Electronic component and method for producing electronic component

An electronic component comprising an outer electrode on a surface of a multilayer body, the multilayer body including an inner glass layer, a magnetic material layer on a top surface and a bottom surface of the inner glass layer, and an outer glass layer on a top surface and a bottom surface of the magnetic material layer,

• wherein the inner glass layer includes a coil multilayer body and a lead-out electrode layer on a top surface and/or a bottom surface of the coil multilayer body, the coil multilayer body including a plurality of coil conductor layers, each of the coil conductor layers including a coil conductor having a coil pattern on a surface of an insulating layer, the lead-out electrode layer including a lead-out electrode on a surface of an insulating layer,
• the coil multilayer body includes a primary coil conductor layer including a primary coil conductor and a secondary coil conductor layer including a secondary coil conductor stacked in this order on the bottom surface thereof,
• the outer electrode includes a first outer electrode, a second outer electrode, a third outer electrode, and a fourth outer electrode,
• the primary coil conductor is coupled to the first outer electrode and the third outer electrode,
• the secondary coil conductor is coupled to the second outer electrode and the fourth outer electrode,
• the insulating layers of the inner glass layer and the outer glass layers contain a dielectric glass material that contains a glass material containing at least K, B, and Si, quartz, and alumina,
• the glass material content of each insulating layer of the inner glass layer ranges from approximately 60% to 65% by weight,
• the quartz content of each insulating layer of the inner glass layer ranges from approximately 34% to 37% by weight, and
• the alumina content of each insulating layer of the inner glass layer ranges from approximately 0.5% to 4% by weight.