# US 12,224,159 B1 · Gas mixing method to enhance plasma > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,224,159 B1 - Document ID: US12224159B1 - Status: Granted - Kind: B1 - Application number: 18/231,907 - Filed: 2023-08-09 - Published: 2025-02-13 - Granted: 2025-02-11 - Earliest claimed: 2023-08-09 - Assignees: Sky Tech Inc. - Applicants: Sky Tech Inc. - Inventors: Ta-Hao Kuo; Chi-Hung Cheng; Yao-Syuan Cheng; Kuo-Ju Liu; Ching-Liang Yi - Web page: https://patentgrep.com/patent/US12224159B1 ## CPC - H01J 37/32449: {Gas control, e.g. control of the gas flow} - C23C 14/0063: {characterised by means for introducing or removing gases} - C23C 14/34: Sputtering - C23C 14/345: {using substrate bias} - C23C 14/50: Substrate holders - H01J 37/3244: {Gas supply means} - H01J 37/32715: {Workpiece holder} - H01J 37/3441: {Dark space shields} - H01J 2237/2007: Holding mechanisms - H01J 2237/20235: Z movement or adjustment - H01J 2237/332: Coating - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) ## Abstract A gas mixing method to enhance plasma includes: providing a reaction chamber; wherein the reaction chamber includes an accommodating space and the reaction chamber includes a top opening connected to the accommodating space; providing an adapter plate, and fixing the adapter plate to the reaction chamber to be arranged corresponding to the top opening; wherein the adapter plate further includes a window area communicating both sides of the adapter plate; providing a target disposed on top of the adapter plate to seal the top opening; premixing a plasma gas and an auxiliary gas into a gas mixture, and introducing the gas mixture into the accommodating space; and providing a biasing field to the accommodating space. ## Claims ### Claim 1 A gas mixing method to enhance plasma comprising: providing a reaction chamber; wherein the reaction chamber includes an accommodating space and the reaction chamber includes a top opening connected to the accommodating space; providing an adapter plate, and fixing the adapter plate to the reaction chamber to be arranged corresponding to the top opening; wherein the adapter plate further includes a window area communicating both sides of the adapter plate and an air intake channel connecting an outer side surface of the adapter plate and the window area; providing a target disposed on top of the adapter plate to seal the top opening, premixing a plasma gas and an auxiliary gas into a gas mixture, and introducing the gas mixture into the accommodating space; providing a biasing field to the accommodating space wherein disposing a holder plate in the accommodating space, providing a biasing power source electrically connected to the holder plate, and providing a biasing signal to the holder plate with the biasing power source, so as to generate the biasing field; providing a shielding ring disposed within the accommodating space; wherein the shielding ring is a circular structure and comprises a first side wall, a second side wall and a bottom; the first side wall is a circular wall, facing the adapter plate, and connected to an inner side surface of the adapter plate; the second side wall is the circular wall in parallel to the first side wall, and extends toward the target, and an inner side of the second side wall defines a shielding ring opening; the bottom connects the first side wall and the second side wall; and providing a cover ring disposed above the shielding ring, wherein the cover ring comprises a horizontal extension portion and a vertical extension portion; the horizontal extension portion is directly or indirectly connected to the adapter plate and extends toward the bottom without contacting the bottom; the inner side of the adapter plate, the shielding ring and the first side wall define an auxiliary intake channel connecting to the air intake channel. ### Claim 2 (depends on 1) The gas mixing method to enhance plasma according to claim 1, wherein the step of mixing the plasma gas and the auxiliary gas into the gas mixture comprises providing a mixing element for receiving the plasma gas and the auxiliary gas, and connecting the mixing element to the accommodating space. ### Claim 3 (depends on 2) The gas mixing method to enhance plasma according to claim 2, wherein the mixing element is connected to the air intake channel of the adapter plate for communicating the window area and the accommodating space. ### Claim 4 (depends on 2) The gas mixing method to enhance plasma according to claim 2, wherein the mixing element is connected to an air intake channel of the reaction chamber for communicating the accommodating space. ### Claim 5 (depends on 3) The electrical connecting assembly according to claim 3, wherein one extending ends of the plurality of first contacting pieces comprises a bent contacting part; one extending ends of the plurality of second contacting pieces comprises a bent contacting part. ### Claim 6 (depends on 1) The gas mixing method to enhance plasma according to claim 1, further comprising disposing a wafer in the accommodating space with the wafer facing the target. ### Claim 7 (depends on 6) The gas mixing method to enhance plasma according to claim 6, further comprising a holding surface of the holder plate facing the target, and disposing the wafer on the holding surface. ### Claim 8 (depends on 7) The gas mixing method to enhance plasma according to claim 7, further comprising providing a linear actuator coupled to the holder plate to drive the holder plate to move relative to the target, so as to change the distance between the holder plate and the target. ### Claim 9 (depends on 1) The gas mixing method to enhance plasma according to claim 1, further comprising continuously evacuating air from the accommodating space. ### Claim 10 An integrated airflow merging and diverting device comprising: a reaction chamber, including an accommodating space and a top opening connected to the accommodating space; an adapter plate, fixed to a top of the reaction chamber and disposed corresponding to the top opening; wherein the adapter plate further includes a window area communicating a top surface and a bottom surface of the adapter plate and an air intake channel connecting an outer side surface of the adapter plate and the window area; a mixing element, configured to receive a plasma gas and a auxiliary gas, to mix the plasma gas and the auxiliary gas into a gas mixture, and to introduce the gas mixture into the accommodating space; a target, disposed on the adapter plate to seal the top opening; and a biasing power source, configured to provide a biasing signal to the accommodating space, so as to ionize the plasma gas to achieve plasma ignition; a holder plate, disposed within the accommodating space, and the biasing power source is electrically connected to the holder plate to provide the biasing signal to the holder plate; a shielding ring being a circular structure, disposed within the accommodating space and comprising: a first side wall, being a circular wall, facing the adapter plate, and connected to an inner side surface of the adapter plate; a second side wall, being a circular wall in parallel to the first side wall, extending toward the target; wherein an inner side of the second side wall defines a shielding ring opening; and a bottom, connecting the first side wall and the second side wall; and a cover ring disposed above the shielding ring and comprising: a horizontal extension portion, directly or indirectly connected to the adapter plate; a vertical extension portion, located within an inner side of the first side wall, and extending toward the bottom without contacting the bottom; wherein the inner side of the adapter plate, the shielding ring and the first side wall define an auxiliary intake channel connecting to the air intake channel. ### Claim 11 (depends on 10) The integrated airflow merging and diverting device according to claim 10, wherein the mixing element is connected to the air intake channel. ### Claim 12 (depends on 10) The integrated airflow merging and diverting device according to claim 10, wherein a holding surface of the holder plate faces the target. ### Claim 13 (depends on 12) The integrated airflow merging and diverting device according to claim 12, further comprising a linear actuator, coupled to the holder plate; wherein the linear actuator is configured to drive the holder plate to move relative to the target. ### Claim 14 (depends on 12) The integrated airflow merging and diverting device according to claim 12, further comprising a clamping ring, disposed on an edge of the holding surface. ### Claim 15 (depends on 10) The integrated airflow merging and diverting device according to claim 10, wherein a vacuum pump, connected to the reaction chamber and configured to the accommodating space to evacuate gas from the accommodating space. ### Claim 16 (depends on 10) The integrated airflow merging and diverting device according to claim 10, wherein the reaction chamber includes an air intake channel connected to the accommodating space and the mixing element for introducing the mixed air into the accommodating space.