# US 12,224,249 B2 · Package module comprising marking and shield films and method of manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,224,249 B2 - Document ID: US12224249B2 - Status: Granted - Kind: B2 - Application number: 17/497,132 - Filed: 2021-10-08 - Published: 2022-01-27 - Granted: 2025-02-11 - Earliest claimed: 2019-04-26 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Toru Komatsu; Tadashi Nomura - Web page: https://patentgrep.com/patent/US12224249B2 ## CPC - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H05K 9/00: Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an antenna H01Q17/00) - H10W 46/00: Marks applied to devices, e.g. for alignment or identification - H10W 74/014: {using batch processing} - H10W 74/114: {by a substrate and the encapsulations} - H10W 46/401: {for identification or tracking} - H10W 46/607: {Located on parts of packages, e.g. on encapsulations or on package substrates} - H10W 72/0198: {batch processes} - H10W 74/117: {the substrate having spherical bumps for external connection} - H10W 90/00: Package configurations - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A module is disclosed that includes a substrate having a first main surface, a first component mounted on the first main surface, a first sealing resin disposed so as to cover the first main surface and the first component, a marking film covering at least an upper surface of the first sealing resin, and a shield film covering the marking film. An upper surface of the marking film is locally formed with a first recess. ## Claims ### Claim 1 A module comprising: a substrate having a first main surface; a first component mounted on the first main surface; a first sealing resin disposed to cover the first main surface and the first component; a marking film covering at least an upper surface of the first sealing resin and having an upper surface opposite the first sealing resin that comprises a first recess locally disposed therein, and a lower surface adjacent to the upper surface of the first sealing resin that is a completely uniform surface; and a shield film covering the marking film. ### Claim 2 (depends on 1) The module according to claim 1, wherein the shield film comprises an upper surface having a second recess that corresponds to the first recess. ### Claim 3 (depends on 2) The module according to claim 2, wherein the second recess of the shield film overlaps with the first recess of the first sealing resin relative to a direction normal to the first main surface of the substrate. ### Claim 4 (depends on 1) The module according to claim 1, wherein the shield film includes a conductive layer and a protective layer that covers the conductive layer. ### Claim 5 (depends on 4) The module according to claim 4, wherein the protective layer is a rustproof layer. ### Claim 6 (depends on 4) The module according to claim 4, wherein the marking film includes a first layer and a second layer that covers the first layer. ### Claim 7 (depends on 6) The module according to claim 6, wherein the first recess is disposed at a position in the second layer that is removed so as to expose the first layer. ### Claim 8 (depends on 6) The module according to claim 6, wherein the first layer comprises a same material as the conductive layer, and the second layer comprises a same material as the protective layer. ### Claim 9 (depends on 1) The module according to claim 1, wherein the marking film covers only the upper surface of the first sealing resin. ### Claim 10 (depends on 1) The module according to claim 1, wherein the shield film covers the upper surface of the marking film, a side surface of the marking film, a side surface of the first sealing resin, and a side surface of the substrate. ### Claim 11 (depends on 1) The module according to claim 1, wherein the shield film comprises a surface closer to the marking film that is configured by an adhesion layer. ### Claim 12 (depends on 1) The module according to claim 1, wherein the marking film comprises a surface closer to the first sealing resin that is configured with an adhesion layer. ### Claim 13 (depends on 1) The module according to claim 1, wherein the substrate has a second main surface opposite to the first main surface, wherein a second component is mounted on the second main surface, wherein a second sealing resin covers the second main surface and the second component, and wherein the shield film covers a side surface of the second sealing resin. ### Claim 14 A module comprising: a substrate having a main surface; an electronic component mounted on the main surface of the substrate; a sealing resin that covers the main surface of the substrate and the electronic component; a marking film that covers the sealing resin opposite the substrate and that has a surface opposite the sealing resin that includes a first recess extending therein towards the sealing resin, and a lower surface adjacent to the surface of the sealing resin that is a completely uniform surface; and a shield film that covers the marking film and includes a surface opposite the marking film with a second recess that aligns with the first recess of the marking film. ### Claim 15 (depends on 14) The module according to claim 14, wherein the second recess of the shield film overlaps with the first recess of the sealing resin relative to a direction normal to the main surface of the substrate. ### Claim 16 A method of manufacturing a module, the method comprising: preparing a collective substrate; mounting a plurality of components on a first main surface of the collective substrate; disposing a first sealing resin to cover the first main surface and the plurality of components; forming a marking film to cover an upper surface of the first sealing resin; forming a plurality of first recesses by irradiating an upper surface of the marking film with a laser beam; cutting the collective substrate into a plurality of module blanks; and forming a shield film on each of the plurality of module blanks to cover an upper surface and a side surface thereof. ### Claim 17 (depends on 16) The method of manufacturing a module according to claim 16, wherein the marking film includes a first layer and a second layer that covers the first layer, and wherein the forming of the plurality of first recesses comprises exposing the first layer by locally removing the second layer. ### Claim 18 (depends on 16) The method of manufacturing a module according to claim 16, wherein the forming of the plurality of first recesses is performed on the collective substrate. ### Claim 19 (depends on 17) The method of manufacturing a module according to claim 17, wherein the forming of the shield film includes forming a plurality of second recesses in an upper surface of the shield film that corresponds to the plurality of first recesses. ### Claim 20 (depends on 19) The method of manufacturing a module according to claim 19, wherein the plurality of second recesses of the shield film overlaps with the plurality of first recesses of the first sealing resin relative to a direction normal to the first main surface of the substrate.