# US 12,218,410 B2 · Electronic device including high-frequency transmission circuit

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,218,410 B2
- Document ID: US12218410B2
- Status: Granted
- Kind: B2
- Application number: 18/459,597
- Filed: 2023-09-01
- Published: 2023-12-21
- Granted: 2025-02-04
- Earliest claimed: 2016-06-13
- Assignees: Samsung Electronics Co., Ltd.
- Applicants: Samsung Electronics Co., Ltd.
- Inventors: Han-Min Cho; Chan-Gi Park; Yeon-Sang Yun; Tae-Wook Ham; Hei-Seong Kwak; Byoung-Il Son; Sung-Chul Park
- Web page: https://patentgrep.com/patent/US12218410B2

## CPC

- H01Q 1/243: {with built-in antennas}
- H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)}
- H01Q 5/35: using two or more simultaneously fed points
- H01Q 21/28: Combinations of substantially independent non-interacting antenna units or systems {(multiple beam H01Q25/00)}
- H01R 12/79: connecting to rigid printed circuits or like structures
- H01R 13/6691: {with built-in signalling means (H01R13/717 takes precedence)}
- H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)}
- H05K 1/0219: {Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors}
- H05K 1/0243: {Printed circuits associated with mounted high frequency components}
- H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)}
- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H05K 1/142: {Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit}
- H05K 1/148: {Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means}
- H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence)
- H05K 7/1427: {Housings}
- H05K 2201/09236: Parallel layout
- H05K 2201/09609: Via grid, i.e. two-dimensional array of vias or holes in a single plane
- H05K 2201/09618: Via fence, i.e. one-dimensional array of vias
- H05K 2201/09727: Varying width along a single conductor; Conductors or pads having different widths
- H05K 2201/0999: Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
- H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Disclosed is a portable communication device including a housing; a first PCB; a wireless communication circuitry disposed on the first PCB; and a second PCB having a plurality of layers including a first PCB portion; a second PCB portion extended from the first PCB portion and more flexible than the first PCB portion; a third PCB portion extended from the second PCB portion and less flexible than the second PCB portion; a fourth PCB portion extended from the third PCB portion and more flexible than the third PCB portion; and a plurality of lines formed at a same layer of the plurality of layers as extended from the second PCB portion through the third PCB portion to the fourth PCB portion, the plurality of lines including a first ground line and a second ground line, and a first signal line between the first and second ground lines.

## Claims

### Claim 1

A portable communication device, comprising:
a housing;
a first printed circuit board (PCB) accommodated in the housing;
a wireless communication circuitry disposed on the first PCB; and
a second PCB having a plurality of layers including:
a first PCB portion;
a second PCB portion continuously extended from the first PCB portion and more flexible than the first PCB portion;
a third PCB portion continuously extended from the second PCB portion and less flexible than the second PCB portion;
a fourth PCB portion continuously extended from the third PCB portion and more flexible than the third PCB portion; and
a plurality of lines formed at a same layer of the plurality of layers as continuously extended from the second PCB portion through the third PCB portion to the fourth PCB portion, the plurality of lines including a first ground line and a second ground line spaced apart from each other, and a first signal line located between the first ground line and the second ground line.

### Claim 2 (depends on 1)

The portable communication device of claim 1, wherein the housing includes a first conductive side portion forming a first portion of a side surface of the portable communication device and configured to operate as part of an antenna, and wherein the first signal line is electrically connected between the wireless communication circuit and the first conductive side portion.

### Claim 3 (depends on 2)

The portable communication device of claim 2, wherein the plurality of lines includes a second signal line located between the first signal line and the second ground line.

### Claim 4 (depends on 3)

The portable communication device of claim 3, wherein the housing includes a second conductive side portion forming a second portion of the side surface and configured to operate as part of another antenna, and wherein the second signal line is electrically connected between the wireless communication circuit and the second conductive side portion.

### Claim 5 (depends on 4)

The portable communication device of claim 4, wherein the first conductive side portion is configured to radiate a first signal corresponding to a first frequency band using a signal transmitted via the first signal line, and the second conductive side portion is configured to radiate a second signal corresponding to a second frequency band different from the first frequency band using another signal transmitted via the second signal line.

### Claim 6 (depends on 4)

The portable communication device of claim 4, wherein the second PCB includes a fifth PCB portion continuously extended from the fourth PCB portion and less flexible than the fourth PCB portion, and wherein the fifth PCB portion includes a first connecting portion and a second connection portion electrically connected with the first conductive side portion and the second conductive side portion, respectively.

### Claim 7 (depends on 1)

The portable communication device of claim 1, wherein the second PCB includes a fifth PCB portion continuously extended from the fourth PCB portion and less flexible than the fourth PCB portion, wherein the first PCB portion includes a first connecting portion electrically connected with the first PCB, and the fifth PCB portion includes a second connecting portion electrically connected with an antenna included in the portable communication device.

### Claim 8 (depends on 7)

The portable communication device of claim 7, wherein the first connecting portion is formed as a soldering pad.

### Claim 9 (depends on 7)

The portable communication device of claim 7, wherein the first connecting portion is formed as a connector including a plurality of connecting pins.

### Claim 10 (depends on 1)

The portable communication device of claim 1, wherein the third PCB portion includes a first conductive via and a second conductive via, and wherein the first ground line is electrically connected with a ground plate in another layer of the plurality of layers through the first conductive via, and the second ground line is electrically connected with the ground plate through the second conductive via.