ULED chip, uLED substrate and method for manufacturing the same, el inspection method for uLED substrate, and el inspection apparatus

Abstract

A micro light-emitting diode (μLED) chip includes a first electrode layer, a second semiconductor layer located on a surface of the first electrode layer, and a first semiconductor layer located on a side of the second semiconductor layer away from the first electrode layer, and a light-emitting layer located between the first semiconductor layer and the second semiconductor layer. The second semiconductor is electrically connected to the first electrode layer, and is configured to transmit first carriers. The first semiconductor layer is configured to transmit second carriers. The light-emitting layer is configured to be excited to emit light upon combination of the first carriers and the second carriers. A surface of the first semiconductor layer away from the light-emitting layer is a concave-convex microstructure, and convex portions of the concave-convex microstructure are configured to receive an electron beam.

Dependencies are inferred from the claim text.