# US 12,224,122 B2 · Electronic component, circuit board, and method of mounting electronic component on circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,224,122 B2 - Document ID: US12224122B2 - Status: Granted - Kind: B2 - Application number: 18/379,687 - Filed: 2023-10-13 - Published: 2024-02-15 - Granted: 2025-02-11 - Earliest claimed: 2018-10-04 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Eiji Teraoka; Hirokazu Takashima - Web page: https://patentgrep.com/patent/US12224122B2 ## CPC - H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)} - H01G 4/012: Form of non-self-supporting electrodes - H01G 4/1218: {based on titanium oxides or titanates (H01G4/1245 takes precedence)} - H01G 4/1227: {based on alkaline earth titanates} - H01G 4/1236: {based on zirconium oxides or zirconates (H01G4/1263 takes precedence)} - H01G 4/228: Terminals - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) ## Abstract An electronic component includes a laminate in which first internal electrodes and second internal electrodes are alternately laminated in a lamination direction with dielectric layers interposed therebetween, the laminate including a first main surface and a second main surface opposite to each other in the lamination direction, a first side surface and a second side surface opposite to each other in a width direction, and a first end surface and a second end surface opposite to each other in a length direction, a first external electrode provided on a surface of the laminate and electrically connected to the first internal electrodes, a second external electrode provided on a surface of the laminate and electrically connected to the second internal electrodes, and side margin portions each including a dielectric including Ca, Zr, and Ti. ## Claims ### Claim 1 An electronic component, comprising: a laminate including an inner layer portion including first internal electrodes and second internal electrodes that are alternately laminated in a lamination direction with dielectric layers interposed between the first internal electrodes and the second internal electrodes, and outer layer portions that sandwich the inner layer portion in the lamination direction, the laminate further including: a first main surface and a second main surface opposite to each other in the lamination direction; a first side surface and a second side surface opposite to each other in a width direction orthogonal or substantially orthogonal to the lamination direction; and a first end surface and a second end surface opposite to each other in a length direction orthogonal or substantially orthogonal to the lamination direction and the width direction; a first external electrode provided on at least the first end surface of the laminate and electrically connected to the first internal electrodes; and a second external electrode provided on at least the second end surface of the laminate and electrically connected to the second internal electrodes; wherein when a cross section including the length direction and the width direction of the laminate is viewed from the lamination direction, side margin portions each include a dielectric including Ca, Zr, and Ti, each of the side margin portions being a region in which none of the first internal electrodes and the second internal electrodes are disposed; each of the side margin portions includes a first portion and a second portion, and the first portion of the side margin portion is closer to the first and second internal electrodes than the second portion of the side margin portion in the width direction; each of the side margin portions includes Si, and a molar ratio of Si/Ti in the second portion is higher than a molar ratio of Si/Ti in the first portion; and the dielectric layers include a different dielectric composition from that of the side margin portions. ### Claim 2 (depends on 1) The electronic component according to claim 1, wherein each of the dielectric layers between each of the first internal electrodes and each the second internal electrodes includes a dielectric material including Ba and Ti as main components. ### Claim 3 (depends on 1) The electronic component according to claim 1, wherein a dimension of the side margin portions in the width direction is about 5 μm or more and about 30 μm or less. ### Claim 4 (depends on 1) The electronic component according to claim 1, wherein a number of laminated internal electrodes including the first internal electrodes and the second internal electrodes is 10 or more and 500 or less; a distance between the first main surface and an internal electrode at a position closest to the first main surface among the first internal electrodes and the second internal electrodes is about 5 μm or more and about 30 μm or less; and a distance between the second main surface and an internal electrode at a position closest to the second main surface among the first internal electrodes and the second internal electrodes is about 5 μm or more and about 30 μm or less. ### Claim 5 (depends on 1) The electronic component according to claim 1, wherein the first internal electrodes and the second internal electrodes each include Cu. ### Claim 6 (depends on 1) The electronic component according to claim 1, wherein the electronic component includes: a dimension in the length direction of about 0.2 mm or more and about 3.2 mm or less; a dimension in the width direction of about 0.1 mm or more and about 1.6 mm or less; and a dimension in the lamination direction of about 0.1 mm or more and about 1.6 mm or less. ### Claim 7 (depends on 1) A circuit board on which the electronic component according to claim 1 is mounted, wherein the electronic component is mounted so that the side margin portions of the electronic component face a mounting surface of the circuit board. ### Claim 8 (depends on 7) The circuit