# US 12,224,226 B2 · Electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,224,226 B2 - Document ID: US12224226B2 - Status: Granted - Kind: B2 - Application number: 17/898,410 - Filed: 2022-08-29 - Published: 2023-08-03 - Granted: 2025-02-11 - Earliest claimed: 2022-01-28 - Assignees: Innolux Corporation - Applicants: InnoLux Corporation - Inventors: Chin-Lung Ting; Chung-Kuang Wei; Cheng-Chi Wang; Yeong-E Chen; Yi-Hung Lin - Web page: https://patentgrep.com/patent/US12224226B2 ## CPC - H10W 40/10: Arrangements for heating - H10W 40/30: wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid - H05K 1/0209: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings} - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 40/47: by flowing liquids, e.g. forced water cooling - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/685: comprising multiple insulating layers - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 72/30: Die-attach connectors - H10W 90/00: Package configurations - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H05K 2201/064: Fluid cooling, e.g. by integral pipes - H10W 72/90: Bond pads, in general - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element. ## Claims ### Claim 1 An electronic device, comprising: a circuit layer; an electronic element disposed on the circuit layer and electrically connected to the circuit layer; and a thermal conducting element disposed between the circuit layer and the electronic element, wherein the thermal conducting element is used for performing heat exchange with the electronic element, wherein the electronic element comprises a plurality of connectors, and a size of one of the plurality of connectors is different from a size of another one of the plurality of connectors. ### Claim 2 (depends on 1) The electronic device according to claim 1, wherein the thermal conducting element has a plurality of openings, and the plurality of connectors correspond to the plurality of openings. ### Claim 3 (depends on 2) The electronic device according to claim 2, wherein each of the plurality of connectors is at least partially overlapped with each of the plurality of openings in a top-view direction of the electronic device. ### Claim 4 (depends on 2) The electronic device according to claim 2, wherein an edge of the thermal conducting element is more protruding relative to an edge of the electronic element. ### Claim 5 (depends on 2) The electronic device according to claim 2, further comprising a plurality of connection pads disposed on the circuit layer and electrically connected to the circuit layer, wherein the plurality of connection pads respectively correspond to one of the plurality of openings, and a gap exists between each of the plurality of connection pads and the thermal conducting element. ### Claim 6 (depends on 1) The electronic device according to claim 1, wherein a gap exists between the thermal conducting element and the electronic element in a top-view direction of the electronic device. ### Claim 7 (depends on 1) The electronic device according to claim 1, further comprising a connection pad disposed on the circuit layer and electrically connected to the circuit layer, wherein the plurality of connectors are electrically connected to the connection pad. ### Claim 8 (depends on 7) The electronic device according to claim 7, wherein the thermal conducting element directly contacts with the connection pad. ### Claim 9 (depends on 1) The electronic device according to claim 1, further comprising a plurality of connection pads disposed on the circuit layer and electrically connected to the circuit layer, wherein each of the plurality of connectors is electrically connected to one of the plurality of connection pads. ### Claim 10 (depends on 1) The electronic device according to claim 1, wherein the thermal conducting element comprises a plurality of thermal conducting portions spaced apart from each other. ### Claim 11 (depends on 1) The electronic device according to claim 1, further comprising a plurality of conductive elements disposed on one side of the circuit layer opposite to the electronic element. ### Claim 12 (depends on 11) The electronic device according to claim 11, wherein a size of one of the plurality of conductive elements is different from a size of another one of the plurality of conductive elements. ### Claim 13 An electronic device, comprising: a circuit layer; a connection pad disposed on the circuit layer; and an electronic element disposed on the circuit layer and electrically connected to the circuit layer, wherein the electronic element comprises a plurality of connectors, and the plurality of connectors are electrically connected to the connection pad, wherein a size of one of the plurality of connectors is different from a size of another one of the plurality of connectors. ### Claim 14 An electronic device, comprising: a circuit layer; an electronic element disposed on the circuit layer and electrically connected to the circuit layer; and a first flow-path structure comprising a first flow path, wherein the electronic element is disposed in the first flow-path structure; and a fluid material disposed in the first flow path, wherein the fluid material is used for performing heat exchange with the electronic element, wherein the first flow-path structure comprises an input hole and an output hole, and the fluid material enters the first flow path through the input hole and exits the first flow path through the output hole. ### Claim 15 (depends on 13) The electronic device according to claim 13, wherein the plurality of connectors are overlapped with the connection pad. ### Claim 16 (depends on 14) The electronic device according to claim 14, wherein the first flow-path structure comprises a substrate, and the substrate comprises the input hole and the output hole. ### Claim 17 (depends on 14) The electronic device according to claim 14, further comprising: a circuit board electrically connected to the circuit layer; and a second flow-path structure disposed on the circuit board and comprising a second flow path. ### Claim 18 (depends on 14) The electronic device according to claim 14, further comprising a protective layer, wherein the electronic element comprises a plurality of connectors, and the protective layer covers the plurality of connectors.