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US 12,219,716 B2Granted
Coated electrical assembly
OwnerAndrew Simon Hall Brooks, Timothy Allan Von Werneinventors
Life of this patent
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Abstract
An electrical assembly which comprises a substrate and a conformal coating deposited on at least one surface of the substrate by plasma polymerization of a compound of formula (I) and deposition of a resulting polymer of the compound of formula (I), and plasma polymerization of a fluorohydrocarbon and deposition of a resulting polymer of the fluorohydrocarbon, such that the resulting polymer of the compound of formula (I) and the resulting polymer of the fluorohydrocarbon create discrete layers of the conformal coating; wherein the compound of formula (I) is an organic compound.
Claims10
A method for conformally coating an electrical assembly, the method comprising:
- plasma polymerization of a first compound of formula (1) and deposition of a resulting polymer of the first compound of formula (I) onto at least one surface of an electrical assembly, the electrical assembly comprising a substrate, a substrate surface, at least one conductive track, at least one electrical component, and a bond connection between the at least one conductive track and the at least one electrical component, and
- plasma polymerization of a first fluorocarbon and deposition of the resulting polymer of the first fluorocarbon onto the resulting polymer of the first compound of formula (1);
- wherein:
- R1 represents C1-C3 alkyl or C2-C3 alkenyl;
- R2 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl;
- R3 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl;
- R4 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl;
- R5 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl;
- and
- R6 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl;
- and
- wherein the resulting polymer comprising of the first compound of formula (I) has a thickness from 250 nanometers to 300 nanometers and the resulting polymer comprising of the first fluorocarbon has a thickness from 25 nanometers to 50 nanometers, wherein the polymer of the first compound of formula (I) comprises crosslinked structure and retains reactive sites, and wherein the resulting polymer is deposited onto the substrate surface, the at least one conductive track, the at least one electrical component, and the bond connection,
- wherein the resulting polymer is deposited onto a top side of the electrical component and further deposited on an underside of the electrical component opposite to the top side;
- and
- wherein the resulting polymer is deposited on the substrate below the electrical component.
12 more elements
A method for conformally coating an electrical assembly, the method comprising:
- plasma polymerization of a first fluorocarbon and deposition of a resulting polymer of the first fluorocarbon onto at least one surface of the
- electrical assembly, the electrical assembly comprising a substrate, a substrate surface, at least one conductive track, at least one electrical component, and a bond connection between the at least one conductive track and the at least one electrical component, and
- plasma polymerization of a first compound of formula (1) and deposition of a resulting polymer of the first compound of formula (J) onto the resulting polymer of the first fluorocarbon;
- wherein:
- R1 represents C1-C3 alkyl or C2-C3 alkenyl;
- R2 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl;
- R3 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl;
- R4 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl;
- R5 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl;
- and
- R6 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl;
- and
- wherein the resulting polymer consisting essentially of the first compound of formula (1) has a thickness from 250 nanometers to 300 nanometers and the resulting polymer consisting essentially of the first fluorohydrocarbon has a thickness from 25 nanometers to 50 nanometers, wherein the polymer of the first compound of formula (I) comprises crosslinked structure and retains reactive sites and wherein the resulting polymer is deposited onto the substrate surface the at least one conductive track, the at least one electrical component, and the bond connection, and
- wherein the resulting polymer is deposited onto a top side of the electrical component and further deposited on an underside of the electrical component opposite to the top side;
- and
- wherein the resulting polymer is deposited on the substrate below the electrical component.
13 more elements
Dependencies are inferred from the claim text.