board according to claim 7, wherein a distance between an end portion of the electronic component on a circuit board side and the mounting surface of the circuit board is about 20 μm or more and about 50 μm or less. ### Claim 9 (depends on 1) A method of mounting the electronic component according to claim 1 on a circuit board, the method comprising: mounting the electronic component on the circuit board so that the side margin portions of the electronic component face a mounting surface of the circuit board. ### Claim 10 (depends on 1) The electronic component according to claim 1, wherein the first external electrode and the second external electrode face each other. ### Claim 11 (depends on 1) The electronic component according to claim 1, wherein the side margin portions extend from the first main surface to the second main surface. ### Claim 12 (depends on 11) The electronic component according to claim 11, wherein each of the outer layer portions is a region in which none of the first internal electrodes and the second internal electrodes are disposed and includes at least one dielectric layer. ### Claim 13 (depends on 1) The electronic component according to claim 1, wherein the side margin portions include a plurality of side margin layers laminated in the width direction. ### Claim 14 (depends on 13) The electronic component according to claim 13, wherein the first portions of the side margin portions include inner side margin layers of the plurality of side margin layers, and the second portions of the side margin portions include outer side margin layers of the plurality of side margin layers. ### Claim 15 (depends on 14) The electronic component according to claim 14, wherein a dimension in the width direction of the outer side margin layers is larger than a dimension in the width direction of the inner side margin layers. ### Claim 16 (depends on 1) The electronic component according to claim 1, wherein the first external electrode is provided on an entirety or substantially an entirety of the first end surface of the laminate; and the second external electrode is provided on an entirety or substantially an entirety of the second end surface of the laminate. ### Claim 17 (depends on 1) The electronic component according to claim 1, wherein the first external electrode includes a three-layer structure including a first base electrode layer, a first lower plating layer provided on a surface of the first base electrode layer, and a first upper plating layer provided on a surface of the first lower plating layer; and the second external electrode includes a three-layer structure including a second base electrode layer, a second lower plating layer provided on a surface of the second base electrode layer, and a second upper plating layer provided on a surface of the second lower plating layer. ### Claim 18 (depends on 17) The electronic component according to claim 17, wherein the first base electrode layer is provided on an entirety or substantially an entirety of the first end surface of the laminate; and the second base electrode layer is provided on an entirety or substantially an entirety of the second end surface of the laminate. ### Claim 19 (depends on 1) The electronic component according to claim 1, wherein the first external electrode includes a first base electrode layer; the second external electrode includes a second base electrode layer; the first base electrode layer is provided on the first end surface of the laminate and extends to each of the first and second main surfaces and the first and second side surfaces of the laminate; and the second base electrode layer is provided on the second end surface of the laminate and extends to each of the first and second main surfaces and the first and second side surfaces of the laminate. ### Claim 20 An electronic component, comprising: a laminate including an inner layer portion including first internal electrodes and second internal electrodes that are alternately laminated in a lamination direction with dielectric layers interposed between the first internal electrodes and the second internal electrodes, and outer layer portions that sandwich the inner layer portion in the lamination direction, the laminate further including: a first main surface and a second main surface opposite to each other in the lamination direction; a first side surface and a second side surface opposite to each other in a width direction orthogonal or substantially orthogonal to the lamination direction; and a first end surface and a second end surface opposite to each other in a length direction orthogonal or substantially orthogonal to the lamination direction and the width direction; a first external electrode provided on at least the first end surface of the laminate and electrically connected to the first internal electrodes; and a second external electrode provided on at least the second end surface of the laminate and electrically connected to the second internal electrodes; wherein when a cross section including the length direction and the width direction of the laminate is viewed from the lamination direction, side margin portions each include a dielectric including Ca, Zr, and Ti, each of the side margin portions being a region in which none of the first internal electrodes and the second internal electrodes are disposed; each of the side margin portions includes a first portion and a second portion, and the first portion of the side margin portion is closer to the first and second internal electrodes than the second portion of the side margin portion in the width direction; each of the side margin portions includes Si, and a molar ratio of Si/Ti in the second portion is higher than a molar ratio of Si/Ti in the first portion; and the dielectric layers include about 90 mol % or more of Ba and Ti in combination.