# US 12,224,119 B2 · Electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,224,119 B2 - Document ID: US12224119B2 - Status: Granted - Kind: B2 - Application number: 18/400,401 - Filed: 2023-12-29 - Published: 2024-04-25 - Granted: 2025-02-11 - Earliest claimed: 2021-05-31 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Satoshi Yokomizo; Shinobu Chikuma; Yohei Mukobata - Web page: https://patentgrep.com/patent/US12224119B2 ## CPC - H01G 2/06: specially adapted for mounting on a printed-circuit support - H01G 4/2325: {characterised by the material of the terminals} - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion} - H05K 3/3442: {having edge contacts, e.g. leadless chip capacitors, chip carriers} - H01G 4/008: Selection of materials - H01G 4/0085: {Fried electrodes} - H01G 4/1227: {based on alkaline earth titanates} - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 4/248: the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) - H05K 1/181: associated with surface mounted components - H05K 2201/10015: Non-printed capacitor - H05K 2201/10378: Interposers - H05K 2201/1053: Mounted components directly electrically connected to each other, i.e. not via the PCB - H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes each at a respective one of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The external electrodes each include a first Sn plated layer that covers an outer surface of the interposer board in a vicinity of at least one board end surface. ## Claims ### Claim 1 An electronic component comprising: an electronic element; and an interposer board; wherein the electronic element includes: a multilayer body including dielectric layers and internal electrode layers which are alternately laminated, a pair of multilayer body end surfaces orthogonal or substantially orthogonal to the internal electrode layers, a pair of multilayer body side surfaces orthogonal or substantially orthogonal to the multilayer body end surfaces, and a pair of multilayer body main surfaces orthogonal or substantially orthogonal to the multilayer body end surfaces and the multilayer body side surfaces; and external electrodes each on a respective one of the pair of multilayer body end surfaces of the multilayer body and connected to the internal electrode layers; the interposer board includes a pair of board end surfaces, a pair of board side surfaces orthogonal or substantially orthogonal to the board end surfaces, and a pair of board main surfaces orthogonal or substantially orthogonal to the board end surfaces and the board side surfaces; one of the pair of board main surfaces is joined with one of the pair of multilayer body main surfaces or one of the pair of multilayer body side surfaces; the external electrodes include a first Cu layer and a first Ni plated layer; a second Cu layer is located on the interposer; a second Ni plated layer is located on the second Cu layer; the interposer board is an alumina board; the first Ni plated layer is spaced from the second Ni plated layer; and a first Sn plated layer is located on the first Ni plated layer and the second Ni plated layer. ### Claim 2 (depends on 1) The electronic component according to claim 1, wherein the second Ni plated layer is provided on the interposer board in a vicinity of at least one of the board end surfaces; and the first Ni plated layer is not connected to the second Ni plated layer. ### Claim 3 (depends on 1) The electronic component according to claim 1, wherein the electronic element and the interposer board are joined with each other by a Sn solder including a flux. ### Claim 4 (depends on 1) The electronic component according to claim 1, wherein the interposer board includes a recess in each of the pair of board end surfaces. ### Claim 5 (depends on 1) The electronic component according to claim 1, wherein, in the electronic element, a length between the pair of multilayer body end surfaces is about 2.01 mm to about 2.20 mm, a width between the pair of multilayer body side surfaces is about 1.30 mm to about 1.50 mm, a thickness between the pair of multilayer body main surfaces is about 1.70 mm to about 1.9 mm, a thickness of each of the dielectric layers is about 0.4 μm to about 0.8 μm, and a thickness of each of the internal electrode layers is about 0.4 μm to about 0.8 μm. ### Claim 6 (depends on 1) The electronic component according to claim 1, wherein, in the electronic element, a length between the pair of multilayer body end surfaces is about 3.1 mm to about 3.3 mm, a width between the pair of multilayer body side surfaces is about 1.5 mm to about 2.7 mm, a thickness between the pair of multilayer body main surfaces is about 1.5 mm to about 2.7 mm, a thickness of each of the dielectric layers is about 0.4 μm to about 0.8 μm, and a thickness of each of the internal electrode layers is about 0.4 μm to about 0.8 μm. ### Claim 7 An electronic component comprising: an electronic element; and an interposer board; wherein the electronic element includes: a multilayer body including dielectric layers and internal electrode layers which are alternately laminated, a pair of multilayer body end surfaces orthogonal or substantially orthogonal to the internal electrode layers, a pair of multilayer body side surfaces orthogonal or substantially orthogonal to the multilayer body end surfaces, and a pair of multilayer body main surfaces orthogonal or substantially orthogonal to the multilayer body end surfaces and the multilayer body side surfaces; and external electrodes each on a respective one of the pair of multilayer body end surfaces of the multilayer body and connected to the internal electrode layers; the interposer board includes a pair of board end surfaces, a pair of board side surfaces orthogonal or substantially orthogonal to the board end surfaces, and a pair of board main surfaces orthogonal or substantially orthogonal to the board end surfaces and the board side surfaces; one of the pair of board main surfaces is joined with one of the pair of multilayer body main surfaces or one of the pair of multilayer body side surfaces; the external electrodes include a first Cu layer, a first Ni plated layer, and a first Sn plated layer; a second Cu layer is located on the interposer; a second Ni plated layer is located on the second Cu layer; a second Sn plated layer is located on the Ni plated layer; the interposer board is an alumina board; the first Ni plated layer is spaced from the second Ni plated layer; a third Sn plated layer is located between the first Ni plated layer and the first Sn plated layer; and the first Sn plated layer is located on the third Sn plated layer and the second Sn plated layer. ### Claim 8 (depends on 7) The electronic component according to claim 7, wherein the second Ni plated layer is provided on the interposer board in a vicinity of at least one of the board end surfaces; and the first Ni plated layer is not connected to the second Ni plated layer. ### Claim 9 (depends on 7) The electronic component according to claim 7, wherein the electronic element and the interposer board are joined with each other by a Sn solder including a flux. ### Claim 10 (depends on 7) The electronic component according to claim 7, wherein the interposer board includes a recess in each of the pair of board end surfaces. ### Claim 11 (depends on 7) The electronic component according to claim 7, wherein, in the electronic element, a length between the pair of multilayer body end surfaces is about 2.01 mm to about 2.20 mm, a width between the pair of multilayer body side surfaces is about 1.30 mm to about 1.50 mm, a thickness between the pair of multilayer body main surfaces is about 1.70 mm to about 1.9 mm, a thickness of each of the dielectric layers is about 0.4 μm to about 0.8 μm, and a thickness of each of the internal electrode layers is about 0.4 μm to about 0.8 μm. ### Claim 12 (depends on 7) The electronic component according to claim 7, wherein, in the electronic element, a length between the pair of multilayer body end surfaces is about 3.1 mm to about 3.3 mm, a width between the pair of multilayer body side surfaces is about 1.5 mm to about 2.7 mm, a thickness between the pair of multilayer body main surfaces is about 1.5 mm to about 2.7 mm, a thickness of each of the dielectric layers is about 0.4 μm to about 0.8 μm, and a thickness of each of the internal electrode layers is about 0.4 μm to about 0.8 μm.