# US 12,218,301 B2 · Manufacturing method of electronic device

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- Number: US 12,218,301 B2
- Document ID: US12218301B2
- Status: Granted
- Kind: B2
- Application number: 18/413,033
- Filed: 2024-01-16
- Published: 2024-05-09
- Granted: 2025-02-04
- Earliest claimed: 2020-08-14
- Assignees: AUO Corporation
- Applicants: AUO Corporation
- Inventors: Chih-Wen Lu; Hao-An Chuang; Chun-Yueh Hou
- Web page: https://patentgrep.com/patent/US12218301B2

## CPC

- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- G09G 3/32: semiconductive, e.g. using light-emitting diodes [LED]
- H10H 20/01: Manufacture or treatment
- H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout}
- G09G 2300/0426: Layout of electrodes and connections
- H10H 20/0364: {of interconnections}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- G09G: ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION (arrangements for transferring data between digital computers and displays G06F3/14; static indicating arrangements comprising an association of a number of separate sources or light control cells G09F9/00; static indicating arrangements comprising integral associations of a number of light sources H01J, H01K, H10H, H05B33/12; scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission, details thereof H04N1/00)

## Abstract

A manufacturing method of an electronic device includes: forming a conductive material layer on a substrate, the conductive material layer continuously extends from a first surface of the substrate to a second surface while passing through a side surface, wherein the side surface connects the first surface and the second surface, forming a first protection layer on the conductive material layer and patterning the conductive material layer by using the first protection layer as a mask to form an edge wire, wherein the edge wire is retracted relative to the first protection layer and forms an undercut structure, and forming a second protection layer on the substrate, wherein the second protection layer fills the undercut structure.

## Claims

### Claim 1

A manufacturing method of an electronic device, comprising:
forming a conductive material layer on a substrate, the conductive material layer continuously extends from a first surface of the substrate to a second surface while passing through a side surface, wherein the side surface connects the first surface and the second surface;
forming a first protection layer on the conductive material layer and patterning the conductive material layer by using the first protection layer as a mask to form an edge wire, wherein the edge wire is retracted relative to the first protection layer and forms an undercut structure; and
forming a second protection layer on the substrate, wherein the second protection layer fills the undercut structure.

### Claim 2 (depends on 1)

The manufacturing method of the electronic device according to claim 1, wherein the first protection layer is formed on the conductive material layer by transfer printing.

### Claim 3 (depends on 1)

The manufacturing method of the electronic device according to claim 1, further comprising:
forming a driving circuit structure on the substrate and covering at least a portion of the driving circuit structure with a release protection layer before forming the conductive material layer.

### Claim 4 (depends on 3)

The manufacturing method of the electronic device according to claim 3, further comprising:
removing the release protection layer after the second protection layer is formed.

### Claim 5 (depends on 1)

The manufacturing method of the electronic device according to claim 1, wherein the second protection layer is formed on the substrate by dipping, spraying, coating, or transfer printing.

### Claim 6 (depends on 1)

The manufacturing method of the electronic device according to claim 1, wherein forming the second protection layer comprises performing a plurality of printing steps, and a plurality of transfer printing patterns of the plurality of printing steps at least partially overlap.

### Claim 7 (depends on 1)

The manufacturing method of the electronic device according to claim 1, wherein patterning the conductive material layer comprises an isotropic etching method.

### Claim 8 (depends on 1)

The manufacturing method of the electronic device according to claim 1, wherein an etchant for patterning the conductive material layer has selectivity with regards to the conductive material layer and the first protection layer.