Long-term implantable electronic devices

Abstract

Provided is a long-term implantable electronic device comprising a first thermally oxidized laver from a first substrate, wherein the first thermally oxidized laver forms a first encapsulation laver; an electronic component supported by the first encapsulation laver, wherein the electronic component and the first encapsulation laver have an exposed surface relative to the first encapsulation laver; a barrier laver that covers the first encapsulation laver and the electronic component exposed surface; a second thermally oxidized layer from a second substrate, wherein the second thermally oxidized layer forms a second encapsulation laver, and the second encapsulation laver is in contact with the barrier layer. Each of the first and second encapsulation layers, the barrier layer, and the electronic component are flexible or bendable, so that the long-term implantable electronic device is configured to conformally contact with a curved biological surface.

Dependencies are inferred from the claim text.