# US 12,222,447 B1 · LIDAR sensor system including integrated modulator > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,222,447 B1 - Document ID: US12222447B1 - Status: Granted - Kind: B1 - Application number: 18/516,646 - Filed: 2023-11-21 - Granted: 2025-02-11 - Earliest claimed: 2023-11-21 - Assignees: Aurora Operations, Inc. - Applicants: Aurora Operations, Inc. - Inventors: Ashish Bhardwaj; Sen Lin; Dong Liu; Xue Liu; Andrew Steil Michaels - Web page: https://patentgrep.com/patent/US12222447B1 ## CPC - G01S 7/4816: {of receivers alone} - G01S 17/34: using transmission of continuous, frequency-modulated waves while heterodyning the received signal, or a signal derived therefrom, with a locally-generated signal related to the contemporaneously transmitted signal - G01S 17/42: Simultaneous measurement of distance and other co-ordinates (indirect measurement G01S17/46) - G01S 17/89: for mapping or imaging - G01S 17/931: of land vehicles - G01S: RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES ## Abstract A light detection and ranging (LIDAR) system for a vehicle can include: a light source configured to output a beam; a photonics integrated circuit (PIC) including a semiconductor die, the semiconductor die comprising a substrate having two or more semiconductor devices formed on the substrate, the two or more semiconductor devices configured to receive the beam from the light source and modify the beam and at least one photonics die coupled to the semiconductor die, the at least one photonics die comprising at least a transmitter configured to receive the beam from the semiconductor die; and one or more optics configured to receive the beam from the transmitter and emit the beam towards an object in an environment of the vehicle. ## Claims ### Claim 1 A light detection and ranging (LIDAR) system for a vehicle, the LIDAR system comprising: a light source configured to output a beam; a photonics integrated circuit (PIC) comprising: a semiconductor die, the semiconductor die comprising a substrate having two or more semiconductor devices formed on the substrate, the two or more semiconductor devices configured to receive the beam from the light source and modify the beam, the two or more semiconductor devices comprising: a first modulator configured to output a transmit signal configured to interact with an object in an environment, wherein the transmit signal is configured to generate a returned signal in response to interaction with the object in the environment; and a second modulator configured to output a local signal; and at least one photonics die coupled to the semiconductor die, the at least one photonics die comprising at least a transmitter configured to receive the beam from the semiconductor die; a mixer configured to mix the returned signal and the local signal and to generate a down-converted signal based on the mix; and one or more optics configured to receive the beam from the transmitter and emit the beam towards the object in the environment of the vehicle. ### Claim 2 (depends on 1) The LIDAR system of claim 1, wherein the semiconductor die comprises one or more channels, at least one of the one or more channels respectively comprising the one or more semiconductor devices, and wherein the at least one photonics die comprises one or more waveguides respectively coupled to the one or more channels. ### Claim 3 (depends on 2) The LIDAR system of claim 2, wherein: the semiconductor die has a particular facet; and an input of at least a first channel of the one or more channels and an output of at least a second channel of the one or more channels are positioned on the particular facet of the semiconductor die. ### Claim 4 (depends on 2) The LIDAR system of claim 2, wherein the at least one photonics die comprises a power distribution network configured to receive the beam and distribute the beam to the one or more channels of the one or more semiconductor devices. ### Claim 5 (depends on 1) The LIDAR system of claim 1, wherein the at least one photonics die comprises at least one silicon photonics die. ### Claim 6 (depends on 1) The LIDAR system of claim 1, wherein the semiconductor die comprises a group III-V semiconductor die, and wherein the one or more semiconductor devices comprise one or more group III-V semiconductor devices. ### Claim 7 (depends on 6) The LIDAR system of claim 6, wherein the group III-V semiconductor devices comprise indium phosphide devices, boron nitride devices, or gallium arsenide devices. ### Claim 8 (depends on 1) The LIDAR system of claim 1, wherein at least one of the two or more semiconductor devices comprises an amplifier stage, the amplifier stage configured to receive the beam from the light source and amplify the beam. ### Claim 9 (depends on 8) The LIDAR system of claim 8, wherein the two or more semiconductor devices comprise a preamplifier stage configured to receive the beam from the light source and amplify the beam to a particular amplitude and provide the beam at the particular amplitude to the amplifier stage. ### Claim 10 (depends on 1) The LIDAR system of claim 1, wherein: a respective semiconductor stack comprises the two or more semiconductor devices on the substrate; and the respective semiconductor stacks of the one or more semiconductor devices are isolated. ### Claim 11 (depends on 1) The LIDAR system of claim 1, wherein the at least one photonics die further comprises a receiver configured to receive a reflected beam from the one or more optics, the reflected beam being reflected from the object. ### Claim 12 (depends on 11) The LIDAR system of claim 11, wherein the at least one photonics die comprises a transceiver die, wherein the transmitter and the receiver are disposed on the transceiver die. ### Claim 13 An autonomous vehicle control system, comprising: a photonics integrated circuit (PIC), the PIC comprising: a semiconductor die, the semiconductor die comprising a substrate having two or more semiconductor devices directly formed on the substrate, the two or more semiconductor devices configured to receive a beam from a light source and modify the beam, the two or more semiconductor devices comprising: a first modulator configured to output a transmit signal configured to interact with an object in an environment, wherein the transmit signal is configured to generate a returned signal in response to interaction with the object in the environment; and a second modulator configured to output a local signal, wherein the local signal and the returned signal are configured to be mixed to generate a down-converted signal; and at least one photonics die coupled to the semiconductor die, the at least one photonics die comprising at least a transmitter configured to receive the beam from the semiconductor die. ### Claim 14 (depends on 13) The autonomous vehicle control system of claim 13, wherein the semiconductor die comprises a group III-V semiconductor die, and wherein the one or more semiconductor devices comprise one or more group III-V semiconductor devices. ### Claim 15 (depends on 13) The autonomous vehicle control system of claim 13, wherein at least one of the two or more semiconductor devices comprises an amplifier stage, the amplifier stage configured to receive the beam from the light source and amplify the beam. ### Claim 16 (depends on 15) The autonomous vehicle control system of claim 15, wherein the two or more semiconductor devices comprise a preamplifier stage configured to receive the beam from the light source and amplify the beam to a particular amplitude and provide the beam at the particular amplitude to the amplifier stage. ### Claim 17 (depends on 13) The autonomous vehicle control system of claim 13, wherein: a respective semiconductor stack comprises the two or more semiconductor devices on the substrate; and the respective semiconductor stacks of the two or more semiconductor devices are isolated. ### Claim 18 An autonomous vehicle, comprising: an autonomous vehicle control system, the autonomous vehicle control system comprising one or more processors; and a light detection and ranging (LIDAR) system, the LIDAR system comprising: a light source configured to output a beam; a photonics integrated circuit (PIC) comprising: a semiconductor die, the semiconductor die comprising a substrate having two or more semiconductor devices formed on the substrate, the two or more semiconductor devices configured to receive the beam from the light source and modify the beam, the two or more semiconductor devices comprising: a first modulator configured to output a transmit signal configured to interact with an object in an environment, wherein the transmit signal is configured to generate a returned signal in response to interaction with the object in the environment; and a second modulator configured to output a local signal; and at least one photonics die coupled to the semiconductor die, the at least one photonics die comprising at least a transmitter configured to receive the beam from the semiconductor die; and one or more optics configured to receive the beam from the transmitter and emit the beam towards the object in the environment of the autonomous vehicle.