjacent in a horizontal direction is less than one tenth of a wavelength corresponding to a resonance frequency of the end-fire antenna. ### Claim 13 (depends on 12) The terminal device according to claim 12, wherein a distance between the metalized fence and the end-fire antenna is a quarter of the wavelength corresponding to the resonance frequency of the end-fire antenna. ### Claim 14 (depends on 12) The terminal device according to claim 12, wherein each subunit further comprises a broadside antenna, and the metalized fence is located between the broadside antenna and the end-fire antenna. ### Claim 15 (depends on 14) The terminal device according to claim 14, wherein the metalized fence is located around the broadside antenna. ### Claim 16 (depends on 11) The terminal device according to claim 11, wherein the feed line comprises: a first horizontal feed line, a second horizontal feed line, a first metal via hole feed line, and a second metal via hole feed line, wherein: one end of the first metal via hole feed line is electrically connected to the end-fire antenna at a first feeding point through the first horizontal feed line, and other end of the first metal via hole feed line is electrically connected to the radio frequency chip; and two ends of the second metal via hole feed line are electrically connected to the end-fire antenna at a second feeding point through the second horizontal feed line, and the other end of the second metal via hole feed line is electrically connected to the radio frequency chip. ### Claim 17 (depends on 16) The terminal device according to claim 16, wherein the end-fire antenna is a dipole antenna. ### Claim 18 (depends on 17) The terminal device according to claim 17, wherein a phase difference between an electrical signal at the first feeding point and an electrical signal at the second feeding point is 180°. ### Claim 19 (depends on 16) The terminal device according to claim 16, wherein the first metal via hole feed line and the second metal via hole feed line extend from the upper surface of the package substrate to the lower surface in an inverted V shape. ### Claim 20 (depends on 11) The terminal device according to claim 11, wherein the end-fire antenna comprises a parasitic element located on a side that is of the end-fire antenna and that is not adjacent to the feed line.