# US 12,224,180 B2 · Semiconductor device and a method of manufacturing a semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,224,180 B2 - Document ID: US12224180B2 - Status: Granted - Kind: B2 - Application number: 17/518,862 - Filed: 2021-11-04 - Published: 2022-05-05 - Granted: 2025-02-11 - Earliest claimed: 2020-11-04 - Assignees: Nexperia B.V. - Applicants: Nexperia B.V. - Inventors: Ricardo Yandoc; Anthony Matthew; Manoj Balakrishnan; Adam Brown - Web page: https://patentgrep.com/patent/US12224180B2 ## CPC - H10W 70/04: of leadframes - H10W 72/60: Strap connectors, e.g. thick copper clips for grounding of power devices - B23K 20/10: making use of vibrations, e.g. ultrasonic welding - H10W 40/778: {in encapsulations} - H10W 70/466: {Tape carriers or flat leads} - H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00} - B23K 2101/40: Semiconductor devices - H10W 72/013: {of die-attach connectors} - H10W 72/01333: {in liquid form, e.g. spin coating, spray coating or immersion coating} - H10W 72/016: {of strap connectors} - H10W 72/07236: {Soldering or alloying} - H10W 72/073: {of die-attach connectors} - H10W 72/07336: {Soldering or alloying} - H10W 72/07636: {Soldering or alloying} - H10W 72/07652: {changes in structures or sizes} - H10W 72/352: {comprising metals or metalloids, e.g. solders} - H10W 72/627: {Multiple strap connectors having different structures or shapes} - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM ## Abstract A semiconductor device including a clip, and the clip includes a clip slot, and a slug and the slug includes a groove. The clip and the slug are attached by the ultrasonic welding. The groove and the clip slot are at least partially overlapping to form a gas pathway. ## Claims ### Claim 1 A semiconductor device comprising: a clip, wherein the clip comprises a clip slot; and a slug, wherein the slug comprises a groove on an underside of the slug that is encased by the top of the slug, wherein the groove and the clip slot are at least partially overlapping to form a gas pathway tunnel on the underside of the slug to an outside side of the slug. ### Claim 2 (depends on 1) The semiconductor device as claimed in claim 1, wherein the clip and the slug are connected by an ultrasonic welding. ### Claim 3 (depends on 1) The semiconductor device as claimed in claim 1, wherein the semiconductor device further comprises: a leadframe; a first solder positioned on a top of the leadframe; a silicon die positioned on a top of the first solder; and a second solder positioned on a top of the silicon die, wherein the clip and the slug are positioned on a top of the second solder. ### Claim 4 (depends on 1) The semiconductor device as claimed in claim 1, wherein the semiconductor device further comprises at least two grooves and at least two clip slots. ### Claim 5 (depends on 2) The semiconductor device as claimed in claim 2, wherein the semiconductor device further comprises: a leadframe; a first solder positioned on a top of the leadframe; a silicon die positioned on a top of the first solder; and a second solder positioned on a top of the silicon die, wherein the clip and the slug are positioned on a top of the second solder. ### Claim 6 (depends on 2) The semiconductor device as claimed in claim 2, wherein the semiconductor device further comprises at least two grooves and at least two clip slots. ### Claim 7 (depends on 3) The semiconductor device as claimed in claim 3, wherein the semiconductor device further comprises at least two grooves and at least two clip slots. ### Claim 8 (depends on 4) The semiconductor device as claimed in claim 4, wherein the at least two grooves and the at least two clip slots are overlapping with each other, and wherein the at least two grooves and the at least two clip slots both form a cross-shape. ### Claim 9 (depends on 4) The semiconductor device as claimed in claim 4, wherein the at least two grooves and the at least two clip slots are overlapping with each other, and wherein the at least two grooves and the at least two clip slots both form a plus-shape. ### Claim 10 (depends on 4) The semiconductor device as claimed in claim 4, wherein the at least two grooves and the at least two clip slots are partially overlapping with each other, wherein the at least two grooves and the at least two clip slots form a rectangle-shape, and wherein the at least two grooves correspond to a first two sides of the rectangle-shape and the at least two clip slots correspond to a second two sides of the rectangle-shape, and the overlapping between the at least two grooves and the at least two clip slots is at vertices of the rectangle-shape. ### Claim 11 (depends on 1) A method of producing a semiconductor device as claimed in claim 1. ### Claim 12 A method of producing a semiconductor device, the method comprising steps of: solder stencil printing to a die pad; attaching a die to the die pad; dispensing a solder on a top of the die; attaching a slug to a clip using ultrasonic welding, wherein the slug comprises a groove on an underside oft the slug that is encased by a top of the slug, and wherein the clip comprises a clip slot, wherein the groove and the clip slot are at least partially overlapping when attaching the slug to the clip to form a gas pathway tunnel on the underside of the slug a to an outside of the slug, wherein the groove is positioned on a side of the slug to which the slug is attached to the clip; and molding, PMC deflash and plating. ### Claim 13 (depends on 4) The semiconductor device as claimed in claim 4, wherein the at least two grooves and the at least two clip slots are overlapping with each other and are arranged in parallel lines.