# US 12,224,120 B2 · Electronic component

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- Number: US 12,224,120 B2
- Document ID: US12224120B2
- Status: Granted
- Kind: B2
- Application number: 18/416,983
- Filed: 2024-01-19
- Published: 2024-06-20
- Granted: 2025-02-11
- Earliest claimed: 2021-05-31
- Assignees: Murata Manufacturing Co., Ltd.
- Applicants: Murata Manufacturing Co., Ltd.
- Inventors: Satoshi Yokomizo; Shinobu Chikuma; Yohei Mukobata
- Web page: https://patentgrep.com/patent/US12224120B2

## CPC

- H01G 2/06: specially adapted for mounting on a printed-circuit support
- H01G 2/065: {for surface mounting, e.g. chip capacitors}
- H01G 4/008: Selection of materials
- H01G 4/1227: {based on alkaline earth titanates}
- H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor
- H01G 4/2325: {characterised by the material of the terminals}
- H01G 4/248: the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence)
- H01G 4/30: Stacked capacitors (H01G4/33 takes precedence)
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)

## Abstract

An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at a pair of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A mark portion is provided on one of the board main surfaces.

## Claims

### Claim 1

An electronic component comprising:
an electronic element; and
an interposer board; wherein
the electronic element includes:
a multilayer body including dielectric layers and internal electrode layers which are alternately laminated, a pair of multilayer body end surfaces orthogonal or substantially orthogonal to the internal electrode layers, a pair of multilayer body side surfaces orthogonal or substantially orthogonal to the multilayer body end surfaces, and a pair of multilayer body main surfaces orthogonal or substantially orthogonal to the multilayer body end surfaces and the multilayer body side surfaces; and
external electrodes each on a respective one of the pair of multilayer body end surfaces of the multilayer body and connected to the internal electrode layers;
the interposer board includes a pair of board end surfaces, a pair of board side surfaces orthogonal or substantially orthogonal to the board end surfaces, and a pair of board main surfaces orthogonal or substantially orthogonal to the board end surfaces and the board side surfaces;
one of the pair of board main surfaces is joined with one of the pair of multilayer body main surfaces or one of the pair of multilayer body side surfaces;
the interposer board is an alumina board; and
a mark portion includes Si and alumina, and is provided on one of the pair of board main surfaces.

### Claim 2 (depends on 1)

The electronic component according to claim 1, wherein the mark portion is provided at a middle portion of the board main surface.

### Claim 3 (depends on 1)

The electronic component according to claim 1, wherein a Cu fired layer is provided on the one of the pair of board main surfaces in a vicinity of both ends of the interposer board, and the mark portion is thinner than the Cu fired layer.

### Claim 4 (depends on 1)

The electronic component according to claim 1, wherein the mark portion is provided on the one of the board main surfaces in a vicinity of the electronic element.

### Claim 5 (depends on 1)

The electronic component according to claim 1, wherein the mark portion is provided on one of the board main surfaces in a vicinity of a circuit board.

### Claim 6 (depends on 1)

The electronic component according to claim 1, wherein the mark portion has a circular, substantially circular, oval, substantially oval, triangular, or substantially triangular shape.

### Claim 7 (depends on 1)

The electronic component according to claim 1, wherein the interposer board includes a recess in each of the pair of board end surfaces.

### Claim 8 (depends on 1)

The electronic component according to claim 1, wherein, in the electronic element, a length between the pair of multilayer body end surfaces is about 2.01 mm to about 2.20 mm, a width between the pair of multilayer body side surfaces is about 1.30 mm to about 1.50 mm, a thickness between the pair of multilayer body main surfaces is about 1.70 mm to about 1.9 mm, a thickness of each of the dielectric layers is about 0.4 um to about 0.8 um, and a thickness of each of the internal electrode layers is about 0.4 um to about 0.8 um.

### Claim 9 (depends on 1)

The electronic component according to claim 1, wherein, in the electronic element, a length between the pair of multilayer body end surfaces is about 3.1 mm to about 3.3 mm, a width between the pair of multilayer body side surfaces is about 1.5 mm to about 2.7 mm, a thickness between the pair of multilayer body main surfaces is about 1.5 mm to about 2.7 mm, a thickness of each of the dielectric layers is about 0.4 um to about 0.8 um, and a thickness of each of the internal electrode layers is about 0.4 um to about 0.8 um.