# US 12,218,286 B2 · Light emitting module and method of manufacturing the same and display apparatus having the same

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- Number: US 12,218,286 B2
- Document ID: US12218286B2
- Status: Granted
- Kind: B2
- Application number: 17/524,607
- Filed: 2021-11-11
- Published: 2022-05-12
- Granted: 2025-02-04
- Earliest claimed: 2020-11-12
- Assignees: Seoul Semiconductor Co., Ltd.
- Applicants: Seoul Semiconductor Co., Ltd.
- Inventors: Jae Hyun Park; Seung Sik Hong
- Web page: https://patentgrep.com/patent/US12218286B2

## CPC

- H10H 20/8506: {Containers}
- H10H 29/842: {Coatings, e.g. passivation layers or antireflective coatings}
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10H 29/852: Encapsulations
- H10H 29/882: {Scattering means}
- H10W 90/00: Package configurations
- G02B 1/11: Anti-reflection coatings
- H10H 20/0363: {of optical field-shaping means}
- H10H 29/853: characterised by their shape
- H10H 29/854: characterised by their material, e.g. epoxy or silicone resins
- H10H 29/8552: {Light absorbing arrangements, e.g. black matrix}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

## Abstract

A light emitting module including a circuit board, a plurality of unit pixels arranged on the circuit board, a molding member covering the unit pixels, and an anti-glare layer disposed on the molding member, in which the molding member includes a first molding layer at least partially covering each of the unit pixels, and a second molding layer covering the first molding layer.

## Claims

### Claim 1

A light emitting module, comprising:
a circuit board;
a plurality of unit pixels arranged on the circuit board;
a molding layer covering the unit pixels; and
an anti-glare layer disposed on the molding layer,
wherein the molding layer includes a first molding layer at least partially covering each of the unit pixels, and a second molding layer covering the first molding layer, and
wherein the first molding layer located on a side surface of at least one of the plurality of unit pixels forms a sidewall including a region that increases in thickness along the side surface from an upper portion toward a lower portion of the at least one of the plurality of unit pixels.

### Claim 2 (depends on 1)

The light emitting module of claim 1, wherein:
the first molding layer includes a black molding layer; and
the second molding layer includes a transparent molding layer.

### Claim 3 (depends on 2)

The light emitting module of claim 2, wherein:
the first molding layer covers a side surface and an upper surface of each of the unit pixels; and
the second molding layer is disposed over the first molding layer.

### Claim 4 (depends on 2)

The light emitting module of claim 2, wherein:
the first molding layer at least partially covers a side surface of the unit pixel,
the second molding layer covers the first molding layer, and
the first molding layer has a concave shape in a region between the unit pixels.

### Claim 5 (depends on 4)

The light emitting module of claim 4, wherein a region of the second molding layer is disposed between the unit pixels.

### Claim 6 (depends on 4)

The light emitting module of claim 4, wherein:
the first molding layer covers upper surfaces of the unit pixels, and
the first molding layer located on the unit pixels has a convex shape.

### Claim 7 (depends on 1)

The light emitting module of claim 1, wherein an upper surface profile of the second molding layer is substantially the same as a surface profile of the circuit board.

### Claim 8 (depends on 1)

The light emitting module of claim 1, wherein:
an upper surface of the circuit board is non-planar; and
each of the first molding layer and the second molding layer has a flat upper surface.

### Claim 9 (depends on 1)

The light emitting module of claim 1, further comprising an anti-reflection layer disposed between the molding layer and the anti-glare layer.

### Claim 10 (depends on 1)

The light emitting module of claim 1, further comprising a hardness enhancement layer disposed between the molding layer and the anti-glare layer.

### Claim 11

A display apparatus, comprising:
a panel substrate; and
a plurality of light emitting modules arranged on the panel substrate, each of the light emitting modules comprising:
a circuit board;
a plurality of unit pixels arranged on the circuit board;
a molding layer covering the unit pixels; and
an anti-glare layer disposed on the molding layer,
wherein the molding layer includes a first molding layer at least partially covering each of the unit pixels, and a second molding layer covering the first molding layer, and
wherein the first molding layer located on a side surface of at least one of the plurality of unit pixels forms a sidewall including a region that increases in thickness along the side surface from an upper portion toward a lower portion of the at least one of the plurality of unit pixels.