# US 12,224,127 B2 · Multilayer electronic component

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- Number: US 12,224,127 B2
- Document ID: US12224127B2
- Status: Granted
- Kind: B2
- Application number: 17/973,132
- Filed: 2022-10-25
- Published: 2023-07-06
- Granted: 2025-02-11
- Earliest claimed: 2021-12-31
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Chung Yeol Lee; Yoo Jeong Lee; Hyung Jong Choi; Kwang Yeun Won; So Jung An; Woo Kyung Sung; Kang Ha Lee; Myung Jun Park; Jong Ho Lee; Jun Hyeong Kim
- Web page: https://patentgrep.com/patent/US12224127B2

## CPC

- H01G 4/2325: {characterised by the material of the terminals}
- H01G 2/065: {for surface mounting, e.g. chip capacitors}
- H01G 4/012: Form of non-self-supporting electrodes
- H01G 4/224: Housing; Encapsulation
- H01G 4/30: Stacked capacitors (H01G4/33 takes precedence)
- H01G 4/1227: {based on alkaline earth titanates}
- H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)

## Abstract

An electronic component includes a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a first connection portion on the third surface and a first band portion on the first surface; a second external electrode including a second connection portion on the fourth surface and a second band portion on the first surface; an insulating layer on the second surface and the first and second connection portions; and a plating layer on the first and second band portions. The plating layer extends onto the first and second connection portions and is in contact with the insulating layer. A thickness of an end of the insulating layer decreases toward the plating layer. An end of the plating layer includes a first region between the insulating layer and the first or second connection portion and a second region covering the insulating layer.

## Claims

### Claim 1

A multilayer electronic component, comprising:
a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other a third direction;
a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a portion of the first surface;
a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a portion of the first surface;
an insulating layer disposed on the second surface and extending to a portion on the first and second connection portions; and
a plating layer disposed on the first band portion
wherein the plating layer is in contact with the insulating layer on the first external electrode, and
wherein an end of the plating layer includes a first area disposed between the insulating layer and the first and second external electrode, and a second area disposed to cover at least a portion of the insulating layer,
wherein an end of the insulating layer extends from a portion of an inner surface of the insulating layer which contacts the first external electrode to a region between the first area and the second area, and is farther from the body than the portion of the inner surface of the insulating layer which contacts the first external electrode.

### Claim 2 (depends on 1)

The multilayer electronic component of claim 1, wherein a thickness of the insulating layer decreases toward an end in a region in which the plating layer is in contact with the insulating layer.

### Claim 3 (depends on 1)

The multilayer electronic component of claim 1, wherein the plating layer is in contact with the insulating layer on the first connection portion.

### Claim 4 (depends on 3)

The multilayer electronic component of claim 3, wherein the first area of the end of the plating layer refers to an area disposed between the insulating layer and the first connection portion, and the second area of the end of the plating layer refers to an area arranged to cover at least a portion of the insulating layer, and wherein a1>a2 is satisfied, in which a1 is a maximum length of the first area in the first direction, and a2 is a maximum length of the second area in the first direction.

### Claim 5 (depends on 1)

The multilayer electronic component of claim 1, wherein the plating layer is in contact with the insulating layer on the first band portion.

### Claim 6 (depends on 5)

The multilayer electronic component of claim 5, wherein the first area of the end of the plating layer refers to an area disposed between the insulating layer and the first band portion, and the second area of the end of the plating layer refers to an area arranged to cover at least a portion of the insulating layer, and wherein a3>a4 is satisfied, in which a3 is a maximum length of the first area in the second direction, and a4 is a maximum length of the second area in the second direction.

### Claim 7 (depends on 1)

The multilayer electronic component of claim 1, wherein H1>H2 is satisfied, in which H1 is an average distance of an internal electrode most adjacent to the first surface in the first direction among the first and second internal electrodes, and H2 is an average distance in the first direction from an extension line of the first surface to an end of the plating layer disposed on the first or second connection portion.

### Claim 8 (depends on 7)

The multilayer electronic component of claim 7, wherein H2<T/2 is satisfied, in which T is an average size of the body in the first direction.

### Claim 9 (depends on 1)

The multilayer electronic component of claim 1, wherein the first and second connection portions are spaced apart from the second surface.

### Claim 10 (depends on 1)

The multilayer electronic component of claim 1, wherein 0.2≤B1/L≤0.4 and 0.2≤B2/L≤0.4 are satisfied, in which L is an average size of the body in the second direction, B1 is an average distance in the second direction from an extension line of the third surface to an end of the first band portion, and B2 is an average distance in the second direction from an extension line of the fourth surface to an end of the second band portion.

### Claim 11 (depends on 1)

The multilayer electronic component of claim 1, wherein a maximum size of the multilayer electronic component in the second direction is 1.1 mm or less, and a maximum size of the multilayer electronic component in the third direction is 0.55 mm or less.

### Claim 12 (depends on 1)

The multilayer electronic component of claim 1, wherein an average thickness of the dielectric layer is 0.35 μm or less.

### Claim 13 (depends on 1)

The multilayer electronic component of claim 1, wherein an average thickness of the first and second internal electrodes is 0.35 μm or less.

