# US 12,224,111 B2 · Composite electronic component

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- Number: US 12,224,111 B2
- Document ID: US12224111B2
- Status: Granted
- Kind: B2
- Application number: 18/124,236
- Filed: 2023-03-21
- Published: 2023-10-05
- Granted: 2025-02-11
- Earliest claimed: 2022-03-31
- Assignees: TDK Corporation
- Applicants: TDK Corporation
- Inventors: Takashi Ito; Tasuku Kawagoe; Keigo Higashida
- Web page: https://patentgrep.com/patent/US12224111B2

## CPC

- H01F 17/045: {with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core}
- H01F 27/402: {Association of measuring or protective means}
- H01F 27/292: {Surface mounted devices}
- H01F 38/48: {Common mode inductor for reducing or eliminating common mode noise on parallel lines}
- H05K 1/0233: {Filters, inductors or a magnetic substance}
- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H05K 1/181: associated with surface mounted components
- H05K 2201/10015: Non-printed capacitor
- H05K 2201/10022: Non-printed resistor
- H05K 2201/1003: Non-printed inductor
- H05K 2201/1006: Non-printed filter
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

The composite electronic component includes: a substrate having a GND pattern; a coil component having at least three terminals and mounted on a first surface of the substrate; and an overlapping arrangement component mounted on the first surface so that at least a part of the overlapping arrangement component overlaps the coil component when viewed from a first direction perpendicular to the first surface. The substrate has at least three coil connection patterns formed on the first surface and connected to the terminals, at least two component connection patterns formed on the first surface and connected to the overlapping arrangement component, and a GND via connecting one of the component connection patterns and the GND pattern to each other. The GND via is arranged in a substrate outer region, which is outside a region of a hypothetical polygon connecting all of the coil connection patterns on the substrate with a shortest perimeter, when viewed from the first direction.

## Claims

### Claim 1

A composite electronic component, comprising:
a substrate having a GND pattern;
a coil component having at least three terminals and mounted on a first surface of the substrate; and
an overlapping arrangement component that is an electronic component having a height lower than that of the coil component and that is mounted on the first surface so that at least a part of the overlapping arrangement component overlaps the coil component when viewed from a first direction perpendicular to the first surface,
wherein the substrate has at least three coil connection patterns formed on the first surface and connected to the terminals, at least two component connection patterns formed on the first surface and connected to the overlapping arrangement component, and a GND via electrically connecting one of the component connection patterns and the GND pattern to each other, and
the GND via is arranged in a substrate outer region, which is outside a region of a hypothetical polygon connecting all of the coil connection patterns on the substrate with a shortest perimeter, when viewed from the first direction.

### Claim 2 (depends on 1)

The composite electronic component according to claim 1,
wherein the coil component is a common mode filter.

### Claim 3 (depends on 1)

The composite electronic component according to claim 1,
wherein the overlapping arrangement component is a capacitor.

### Claim 4 (depends on 1)

The composite electronic component according to claim 1, further comprising:
a resistive element mounted on the first surface so that at least a part of the resistive element overlaps the coil component when viewed from the first direction,
wherein, one end of the resistive element is wired to one of the coil connection patterns on the substrate, and the other end of the resistive element is wired to another one of the component connection patterns on the substrate.

### Claim 5 (depends on 4)

The composite electronic component according to claim 4,
wherein at least a part of the resistive element is arranged in a substrate inner region, which is inside the region of the hypothetical polygon on the substrate, when viewed from the first direction.

### Claim 6 (depends on 1)

The composite electronic component according to claim 1,
wherein at least a part of another one of the component connection patterns is arranged in a substrate inner region, which is inside the region of the hypothetical polygon on the substrate, when viewed from the first direction.

### Claim 7 (depends on 1)

The composite electronic component according to claim 1, further comprising:
an ESD protection element mounted on the first surface so that at least a part of the ESD protection element overlaps the coil component when viewed from the first direction,
wherein, on the substrate, the ESD protection element is wired to one of the coil connection patterns.