# US 12,218,293 B2 · Pixel module employing molding member having multi-molding layer and displaying apparatus having the same

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- Number: US 12,218,293 B2
- Document ID: US12218293B2
- Status: Granted
- Kind: B2
- Application number: 17/666,202
- Filed: 2022-02-07
- Published: 2022-08-18
- Granted: 2025-02-04
- Earliest claimed: 2021-02-18
- Assignees: Seoul Viosys Co., Ltd.
- Applicants: Seoul Viosys Co., Ltd.
- Inventors: Junhong Min; Ik Kyu You
- Web page: https://patentgrep.com/patent/US12218293B2

## CPC

- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10H 29/30: Active-matrix LED displays
- H10H 29/855: Optical field-shaping means, e.g. lenses
- H10H 29/8552: {Light absorbing arrangements, e.g. black matrix}
- H10W 90/00: Package configurations
- G02F 1/133603: {with LEDs}
- H10H 20/0363: {of optical field-shaping means}
- H10H 29/854: characterised by their material, e.g. epoxy or silicone resins
- H10H 29/882: {Scattering means}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS

## Abstract

A pixel module includes a circuit board, a plurality of unit pixels arranged on the circuit board, and a molding member covering the plurality of unit pixels. The molding member includes a light diffusion layer and a black molding layer covering the light diffusion layer.

## Claims

### Claim 1

A pixel module, comprising:
a circuit board;
unit pixels arranged on the circuit board; and
a molding layer covering the unit pixels,
wherein the molding layer includes a light diffusion layer and a black molding layer covering the light diffusion layer such that the molding layer is disposed between the unit pixels, and
wherein the light diffusion layer comprises a first region having a first thickness and disposed between the unit pixels and the black molding layer comprises a second region having a second thickness and disposed on the light diffusion layer, the second thickness being smaller than the first thickness, and
wherein a maximum value of Δu′v′ that is indicative of color deviation of the pixel module and in a range of +−45 degree is equal to or less than 0.01.

### Claim 2 (depends on 1)

The pixel module of claim 1,
wherein the light diffusion layer includes a transparent matrix having light diffusion particles dispersed therein and the light diffusion particles include silica or TiO2 particles.

### Claim 3 (depends on 1)

The pixel module of claim 1,
wherein the black molding layer includes a light absorbing material in a matrix.

### Claim 4 (depends on 3)

The pixel module of claim 3,
wherein the light absorbing material include carbon black.

### Claim 5 (depends on 4)

The pixel module of claim 4,
wherein the carbon black is coated on surfaces of organic or inorganic particles dispersed in the matrix of the black molding layer.

### Claim 6 (depends on 5)

The pixel module of claim 5,
wherein the inorganic particles dispersed in the matrix of the black molding layer include silica or TiO2.

### Claim 7 (depends on 3)

The pixel module of claim 3,
wherein the black molding layer includes a plurality of layers having different concentrations of the light absorbing material.

### Claim 8 (depends on 7)

The pixel module of claim 7,
wherein the plurality of layers further includes a first layer and a second layer, and
the first layer having a higher concentration of light absorbing material than the second layer and the second layer is disposed further apart from the light diffusion layer than the first layer is.

### Claim 9 (depends on 3)

The pixel module of claim 3,
wherein a concentration of the light absorbing material in the black molding layer is gradually decreased from the light diffusion layer in a thickness direction of the black molding layer.

### Claim 10 (depends on 1)

The pixel module of claim 1, wherein:
the molding layer further includes a transparent molding layer on which the light diffusion layer is disposed and the black molding layer is disposed on the light diffusion layer; and
the transparent molding layer is further disposed between the unit pixels and the light diffusion layer.

### Claim 11 (depends on 10)

The pixel module of claim 10, wherein:
the light diffusion layer and the black molding layer are disposed in an upper region of two neighboring unit pixels among the unit pixels and in a region between the two neighboring unit pixels; and
the light diffusion layer and the black molding layer in the upper region are configured to be thinner than the light diffusion layer and the black molding layer in the region between the two neighboring unit pixels.

### Claim 12 (depends on 1)

The pixel module of claim 1,
wherein a unit pixel of the unit pixels comprises at least three light emitting devices disposed adjacent to one another and the at least three light emitting devices are arranged side by side.

### Claim 13 (depends on 12)

The pixel module of claim 12,
wherein the unit pixel of the unit pixels further comprises a step adjustment layer disposed between the at least three light emitting devices.

### Claim 14 (depends on 1)

The pixel module of claim 1,
wherein a thickness of the light diffusion layer, a thickness of the black molding layer, or both thicknesses of the light diffusion layer and the black molding layer vary along a lateral direction of the circuit board.

### Claim 15 (depends on 14)

The pixel module of claim 14,
wherein the black molding layer is arranged in an upper region of a selected unit pixel of the unit pixels and in a region between the selected unit pixel and a neighboring unit pixel, and the thickness of the black molding layer is smaller than the black molding layer arranged in the region between the selected unit pixel and the neighboring unit pixel.

### Claim 16 (depends on 15)

The pixel module of claim 15, further comprising:
a protection layer; and
a plurality of connection electrodes; and
wherein an upper surface of the protection layer and upper surfaces of the plurality of connection electrodes are flush with one another.

### Claim 17 (depends on 1)

The pixel module of claim 1,
wherein the molding layer has a thickness within a range of 50 μm to 400 μm.

### Claim 18 (depends on 1)

The pixel module of claim 1,
wherein the molding layer is formed through a vacuum lamination technique using a film including the light diffusion layer and the black molding layer.

### Claim 19

A display apparatus, comprising:
a panel substrate; and
pixel modules disposed on the panel substrate,
each of the pixel modules comprising:
a circuit board;
unit pixels arranged on the circuit board; and
a molding layer covering the unit pixels such that the molding layer is disposed between and on or above the unit pixels,
wherein the molding layer includes a light diffusion layer and a black molding layer the light diffusion layer comprising a first region having a first thickness that is disposed on one of the unit pixels and the black molding layer including a second region having a second thickness that is disposed between the unit pixels,
wherein the first thickness is greater than the second thickness, and
wherein a maximum value of Δu′v′ that is indicative of color deviation of a pixel module and in a range of +−45 degree is equal to or less than 0.01.

### Claim 20 (depends on 19)

The display apparatus of claim 19, wherein the molding layer has a thickness within a range between 50 μm and 400 μm.