### Claim 14 (depends on 1)

The multilayer electronic component of claim 1, wherein the body comprises:
a capacitance formation portion including the first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween and a cover portion disposed on both end surfaces of the capacitance formation portion in the first direction, wherein an average size of the cover portion in the first direction is 15 μm or less.

### Claim 15 (depends on 1)

The multilayer electronic component of claim 1, wherein the first external electrode further includes a third band portion extending from the first connection portion to a portion of the second surface, and the second external electrode further includes a fourth band portion extending from the second connection portion to a portion of the second surface.

### Claim 16 (depends on 1)

The multilayer electronic component of claim 1, the first external electrode further includes a first side band portion extending from the first connection portion to portions of the fifth and sixth surfaces and the second external electrode further includes a second side band portion extending from the second connection portion to portions of the fifth and sixth surfaces.

### Claim 17 (depends on 1)

The multilayer electronic component of claim 1, further comprising:
an additional insulating layer disposed on the first surface and disposed between the first band portion and the second band portion.

### Claim 18 (depends on 16)

The multilayer electronic component of claim 16, wherein the sizes of the first and second side band portions in the second direction may gradually increase toward the first surface.

### Claim 19 (depends on 16)

The multilayer electronic component of claim 16, wherein the insulating layer disposed to cover the portion of the first side band portion, the second side band portion, the fifth surface and the sixth surface.

### Claim 20 (depends on 1)

The multilayer electronic component of claim 1, wherein the body includes a 1-3corner connecting the first surface to the third surface, a 1-4 corner connecting the first surface to the fourth surface, a 2-3 corner connecting the second surface to the third surface, and a 2-4 corner connecting the second surface to the fourth surface,
wherein the 1-3 corner and the 2-3 corner have a form reducing in a direction of a center of the body taken in the first direction toward the third surface, and the 1-4 corner and the 2-4 corner have a form reducing in a direction of the center of the body taken in the first direction toward the fourth surface, and
wherein the first external electrode includes a corner portion disposed on the 1-3 corner and a corner portion extending from the first connection portion to the 2-3 corner, and the second external electrode includes a corner portion disposed on the 1-4 corner and a corner portion extending from the second connection portion to the 2-4 corner.

### Claim 21 (depends on 20)

The multilayer electronic component of claim 20, wherein B3≤G1 and B4<G2 are satisfied, in which B3 is an average distance in the second direction from an extension line of the third surface to an end of the first corner portion, B4 is an average distance in the second direction from an extension line of the fourth surface to an end of the second corner portion, G1 is an average size of a region in which the third surface and the second internal electrode are spaced apart from each other, taken in the second direction, and G2 is an average size of a region in which the fourth surface and the first internal electrode are spaced apart from each other, taken in the second direction.

### Claim 22 (depends on 1)

The multilayer electronic component of claim 1, wherein B1>G1 and B2>G2 are satisfied, in which B1 is an average distance in the second direction from the extension line of the third surface to an end of the first band portion, B2 is an average distance in the second direction from the extension line of the fourth surface to an end of the second band portion, G1 is an average size of a region in which the third surface and the second internal electrode are apaced apart from each other, taken in the second direction, and G2 is an average size of a region which the fourth surface and the first internal electrode are spaced apart from each other, taken in the second direction.

### Claim 23 (depends on 1)

The multilayer electronic component of claim 1, wherein an average thickness of the plating layer is less than an average thickness of the insulating layer.

### Claim 24 (depends on 1)

The multilayer electronic component of claim 1, wherein the first and second connection portions are spaced apart from the fifth and sixth surfaces.

### Claim 25 (depends on 1)

The multilayer electronic component of claim 1, wherein the insulating layer is disposed on a portion of the fifth and sixth surfaces.

### Claim 26 (depends on 1)

The multilayer electronic component of claim 1, wherein the insulating layer is disposed to cover an entirety of the fifth and sixth surfaces.

### Claim 27 (depends on 1)

The multilayer electronic component of claim 1, wherein the first external electrode includes a first connection electrode disposed on the third surface and a first band electrode disposed on the first surface and connected to the first connection electrode, and
wherein the second external electrode includes a second connection electrode disposed on the fourth surface and a second band electrode disposed on the first surface and connected to the second connection electrode.

### Claim 28 (depends on 27)

The multilayer electronic component of claim 27, wherein the first and second connection electrodes are spaced apart from the fifth and sixth surfaces.

### Claim 29 (depends on 27)

The multilayer electronic component of claim 27, wherein the first and second connection electrodes are spaced apart from the second surfaces.

### Claim 30 (depends on 27)

The multilayer electronic component of claim 27, wherein the first connection electrode and the second connection electrode include the same metal as a metal included in the first and second internal electrodes.

### Claim 31 (depends on 27)

The multilayer electronic component of claim 27, wherein the first connection electrode and the second connection electrode include fired electrodes including a conductive metal and glass.

### Claim 32 (depends on 27)

The multilayer electronic component of claim 27, wherein the first band electrode and the second band electrode are fired electrodes including a conductive metal and glass.

### Claim 33 (depends on 27)

The multilayer electronic component of claim 27, wherein the first connection electrode and the second connection electrode include plating layers.

### Claim 34 (depends on 27)

The multilayer electronic component of claim 27, wherein the first band electrode and the second band electrode include plating layers.