# US 12,224,235 B2 · Printed circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,224,235 B2 - Document ID: US12224235B2 - Status: Granted - Kind: B2 - Application number: 18/211,093 - Filed: 2023-06-16 - Published: 2023-10-19 - Granted: 2025-02-11 - Earliest claimed: 2020-12-08 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Chan Hoon Ko; Sang Hoon Kim; Yoong Oh; Hea Sung Kim - Web page: https://patentgrep.com/patent/US12224235B2 ## CPC - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H10W 70/65: Shapes or dispositions of interconnections - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 3/4007: {Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465)} - H05K 3/4682: {Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil} - H10W 70/687: {characterized by the outer layers being for protection, e.g. solder masks, or for protection against chemical or mechanical damage} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H05K 2201/0367: Metallic bump or raised conductor not used as solder bump - H05K 2201/09472: Recessed pad for surface mounting; Recessed electrode of component - H05K 2201/098: Special shape of the cross-section of conductors, e.g. very thick plated conductors - H05K 2201/099: Coating over pads, e.g. solder resist partly over pads - H10P 72/74: {using temporarily an auxiliary support} - H10P 72/7424: {used as a support during the manufacture of self-supporting substrates} - H10W 70/685: comprising multiple insulating layers - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A printed circuit board includes a first insulating layer; a pad disposed on the insulating layer and having a protrusion; and a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad. The protrusion protrudes from one surface of the pad and is buried in at least one of the insulating layer and the protective layer. ## Claims ### Claim 1 A printed circuit board, comprising: a first insulating layer; a pad disposed in the insulating layer and having a protrusion; another pad disposed on the insulating layer; and a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad and of the another pad, wherein the protrusion protrudes from one surface of the pad and is buried in the insulating layer, and wherein a top surface of the another pad is higher than a top surface of the pad and lower than a top surface of the protective layer. ### Claim 2 (depends on 1) The printed circuit board of claim 1, wherein the pad includes a first metal layer and a second metal layer disposed on the first metal layer and provided as the protrusion. ### Claim 3 (depends on 2) The printed circuit board of claim 2, wherein the first metal layer is disposed in the insulating layer, and wherein the second metal layer is disposed on a surface of the first metal layer opposing the protective layer. ### Claim 4 (depends on 3) The printed circuit board of claim 3, wherein one surface of the second metal layer is coplanar with one surface of the insulating layer. ### Claim 5 (depends on 2) The printed circuit board of claim 2, wherein one surface of the pad is coplanar with one surface of the second metal layer. ### Claim 6 (depends on 1) The printed circuit board of claim 1, wherein the protrusion includes a plurality of protrusions spaced apart from each other. ### Claim 7 (depends on 1) The printed circuit board of claim 1, further comprising: a conductive post disposed on the insulating layer and connected to the pad. ### Claim 8 A printed circuit board, comprising: an insulating layer; a pad buried in the insulating layer to be exposed to one surface of the insulating layer and including a first metal layer and a second metal layer disposed on the first metal layer; another pad disposed on the insulating layer; a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad and of the another pad; and a conductive post disposed in the opening of the protective layer, protruding from the protective layer, and connected to the pad, wherein a top surface of the another pad is higher than a top surface of the pad and lower than a top surface of the protective layer. ### Claim 9 (depends on 8) The printed circuit board of claim 8, wherein the pad includes a region having a stepped portion. ### Claim 10 (depends on 8) The printed circuit board of claim 8, wherein a width of the first metal layer is different from a width of the second metal layer. ### Claim 11 (depends on 8) The printed circuit board of claim 8, wherein the second metal layer has a through-portion exposing the first metal layer. ### Claim 12 (depends on 11) The printed circuit board of claim 11, wherein the protective layer is disposed in the through-portion. ### Claim 13 A printed circuit board, comprising: an insulating body; a pad disposed in the insulating body and including a first metal layer and a second metal layer; another pad disposed on the insulating layer; a protective layer disposed on the insulating body and having an opening exposing at least a portion of the pad and of the another pad; and a conductive post extending from the first metal layer to protrude from the insulating body, wherein the second metal layer is spaced apart from the conductive post, and wherein a top surface of the another pad is higher than a top surface of the pad and lower than a top surface of the protective layer. ### Claim 14 (depends on 13) The printed circuit board of claim 13, wherein the second metal layer includes one or more protrusions extending from the first metal layer and embedded in the insulating body. ### Claim 15 (depends on 14) The printed circuit board of claim 14, wherein the one or more protrusions and the conductive post are disposed on a same one side of the first metal layer. ### Claim 16 (depends on 13) The printed circuit board of claim 13, wherein a width of the first metal layer is different from a width of the second metal layer. ### Claim 17 (depends on 16) The printed circuit board of claim 16, wherein the second metal layer has a through-portion exposing a portion of the first metal layer. ### Claim 18 (depends on 16) The printed circuit board of claim 16, wherein side surfaces of the first metal layer and the second metal layer provide a step.