# US 12,224,126 B2 · Multilayer electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,224,126 B2 - Document ID: US12224126B2 - Status: Granted - Kind: B2 - Application number: 17/961,490 - Filed: 2022-10-06 - Published: 2023-05-25 - Granted: 2025-02-11 - Earliest claimed: 2021-11-24 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Hyung Jong Choi; Yoo Jeong Lee; Chung Yeol Lee; Kwang Yeun Won; So Jung An; Woo Kyung Sung; Myung Jun Park; Jong Ho Lee - Web page: https://patentgrep.com/patent/US12224126B2 ## CPC - H01G 4/2325: {characterised by the material of the terminals} - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G 4/1209: {characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence)} - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) ## Abstract A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction. ## Claims ### Claim 1 A multilayer electronic component comprising: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first external electrode disposed on the third surface of the body; and a second external electrode disposed on the fourth surface of the body, wherein one of the first and second external electrodes includes a first electrode layer disposed on one of the third and fourth surfaces and including a conductive material, a second electrode layer disposed on the first electrode layer and including Ni and glass, a third electrode layer disposed on the second electrode layer and including an Ni—Sn alloy, and a conductive resin layer disposed on the third electrode layer and including a conductive metal and a resin, wherein E1>E2 in which E1 is a standard reduction potential of the first electrode layer and E2 is a standard reduction potential of the second electrode layer. ### Claim 2 (depends on 1) The multilayer electronic component of claim 1, wherein the conductive material included in the first electrode layer includes one or more of Cu and a Cu—Ni alloy. ### Claim 3 (depends on 1) The multilayer electronic component of claim 1, wherein the conductive material included in the first electrode layer includes one or more of Ag and an Ag—Ni alloy. ### Claim 4 (depends on 1) The multilayer electronic component of claim 1, wherein the first electrode layer further includes glass. ### Claim 5 (depends on 1) The multilayer electronic component of claim 1, wherein the Ni—Sn alloy includes Ni3Sn, Ni3Sn2, Ni3Sn4, or a mixture thereof. ### Claim 6 (depends on 1) The multilayer electronic component of claim 1, wherein the conductive resin layer extends onto portions of the first and second surfaces of the body. ### Claim 7 (depends on 1) The multilayer electronic component of claim 1, wherein the conductive metal includes Sn, and the resin includes an epoxy resin. ### Claim 8 (depends on 7) The multilayer electronic component of claim 7, wherein the conductive metal further includes at least one of Ag, Cu, and Ni. ### Claim 9 A multilayer electronic component comprising: a body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first external electrode disposed on the third surface of the body; and a second external electrode disposed on the fourth surface of the body, wherein one of the first and second external electrodes includes: a plurality of first electrode layers disposed on one of the third and fourth surfaces and spaced apart from each other in the first direction, being in contact with the first internal electrodes or the second internal electrodes, and including a conductive material, a second electrode layer disposed on the plurality of first electrode layers and including Ni, a third electrode layer disposed on the second electrode layer and including an Ni—Sn alloy; and a conductive resin layer disposed on the third electrode layer and including a conductive metal and a resin, wherein E1>E2 in which E1 is a standard reduction potential of the plurality of first electrode layers and E2 is a standard reduction potential of the second electrode layer. ### Claim 10 (depends on 9) The multilayer electronic component of claim 9, wherein the conductive material included in the plurality of first electrode layers includes one or more of Cu and a Cu—Ni alloy. ### Claim 11 (depends on 9) The multilayer electronic component of claim 9, wherein the conductive material included in the plurality of first electrode layers includes one or more of Ag and an Ag—Ni alloy. ### Claim 12 (depends on 9) The multilayer electronic component of claim 9, wherein the plurality of first electrode layers further include glass. ### Claim 13 (depends on 9) The multilayer electronic component of claim 9, wherein the Ni—Sn alloy includes Ni3Sn, Ni3Sn2, Ni3Sn4, or a mixture thereof. ### Claim 14 (depends on 9) The multilayer electronic component of claim 9, wherein the conductive resin layers extend onto portions of the first and second surfaces of the body. ### Claim 15 (depends on 9) The multilayer electronic component of claim 9, wherein the conductive metal includes Sn, and the resin includes an epoxy resin. ### Claim 16 (depends on 15) The multilayer electronic component of claim 15, wherein the conductive metal further includes at least one of Ag, Cu, and Ni. ### Claim 17 A multilayer electronic component comprising: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first external electrode disposed on the third surface of the body; and a second external electrode disposed on the fourth surface of the body, wherein one of the first and second external electrodes includes a first electrode layer disposed on one of the third and fourth surfaces and including a first conductive material and glass, a second electrode layer disposed on the first electrode layer and including a second conductive material and glass, and a conductive resin layer disposed on the second electrode layer and including a third conductive metal and a resin, wherein E1>E2 in which E1 is a standard reduction potential of the first electrode layer and E2 is a standard reduction potential of the second electrode layer, and the first electrode layer includes a plurality of patterns spaced apart from each other. ### Claim 18 (depends on 17) The multilayer electronic component of claim 17, wherein the first conductive material includes one or more of Cu, a Cu—Ni alloy, Ag, and an Ag—Ni alloy. ### Claim 19 (depends on 17) The multilayer electronic component of claim 17, wherein the second conductive material includes Ni, and the second electrode layer includes a sintered electrode. ### Claim 20 (depends on 19) The multilayer electronic component of claim 19, wherein the third conductive metal includes Sn. ### Claim 21 (depends on 20) The multilayer electronic component of claim 20, wherein the third conductive metal further includes at least one of Ag, Cu, and Ni.