# US 12,218,402 B2 · Device for securing and releasing a first module and a second module in a space > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,218,402 B2 - Document ID: US12218402B2 - Status: Granted - Kind: B2 - Application number: 17/643,634 - Filed: 2021-12-10 - Published: 2022-03-31 - Granted: 2025-02-04 - Earliest claimed: 2019-06-13 - Assignees: Huawei Technologies Co., Ltd. - Applicants: Huawei Technologies Co., Ltd. - Inventors: Niklas Lekselius; Stefan Bornholm - Web page: https://patentgrep.com/patent/US12218402B2 ## CPC - H01Q 1/12: Supports; Mounting means - H01Q 1/005: {Damping of vibrations; Means for reducing wind-induced forces} - H01R 11/22: End pieces terminating in a spring clip - H01R 13/627: Snap or like fastening - H01R 13/6275: {Latching arms not integral with the housing (H01R13/6276, H01R13/6277, H01R13/6278 take precedence)} - H05K 7/1401: {comprising clamping or extracting means (H05K7/10 takes precedence)} - H05K 7/2049: {Pressing means used to urge contact, e.g. springs} - H05K 7/20536: {for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment} - H05K 7/20945: {Thermal management, e.g. inverter temperature control} - H01R 13/62: Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement - H05K 7/1402: {for securing or extracting printed circuit boards} - H05K 7/1405: {by clips or resilient members, e.g. hooks} - H05K 7/20: Modifications to facilitate cooling, ventilating, or heating - H05K 7/20381: {Thermal management, e.g. evaporation control} - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - H05K 7/20436: {Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing} - H05K 7/206: {Air circulating in closed loop within cabinets wherein heat is removed through air-to-air heat-exchanger} - H05K 7/207: {Thermal management, e.g. cabinet temperature control} - H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract The disclosure relates to a device for securing a first module and a second module in a space between a first mount and a second mount. The device comprises a biasing apparatus configured to urge the first module and the second module away from each other, thereby urging the first module against the first mount and urging the second module against the second mount. Further, the device comprises a release apparatus configured to move the first module and the second module toward each other, thereby moving the first module away from the first mount and moving the second module away from the second mount. The device provides an uncomplicated and flexible mounting and demounting of the first module and second module, thus attaining a flexible and uncomplicated attachment of each module to the respective mount and a flexible and uncomplicated detachment of each module from the respective mount. ## Claims ### Claim 1 A device for securing a first module and a second module in a space between a first mount and a second mount, the device comprising: a biasing apparatus to urge the first module and the second module away from each other, wherein the first module is to be urged against the first mount and the second module is to be urged against the second mount; and a release apparatus for moving the first module and the second module toward each other, wherein the first module is to be moved away from the first mount and the second module is to be moved away from the second mount. ### Claim 2 (depends on 1) The device according to claim 1, wherein the first module has a first contact surface configured to abut against the first mount, wherein the second module has a second contact surface configured to abut against the second mount, and wherein the release apparatus is configured such that when first module and the second module are moved toward each other a distance between the first contact surface and the second contact surface is less than a distance between the first mount and the second mount. ### Claim 3 (depends on 1) The device according to claim 1, wherein the release apparatus comprises a core unit located at least partly between the first module and the second module, wherein the first module and the second module are attached to the core unit and movable in relation to the core unit, and wherein the release apparatus comprises a grip attached to the core unit and configured to move the core unit, which is to move the first module and the second module in relation to the core unit. ### Claim 4 (depends on 3) The device according to claim 3, wherein the device comprises a fixing element, wherein the core unit is movable in relation to the fixing element, wherein the first module and the second module are movable in relation to the fixing element, and wherein the grip is movable in relation to the fixing element. ### Claim 5 (depends on 2) The device according to claim 2, wherein the release apparatus comprises one or more core guides, wherein each core guide has a longitudinal extension and a core guide member movable in the core guide, wherein the core guide is configured to hold and guide the core guide member, and wherein the release apparatus is configured to move the first module and the second module in relation to each other by moving the core guide member along the longitudinal extension of the core guide. ### Claim 6 (depends on 5) The device according to claim 5, wherein the longitudinal