Semiconductor device, display apparatus, and manufacturing method of semiconductor device

A method of manufacturing a semiconductor device, the semiconductor device including

• a conductive resin layer that includes an insulating resin and a plurality of first fillers dispersed in the insulating resin and has a first main surface and a second main surface on a side opposite to the first main surface, and
• an element layer that is arranged on a first-main-surface side of the conductive resin layer and includes a semiconductor element,
• the method comprising:
• forming the conductive resin layer by die coating using a die head;
• and
• forming the element layer, wherein
• the die head has an opening whose gap dimension is equal to or larger than 100 μm but equal to or smaller than 500 μm,
• each of the plurality of first fillers is a fibrous conductive filler,
• the conductive resin layer has
• a first surface layer section that includes the first main surface of the conductive resin layer and has a thickness which is 30% of a thickness of the conductive resin layer,
• a second surface layer section that includes the second main surface of the conductive resin layer and has a thickness which is 30% of the thickness of the conductive resin layer, and
• an intermediate layer section arranged between the first surface layer section and the second surface layer section, and,
• among the plurality of first fillers, first fillers arranged in the first surface layer section have a directional angle relative to the first main surface which is smaller than a directional angle of first fillers arranged in the intermediate layer section.