# US 12,222,460 B2 · Ultrasonic sensor and method of manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,222,460 B2 - Document ID: US12222460B2 - Status: Granted - Kind: B2 - Application number: 18/396,629 - Filed: 2023-12-26 - Published: 2024-05-23 - Granted: 2025-02-11 - Earliest claimed: 2022-08-16 - Assignees: Hyundai Mobis Co., Ltd. - Applicants: Hyundai Mobis Co., Ltd. - Inventors: Sang Hee Bae - Web page: https://patentgrep.com/patent/US12222460B2 ## CPC - G01H 11/08: using piezoelectric devices - G01S 7/521: Constructional features - B06B 1/0644: {using a single piezoelectric element (B06B1/0688 takes precedence)} - G01S 15/08: Systems for measuring distance only (indirect measurement G01S15/46) - G10K 9/122: using piezoelectric driving means {(G10K9/121 takes precedence)} - G01H: MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES - G01S: RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - B06B: METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, {e.g.} FOR PERFORMING MECHANICAL WORK IN GENERAL (for particular applications, see the relevant subclasses, e.g. B07B1/40, B23Q17/12, B24B31/06; measurement of mechanical vibrations G01H; in direction finding, locating, distance or velocity measuring G01S; {generating seismic energy G01V1/02}; control of mechanical vibrations in general G05D; sound-producing devices, e.g. bells, sirens, whistles G10K, {e.g. methods or devices for transmitting, conducting, or directing sound in general G10K11/00}; generation of electrical oscillations H03B; electromechanical resonators in general H03H; electromechanical transducers {for communication techniques, e.g. microphones, speakers} H04R) - G10K: SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR ## Abstract An ultrasonic sensor includes a piezoelectric element, a cell case configured to support the piezoelectric element bonded to a front portion of the cell case at an inside of the cell case, the cell case having an opening at a rear portion thereof, a PCB assembly electrically connected to the piezoelectric element, a housing coupled to the opening of the cell case while receiving the PCB assembly therein and configured to seal a space required for electrical connection between the piezoelectric element in the cell case and the PCB assembly, a filler filling the space required for electrical connection between the piezoelectric element and the PCB assembly, after completion of the electrical connection between the piezoelectric element and the PCB assembly, and a rear cover configured to seal a rear opening formed at the housing in order to allow insertion of the PCB assembly. ## Claims ### Claim 1 An ultrasonic sensor comprising: a piezoelectric element; a printed circuit board (PCB) assembly electrically connected to the piezoelectric element; a housing receiving the PCB assembly therein and configured to seal a space required for electrical connection between the piezoelectric element and the PCB assembly; a filler filling the space required for electrical connection between the piezoelectric element and the PCB assembly; and a rear cover configured to seal a rear opening formed at the housing to allow insertion of the PCB assembly. ### Claim 2 (depends on 1) The ultrasonic sensor according to claim 1, wherein the PCB assembly divides an interior of the housing into a space facing the piezoelectric element and a space connected to the rear cover such that the spaces are isolated from each other. ### Claim 3 (depends on 2) The ultrasonic sensor according to claim 2, wherein an application-specific integrated circuit (ASIC) is disposed at a surface of the PCB assembly facing the piezoelectric element, and a circuit element having a greater volume protruding from the PCB assembly than a volume of the ASIC protruding from the PCB assembly is disposed at a surface of the PCB assembly facing the rear cover. ### Claim 4 (depends on 2) The ultrasonic sensor according to claim 2, wherein: the rear cover is made of engineering plastic having a laser transmittance of 50% or more at a thickness of 1 mm; and the rear cover is bonded to the housing through laser welding. ### Claim 5 (depends on 2) The ultrasonic sensor according to claim 2, wherein: a connector is formed at the housing such that the connector is integrated with the housing; and connector pins of the connector are insert-molded in the housing such that one-side ends of the connector pins connected to the PCB assembly protrude toward the rear cover in parallel. ### Claim 6 (depends on 5) The ultrasonic sensor according to claim 5, wherein: lead pins are inserted into the housing, for electrical interconnection between the PCB assembly and the piezoelectric element; the lead pins are inserted into the housing such that one-side ends thereof connected to the PCB assembly protrude toward the rear cover in parallel to the connector pins; and the PCB assembly is coupled to the connector pins and the lead pins through press fitting. ### Claim 7 (depends on 6) The ultrasonic sensor according to claim 6, wherein the