# US 12,224,121 B2 · Multilayer capacitor and board having the same mounted thereon > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,224,121 B2 - Document ID: US12224121B2 - Status: Granted - Kind: B2 - Application number: 18/232,050 - Filed: 2023-08-09 - Published: 2023-11-30 - Granted: 2025-02-11 - Earliest claimed: 2020-12-30 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: A Ra Cho; Dong Hwi Shin; Seon Young Yoo - Web page: https://patentgrep.com/patent/US12224121B2 ## CPC - H01G 4/008: Selection of materials - H01G 4/0085: {Fried electrodes} - H01G 4/1209: {characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence)} - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 4/2325: {characterised by the material of the terminals} - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 1/181: associated with surface mounted components - H01G 4/012: Form of non-self-supporting electrodes - H05K 2201/10015: Non-printed capacitor - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with each of the plurality of dielectric layers interposed therebetween, and an external electrode disposed on the capacitor body to be connected to the internal electrode. At least one intermetallic compound layer is disposed in a region in which the plurality of internal electrodes and the external electrode are connected, and a total number of the at least one intermetallic compound layer is more than or equal to 55% and less than 100% of a total number of the plurality of internal electrodes. ## Claims ### Claim 1 A multilayer capacitor comprising: a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with each of the plurality of dielectric layers interposed therebetween; and an external electrode disposed on the capacitor body to be connected to the plurality of internal electrodes, wherein at least one intermetallic compound layer is disposed in a region in which the plurality of internal electrodes and the external electrode are connected, the capacitor body comprises first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, perpendicular to the first direction, and fifth and sixth surfaces opposing each other in a third direction, perpendicular to the first and second directions, in the third and fourth surfaces of capacitor body, a plurality of grooves are disposed between the dielectric layers disposed in the first direction, the at least one intermetallic compound layer is disposed in the grooves, and the external electrode is free of an intermetallic compound layer. ### Claim 2 (depends on 1) The multilayer capacitor of claim 1, wherein a total number of the at least one intermetallic compound layer is 55% to 99% of a total number of the plurality of internal electrodes. ### Claim 3 (depends on 1) The multilayer capacitor of claim 1, wherein a ratio of an average thickness of the at least one intermetallic compound layer to an average thickness of an internal electrode is 50% or more. ### Claim 4 (depends on 1) The multilayer capacitor of claim 1, wherein an average depth of the plurality of grooves is 30 μm or more. ### Claim 5 (depends on 1) The multilayer capacitor of claim 1, wherein an average depth of portions of the external electrode that diffuse to the plurality of internal electrodes, on connection portions between the plurality of internal electrodes and the external electrode, is 30 μm or more. ### Claim 6 (depends on 1) The multilayer capacitor of claim 1, wherein the external electrode comprises: an electrode layer disposed on the capacitor body and in contact with the at least one intermetallic compound layer; and a conductive resin layer disposed on layer and including a plurality of metal conductive connection portion surrounding plurality of metal particles and contacting layer, and a base resin. ### Claim 7 (depends on 6) The multilayer capacitor of claim 6, wherein the plurality of metal particles of the conductive resin layer include at least one of copper, nickel, silver, silver-coated copper, or tin-coated copper. ### Claim 8 (depends on 6) The multilayer capacitor of claim 6, wherein the plurality of metal particles of the conductive resin layer have one of a spherical shape, a flake shape, or a mixture of the spherical shape and the flake shape. ### Claim 9 (depends on 6) The multilayer capacitor of claim 6, wherein the external electrode further comprises a plating layer disposed on the conductive resin layer. ### Claim 10 (depends on 9) The multilayer capacitor of claim 9, wherein the plating layer comprises a nickel plating layer and a tin plating layer, sequentially stacked on the conductive resin layer. ### Claim 11 (depends on 1) The multilayer capacitor of claim 1, wherein each of the plurality of internal electrodes includes nickel, and the at least one intermetallic compound layer includes nickel-copper (Ni—Cu). ### Claim 12 (depends on 1) A board having a multilayer capacitor mounted thereon, the board comprising: a substrate having a plurality of electrode pads on one surface of the substrate; and the multilayer capacitor of claim 1, mounted on the substrate, wherein the external electrode is connected to the plurality of electrode pads.