# US 12,224,247 B2 · Fan-out package having a main die and a dummy die

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- Number: US 12,224,247 B2
- Document ID: US12224247B2
- Status: Granted
- Kind: B2
- Application number: 18/616,427
- Filed: 2024-03-26
- Published: 2024-08-08
- Granted: 2025-02-11
- Earliest claimed: 2016-11-29
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Co., Ltd.
- Inventors: Yan-Fu Lin; Chen-Hua Yu; Meng-Tsan Lee; Wei-Cheng Wu; Hsien-Wei Chen
- Web page: https://patentgrep.com/patent/US12224247B2

## CPC

- H10W 70/614: {the multiple chips being integrally enclosed}
- H10W 20/427: {Power or ground buses}
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 90/00: Package configurations
- H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
- H10W 70/095: {of vias therein}
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/635: {Through-vias}
- H10W 70/6523: {for connecting to pads at different heights at the same side of the package substrate, interposer or RDL}
- H10W 70/655: Fan-out layouts
- H10W 72/0198: {batch processes}
- H10W 72/072: {of bump connectors}
- H10W 72/07254: {changes in dispositions}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07307: {the auxiliary member being a temporary substrate, e.g. a removable substrate}
- H10W 72/075: {of bond wires}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/244: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
- H10W 72/247: {Dispositions of multiple bumps}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/354: {comprising polymers}
- H10W 72/5473: {multiple bond wires connected to a common bond pad}
- H10W 72/552: {comprising metals or metalloids, e.g. silver}
- H10W 72/853: {On the same surface}
- H10W 72/874: {On different surfaces}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/9413: {on encapsulations}
- H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/288: {characterised by arrangements for thermal management of the stacked chips}
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/732: {between stacked chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A fan-out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die.

## Claims

### Claim 1

A method, comprising:
placing a functional die and a dummy die on a first substrate, wherein the functional die comprises a first insulating layer overlying the first substrate, wherein the dummy die comprises a second insulating layer overlying a second substrate, wherein the dummy die is free of active devices;
disposing a molding compound along sidewalls of the functional die and the dummy die; and
forming a redistribution structure over the functional die, the dummy die, and the molding compound, wherein forming the redistribution structure comprises forming a first conductive line electrically coupled to the functional die, wherein forming the redistribution structure comprises forming a first external contact on a side opposite the functional die.

### Claim 2 (depends on 1)

The method of claim 1, wherein the dummy die further comprises metal pillars in the second insulating layer.

### Claim 3 (depends on 2)

The method of claim 2, wherein forming the redistribution structure comprises forming the redistribution structure directly on the metal pillars.

### Claim 4 (depends on 3)

The method of claim 3, wherein the redistribution structure comprises a second conductive line electrically coupled to a first metal pillar of the metal pillars.

### Claim 5 (depends on 4)

The method of claim 4, wherein the second conductive line is electrically coupled to ground.

### Claim 6 (depends on 3)

The method of claim 3, wherein forming the redistribution structure comprises forming a third insulating layer directly on the metal pillar, wherein the metal pillars are completely covered by the third insulating layer after forming the first external contact.

### Claim 7 (depends on 1)

The method of claim 1, further comprising:
prior to forming the molding compound, forming one or more through vias, wherein forming the molding compound comprises forming the molding compound along sidewalls of the one or more through vias.

### Claim 8

A method, comprising:
placing a functional die on a first surface, the functional die comprising a first substrate and a first insulating layer on the first substrate;
placing a dummy die on the first surface, the dummy die comprising a second substrate and a second insulating layer on the second substrate, wherein the first insulating layer and the second insulating layer face a same direction relative to the first surface;
placing a molding material on the first surface, the molding material extending between the dummy die and the functional die, wherein the molding material completely covers sidewalls of the second insulating layer; and
forming a redistribution structure over the functional die and the molding material, wherein the redistribution structure comprises an external contact electrically coupled to the functional die.

### Claim 9 (depends on 8)

The method of claim 8, wherein the molding material extends between the dummy die and the redistribution structure.

### Claim 10 (depends on 8)

The method of claim 8, wherein the dummy die further comprises metal pillars in the second insulating layer.

### Claim 11 (depends on 10)

The method of claim 10, wherein forming the redistribution structure comprises:
forming a third insulating layer over the functional die and the dummy die; and
forming a conductive feature through the third insulating layer to electrically contact the functional die, wherein the third insulating layer completely covers the metal pillars after forming the conductive feature.

### Claim 12 (depends on 10)

The method of claim 10, wherein forming the redistribution structure comprises:
forming a third insulating layer over the functional die and the dummy die; and
forming a first conductive feature through the third insulating layer to electrically contact the functional die and forming a second conductive feature through the third insulating layer to electrically contact a first metal pillar of the metal pillars.

### Claim 13 (depends on 12)

The method of claim 12, wherein the second conductive feature is electrically coupled to a ground plane.

### Claim 14 (depends on 8)

The method of claim 8, wherein a thickness of the dummy die is less than a thickness of the functional die.

### Claim 15

A method, comprising:
placing a functional die on a first surface of a first structure, the functional die comprising a first substrate and a first insulating layer on the first substrate, wherein the first substrate is interposed between the first structure and the first insulating layer;
placing a dummy die on the first surface of the first structure laterally spaced apart from the functional die, the dummy die comprising a second substrate and a second insulating layer on the second substrate, wherein the second substrate is interposed between the first structure and the second insulating layer;
placing a molding material on the first surface, the molding material extending between the dummy die and the functional die, wherein the molding material completely covers sidewalls of the second insulating layer, wherein an electrical contact of the functional die is exposed after placing the molding material; and
forming a redistribution structure over the functional die and the molding material, wherein the redistribution structure comprises an external contact electrically coupled to the electrical contact of the functional die.

### Claim 16 (depends on 15)

The method of claim 15, wherein the molding material is between the dummy die and the redistribution structure.

### Claim 17 (depends on 15)

The method of claim 15, wherein the first substrate and the second substrate have a same material composition.

### Claim 18 (depends on 15)

The method of claim 15, wherein the dummy die further comprises conductive contacts in the second insulating layer.

### Claim 19 (depends on 18)

The method of claim 18, wherein the conductive contacts are electrically isolated from conductive elements of the redistribution structure.

### Claim 20 (depends on 18)

The method of claim 18, wherein the conductive contacts are electrically connected to conductive elements of the redistribution structure.