lead pins are coupled to the housing through linear movement thereof in a forward/rearward direction from a side of the rear cover to a side of the piezoelectric element, so that movement of the lead pins relative to the housing in any direction is restrained. ### Claim 8 (depends on 7) The ultrasonic sensor according to claim 7, wherein each of the lead pins comprises: a restraint portion configured to be inserted into a pin insertion groove formed at the housing in front of the one-side end of the lead pin press-fitted in the PCB assembly, restraining relative movement thereof in a direction perpendicular to the forward/rearward direction; and a press-fit protrusion protruding from the restraint portion in the forward/rearward direction, to be press-fitted in the housing. ### Claim 9 (depends on 8) The ultrasonic sensor according to claim 8, wherein: the lead pin is bent toward a central portion of the housing after extending from the restraint portion in the forward/rearward direction; and restraint protrusions are provided at the housing, to restrain opposite sides of a bent portion of the lead pin. ### Claim 10 (depends on 8) The ultrasonic sensor according to claim 8, wherein: a wire is provided between an other-side end of the lead pin and the piezoelectric element such that opposite ends of the wire are coupled to the lead pin and the piezoelectric element, respectively; and the wire has at least one bent portion at a middle portion thereof, to prevent the wire from being disconnected in spite of shrinkage and expansion of the filler. ### Claim 11 (depends on 2) The ultrasonic sensor according to claim 2, further comprising: a cell case equipped with the piezoelectric element inside and provided in the front of the housing; a rubber cap interposed between the cell case and the housing; and a front cover fitted around the cell case, to surround front portions of the rubber cap and the housing. ### Claim 12 (depends on 11) The ultrasonic sensor according to claim 11, wherein the housing has an integrated structure comprising: a support portion configured to support a rear end of the cell case under a condition that the rubber cap is interposed between the support portion and the rear end of the cell case and to allow the opening of the cell case to communicate with the interior of the housing; and a front end configured to protrude from an outside of the support portion in a forward direction while being surrounded by the front cover. ### Claim 13 (depends on 12) The ultrasonic sensor according to claim 12, wherein the rubber cap has an integrated structure comprising: a first sealing protrusion configured to press an inner peripheral surface of the support portion of the housing, sealing the inner peripheral surface of the support portion; a second sealing protrusion configured to press an inner peripheral surface of the front end of the housing, sealing the inner peripheral surface of the front end; and a third sealing protrusion configured to press an outer peripheral surface of the cell case, sealing the outer peripheral surface of the cell case. ### Claim 14 (depends on 13) The ultrasonic sensor according to claim 13, wherein: an enlarged portion having an enlarged cross-section is provided at a rear portion of the outer peripheral surface of the cell case; and the third sealing protrusion is formed to press a region where the enlarged portion of the cell case starts. ### Claim 15 (depends on 13) The ultrasonic sensor according to claim 13, wherein: the front cover is provided with a press-fit rib configured to be press-fitted at a front portion of the rubber cap; and the rubber cap is formed with a press-fit groove configured to receive the press-fit rib. ### Claim 16 (depends on 15) The ultrasonic sensor according to claim 15, wherein the front cover is fused to the housing and the rubber cap by ultrasonic waves in a state in which the front cover presses the rubber cap against the outer peripheral surface of the cell case by an inclined surface formed inside the press-fit rib. ### Claim 17 (depends on 12) The ultrasonic sensor according to claim 12, wherein at least one protrusion rib is formed at the support portion of the housing such that the protrusion rib protrudes toward the front portion of the rubber cap. ### Claim 18 An ultrasonic sensor, comprising: a housing with openings at both the front and the rear; a piezoelectric element installed in a manner to seal the front of the housing; a printed circuit board (PCB) assembly configured to block both the front and the rear of the housing; a filler material filling the space where the piezoelectric element and the PCB assembly are electrically connected. ### Claim 19 (depends on 18) The ultrasonic sensor according to claim 18, further comprising: a rear cover sealing the rear of the housing. ### Claim 20 (depends on 18) The ultrasonic sensor according to claim 18, further comprising: the front of the housing is sealed by a cell case enclosing the piezoelectric element and being coupled to the front of the housing.