Thermal head
AssigneeSato Holdings Kabushiki Kaisha
InventorsKazuyuki Hoshi, Hiroshi Kokuta, Tatsuyuki Takahashi
Life of this patent
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Abstract
An embodiment of the present invention is a thermal head including: a heat dissipation plate having a first surface of a substantially rectangular shape in a plane view, and a second surface that is on an opposite side to the first surface; a board attached to the heat dissipation plat in such a manner as to extend from the first surface to the second surface, via a first end part interposed between the first surface and the second surface; a heating part having a plurality of heating elements, the heating part being disposed on the board over the first surface; and surface-mount devices mounted on the board over the second surface.
Claims17
A thermal head comprising:
- a heat dissipation plate having a first surface of a substantially rectangular shape in a plane view, and a second surface that is on an opposite side to the first surface;
- a board attached to the heat dissipation plat in such a manner as to extend from the first surface to the second surface, via a first end part interposed between the first surface and the second surface;
- a heating part having a plurality of heating elements, the heating part being disposed on the board over the first surface;
- and
- surface-mount devices mounted on the board over the second surface.
Dependencies are inferred from the claim text.