extension of the core guide forms an acute angle with the first contact surface and the second contact surface. ### Claim 7 (depends on 5) The device according to claim 5, wherein the core guide comprises a groove having the longitudinal extension, wherein the core guide member is configured to engage the groove and is movable in the groove, and wherein the release apparatus is configured to move the first module and the second module in relation to each other by moving the core guide member along the longitudinal extension of the groove. ### Claim 8 (depends on 1) The device according to claim 1, wherein the biasing apparatus comprises one or more compression springs, and wherein when the first module and the second module are moved toward each other by the release apparatus the release apparatus is to compress the one or more compression springs such that the one or more compression springs are more compressed compared to when the first module is urged against the first mount and the second module is urged against the second mount. ### Claim 9 (depends on 1) The device according to claim 1, wherein the first module comprises a first heat source, and wherein the first module is configured to transfer heat from the first heat source to the first mount when the first module is urged against the first mount. ### Claim 10 (depends on 9) The device according to claim 9, wherein the first module comprises a first heat sink thermally coupled to the first heat source and configured to abut against the first mount. ### Claim 11 (depends on 9) The device according to claim 9, wherein the second module comprises a second heat source, and wherein the second module is configured to transfer heat from the second heat source to the second mount when the second module is urged against the second mount. ### Claim 12 (depends on 11) The device according to claim 11, wherein the second module comprises a second heat sink thermally coupled to the second heat source and configured to abut against the second mount. ### Claim 13 (depends on 11) The device according to claim 11, wherein at least one of the first module and the second module comprises a printed circuit board, and wherein the printed circuit board comprises at least one of the first heat source and the second heat source. ### Claim 14 An arrangement, comprising: a device; a first mount; a second mount; and a third heat sink thermally coupled to the first mount, wherein the first mount and the second mount define a space which is configured to receive and hold the device, wherein the device comprises: a biasing apparatus for urging a first module and a second module away from each other, wherein the first module is to be urged against the first mount and the second module is to be urged against the second mount, and a release apparatus for moving the first module and the second module toward each other, wherein the first module is to be moved away from the first mount and the second module is to be moved away from the second mount. ### Claim 15 (depends on 14) The arrangement according to claim 14, further comprising: a fourth heat sink thermally coupled to the second mount. ### Claim 16 (depends on 15) The arrangement according to claim 15, further comprising: a housing, wherein the housing comprises the first mount, the second mount, and at least one of the third heat sink and the fourth heat sink, and wherein the housing houses the device in the space. ### Claim 17 (depends on 14) The arrangement according to claim 14, wherein the first module has a first contact surface configured to abut against the first mount, wherein the second module has a second contact surface configured to abut against the second mount, and wherein the release apparatus is configured such that when the first module and the second module are moved toward each other a distance between the first contact surface and the second contact surface is less than a distance between the first mount and the second mount. ### Claim 18 A network access node for a wireless communication system, wherein the network access node comprises an arrangement, where the arrangement comprises: a device; a first mount; a second mount; and a third heat sink thermally coupled to the first mount, wherein the first mount and the second mount define a space which is configured to receive and hold the device, where the device comprises: a biasing apparatus for urging a first module and a second module away from each other, wherein the first module is urged against the first mount and the second module is to be urged against the second mount, and a release apparatus for moving the first module and the second module toward each other, wherein the first module is to be moved away from the first mount and the second module is to be moved away from the second mount. ### Claim 19 (depends on 18) The network access node according to claim 18, wherein the network access node further comprises: a fourth heat sink thermally coupled to the second mount. ### Claim 20 (depends on 19) The network access node according to claim 19, wherein the network access node further comprises: a housing wherein the housing comprises the first mount, the second mount, and at least one of the third heat sink and the fourth heat sink, and wherein the housing houses the device in the space.