# US 12,224,252 B2 · Magnetic core inductors in interposer

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- Number: US 12,224,252 B2
- Document ID: US12224252B2
- Status: Granted
- Kind: B2
- Application number: 17/030,121
- Filed: 2020-09-23
- Published: 2022-03-24
- Granted: 2025-02-11
- Earliest claimed: 2020-09-23
- Assignees: Intel Corporation
- Applicants: Intel Corporation
- Inventors: Krishna Bharath; William J. Lambert; Haifa Hariri; Siddharth Kulasekaran; Mathew Manusharow; Anne Augustine
- Web page: https://patentgrep.com/patent/US12224252B2

## CPC

- H10W 44/501: {Inductive arrangements (H10W44/20 takes precedence)}
- H01F 17/06: with core substantially closed in itself, e.g. toroid
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/685: comprising multiple insulating layers
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H01F 2017/002: {Details of via holes for interconnecting the layers}
- H01F 2017/065: {Core mounted around conductor to absorb noise, e.g. EMI filter}
- H01F 2017/067: {Core with two or more holes to lead through conductor}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES

## Abstract

Embodiments disclosed herein include coreless interposers with embedded inductors. In an embodiment, a coreless interposer comprises a plurality of buildup layers, where electrical routing is provided in the plurality of buildup layers. In an embodiment, the coreless interposer further comprises an inductor embedded in the plurality of buildup layers. In an embodiment, the inductor comprises a magnetic shell, and a conductive lining over an interior surface of the magnetic shell.

## Claims

### Claim 1

A coreless interposer, comprising:
a plurality of buildup layers, wherein electrical routing is provided in the plurality of buildup layers; and
an inductor embedded in the plurality of buildup layers, wherein the inductor comprises:
a plurality of discrete magnetic shells; and
a conductive lining over an interior surface of each of the plurality of discrete magnetic shells.

### Claim 2 (depends on 1)

The coreless interposer of claim 1, wherein the inductor extends through two or more of the plurality of buildup layers.

### Claim 3 (depends on 1)

The coreless interposer of claim 1, wherein a first end of the inductor is below a topmost buildup layer, and wherein a second end of the inductor is above a bottommost buildup layer.

### Claim 4 (depends on 1)

The coreless interposer of claim 1, further comprising:
a second inductor embedded in the plurality of buildup layers, wherein the second inductor comprises:
a second magnetic shell; and
a second conductive lining over an interior surface of the second magnetic shell.

### Claim 5 (depends on 4)

The coreless interposer of claim 4, wherein a first end of the inductor is electrically coupled to a first end of the second inductor by a trace.

### Claim 6 (depends on 1)

The coreless interposer of claim 1, wherein a first end of the inductor is electrically coupled to a pad on a topmost surface of the plurality of buildup layers by one or more vias.

### Claim 7 (depends on 1)

The coreless interposer of claim 1, further comprising:
a second conductive lining over an interior surface of each of the plurality of discrete magnetic shells, wherein the conductive lining and the second conductive lining are coupled together by a corresponding one of the plurality of discrete magnetic shells.

### Claim 8 (depends on 1)

The coreless interposer of claim 1, further comprising:
a plug within the conductive lining.

### Claim 9 (depends on 1)

The coreless interposer of claim 1, further comprising:
a coreless package coupled to the coreless interposer; and
a die coupled to the coreless package.

### Claim 10

A coreless interposer, comprising:
a plurality of buildup layers wherein electrical routing is provided in the plurality of buildup layers;
an inductor embedded in the plurality of buildup layers, wherein the inductor comprises:
a first magnetic block;
a second magnetic block, wherein the second magnetic block is connected to the first magnetic block by a first magnetic lid;
a third magnetic block;
a fourth magnetic block, wherein the fourth magnetic block is connected to the third magnetic block by a second magnetic lid; and
a first plurality of conductive loops surrounding the second magnetic block; and
a second plurality of conductive loops surrounding the third magnetic block.

### Claim 11 (depends on 10)

The coreless interposer of claim 10, wherein the first plurality of conductive loops and the second plurality of conductive loops are disposed in more than one buildup layer of the plurality of buildup layers.

### Claim 12 (depends on 10)

The coreless interposer of claim 10, further comprising:
shielding layers over a first end and a second end of the inductor.

### Claim 13 (depends on 10)

The coreless interposer of claim 10, wherein the first plurality of conductive loops are electrically coupled to the second plurality of conductive loops.

### Claim 14 (depends on 10)

The coreless interposer of claim 10, wherein the first magnetic block, the second magnetic block, the third magnetic block, and the fourth magnetic block pass through two or more buildup layers.

### Claim 15 (depends on 10)

The coreless interposer of claim 10, wherein the first conductive loops and the second conductive loops are part of the electrical routing in the plurality of buildup layers.

### Claim 16 (depends on 10)

The coreless interposer of claim 10, wherein the first magnetic block, the second magnetic block, the third magnetic block, and the fourth magnetic block comprise a first row of magnetic blocks, and wherein the inductor further comprises at least a second row of magnetic blocks.

### Claim 17 (depends on 16)

The coreless interposer of claim 16, wherein the inductor further comprises:
a third plurality of conductive loops surrounding magnetic blocks in the second row of magnetic blocks; and
a fourth plurality of conductive loops surrounding magnetic blocks in the second row of magnetic blocks.

### Claim 18 (depends on 10)

The coreless interposer of claim 10, wherein the first magnetic block, the second magnetic block, the third magnetic block, and the fourth magnetic block are cylinders.

### Claim 19

An electronic system, comprising:
a board;
a coreless interposer coupled to the board, wherein the coreless interposer comprises:
an embedded inductor, comprising a plurality of discrete magnetic shells with a conductive layer lining an interior surface of each of the plurality of discrete magnetic shells;
a coreless patch coupled to the coreless interposer; and
a die coupled to the coreless patch.

### Claim 20 (depends on 19)

The electronic system of claim 19, wherein the inductor is vertically oriented, and wherein the inductor passes through a plurality of buildup layers of the coreless interposer.

### Claim 21

A coreless interposer, comprising:
a plurality of buildup layers, wherein electrical routing is provided in the plurality of buildup layers;
a first inductor embedded in the plurality of buildup layers, wherein the first inductor comprises:
a first magnetic shell; and
a first conductive lining over an interior surface of the first magnetic shell; and
a second inductor embedded in the plurality of buildup layers, wherein the second inductor comprises:
a second magnetic shell; and
a second conductive lining over an interior surface of the second magnetic shell.

### Claim 22 (depends on 21)

The coreless interposer of claim 21, wherein a first end of the first inductor is electrically coupled to a first end of the second inductor by a trace.

### Claim 23 (depends on 21)

The coreless interposer of claim 21, wherein each of the first inductor and the second inductor extends through two or more of the plurality of buildup layers.

### Claim 24 (depends on 21)

The coreless interposer of claim 21, wherein a first end of each of the first inductor and the second inductor is below a topmost buildup layer, and wherein a second end of each of the first inductor and the second inductor is above a bottommost buildup layer.

### Claim 25 (depends on 21)

The coreless interposer of claim 21, further comprising:
a first plug within the first conductive lining; and
a second plug within the second conductive lining.