# US 12,222,095 B1 · Lightweight powerful LED light for drones

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- Number: US 12,222,095 B1
- Document ID: US12222095B1
- Status: Granted
- Kind: B1
- Application number: 18/329,493
- Filed: 2023-06-05
- Granted: 2025-02-11
- Earliest claimed: 2023-05-26
- Assignees: Light & Motion Industries
- Applicants: Daniel Emerson; David Tolan; Joseph Goldman
- Inventors: Daniel Emerson; David Tolan; Joseph Goldman
- Web page: https://patentgrep.com/patent/US12222095B1

## CPC

- F21V 29/70: characterised by passive heat-dissipating elements, e.g. heat-sinks
- B64D 47/02: Arrangements or adaptations of signal or lighting devices
- F21V 29/60: characterised by the use of a forced flow of gas, e.g. air
- F21V 31/005: {Sealing arrangements therefor}
- B64D 47/04: the lighting devices being primarily intended to illuminate the way ahead
- B64D 2203/00: Aircraft or airfield lights using LEDs
- F21V 29/89: Metals
- F21W 2107/30: for aircraft
- F21Y 2115/10: Light-emitting diodes [LED]
- F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- B64D: EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
- F21W: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED

## Abstract

An LED drone light of high power and very light weight has an LED circuit board cooled by a foamed metal matrix of copper or aluminum. Preferably bonded to a disc or puck which is thermally bonded to the back of the PCB, the foamed metal matrix can be cooled by a small fan attached to the light's housing.

## Claims

### Claim 1

A lightweight LED light device on a drone, comprising:
a housing secured on the drone,
a single circuit board within the housing and including one or more LEDs and LED drive and control electronics,
a focusing optic for each LED,
a heat sink thermally connected to the circuit board, the heat sink including a lightweight foamed metal matrix thermally bonded to a thermal heat sink base or puck secured to a side of the circuit board opposite the LED and electronics, the foamed metal matrix being exposed to air for LED cooling when the drone is flown, and
wiring connected to the LEDs and extending through the housing for connection to a power source carried on the drone,
whereby the foamed metal matrix helps minimize weight of the drone.

### Claim 2 (depends on 1)

The lightweight LED light device of claim 1, including a fan secured to the housing adjacent to the foamed metal matrix, positioned to direct air flow through the foamed metal matrix.

### Claim 3 (depends on 1)

The lightweight LED light device of claim 1, wherein the housing includes a metal external enclosure thermally connected to the foamed metal matrix to provide increased cooling surface.

### Claim 4 (depends on 1)

The lightweight LED light device of claim 1, wherein the housing further includes external fittings formed into an external surface of the housing, providing for attachment to the drone.

### Claim 5 (depends on 1)

The lightweight LED light device of claim 1, wherein the LEDs deliver at least 4000 lumens, with the lighting device having a weight less than 80 grams.

### Claim 6 (depends on 1)

The lightweight LED light device of claim 1, capable of delivering at least 3.5 lux at a distance of 100 meters.

### Claim 7 (depends on 1)

The lightweight LED light device of claim 1, further including means for wireless control of operation of the lighting device from the ground.

### Claim 8 (depends on 7)

The lightweight LED light device of claim 7, including control means employing USB protocol.

### Claim 9 (depends on 1)

The lightweight LED light device of claim 1, wherein the heat sink includes a metal puck secured to the back of the circuit board, the foamed metal matrix being secured to the heat sink puck.

### Claim 10 (depends on 9)

The lightweight LED light device of claim 9, wherein the heat sink puck is of aluminum, with the foamed metal matrix being aluminum and braised to the aluminum heat sink puck.

### Claim 11 (depends on 9)

The lightweight LED light device of claim 9, wherein the heat sink puck is of aluminum, with the foamed metal matrix being aluminum and thermally bonded to the aluminum heat sink puck using a low temperature ALUMALOY material.

### Claim 12 (depends on 1)

The lightweight LED light device of claim 1, wherein the outer diameter of the housing is no more than 40 mm, with a length of no more of 40 mm.

### Claim 13 (depends on 1)

The lightweight LED light device of claim 1, wherein the enclosure is sealed against dust and moisture, with a front protective window connected to the housing via an O-ring and threaded closure bezel.

### Claim 14 (depends on 1)

The lightweight LED light device of claim 1, wherein the housing includes an extruded metal exterior with cooling fins to increase cooling surface area.

### Claim 15 (depends on 1)

The lightweight LED light device of claim 1, wherein the foamed metal matrix has at least 20 pores per inch.

### Claim 16 (depends on 1)

The lightweight LED light device of claim 1, wherein the foamed metal heat sink is formed with sintered thermally conducted metal by a process of additive manufacturing, producing a lightweight open cell structure that maximizes surface area with minimal weight.

### Claim 17 (depends on 1)

The lightweight LED light device of claim 1, wherein the heat sink includes a heat sink puck thermally bonded into the housing by a low temperature solder.

### Claim 18 (depends on 17)

The lightweight LED light device of claim 17, wherein the heat sink puck and the housing are of aluminum, and the low temperature solder is an aluminum solder.

### Claim 19 (depends on 1)

The lightweight LED light device of claim 1, wherein the foamed metal matrix includes heat pipes thermally bonded within the matrix to aid in removing heat from the back of the heat sink and delivering the heat to areas of maximum air flow, including cooling efficiency.
