# US 12,224,184 B2 · Methods for registration of circuit dies and electrical interconnects

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- Number: US 12,224,184 B2
- Document ID: US12224184B2
- Status: Granted
- Kind: B2
- Application number: 18/652,529
- Filed: 2024-05-01
- Published: 2024-08-22
- Granted: 2025-02-11
- Earliest claimed: 2019-04-29
- Assignees: 3M Innovative Properties Company
- Applicants: 3M Innovative Properties Company
- Inventors: Ankit Mahajan; Saagar A. Shah; Mikhail L. Pekurovsky; Kayla C. Niccum; Kara A. Meyers; Matthew R. D. Smith; Gino L. Pitera; Graham M. Clarke; Jeremy K. Larsen; Teresa M. Goeddel
- Web page: https://patentgrep.com/patent/US12224184B2

## CPC

- H10W 74/01: Manufacture or treatment
- H05K 1/113: {Via provided in pad; Pad over filled via}
- H05K 1/186: {manufactured by mounting on or connecting to patterned circuits before or during embedding}
- H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes}
- H10W 72/0198: {batch processes}
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 74/129: {forming a chip-scale package [CSP]}
- H10W 74/47: comprising organic materials, e.g. plastics or resins
- H05K 3/0014: {Shaping of the substrate, e.g. by moulding}
- H05K 2203/308: Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
- H10W 44/241: {for passive devices or passive elements}
- H10W 44/248: {for antennas}
- H10W 72/01923: {in liquid form, e.g. by dispensing droplets or by screen printing}
- H10W 72/01961: {Chemical or physical modification, e.g. by sintering or anodisation (patterning H10W72/01951)}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/353: {not comprising solid metals or solid metalloids, e.g. ceramics}
- H10W 72/9413: {on encapsulations}
- H10W 72/9415: {relative to the surface, e.g. recessed, protruding}
- H10W 74/10: characterised by their shape or disposition
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.

## Claims

### Claim 1

An article comprising:
microstructures extending upward from a major surface of a pliable mold, wherein the microstructures comprise a pliable mating surface;
a solid circuit die comprising a plurality of electrically conductive contact pads, wherein at least a portion of the contact pads directly contact the pliable mating surfaces of the microstructures; and
a polymeric carrier releasably attached to the major surface of the pliable mold, wherein the polymeric carrier at least partially encapsulates the solid circuit die, and wherein the polymeric carrier comprises channels corresponding to the microstructures wherein the channels are interconnected to at least a portion of the contact pads on the solid circuit die.

### Claim 2 (depends on 1)

The article of claim 1, wherein the microstructures comprise linear ridges.

### Claim 3 (depends on 1)

The article of claim 1, wherein the contact pads are at least partially embedded in the pliable mating surface.

### Claim 4 (depends on 1)

The article of claim 1, wherein the pliable mold comprises polydimethylsiloxane.

### Claim 5 (depends on 1)

The article of claim 1, wherein the polymeric carrier is selected from the group consisting of thermoplastic polyester, polyetherimide, epoxy resins, and combinations thereof.