# US 12,218,165 B2 · Semiconductor image sensor and method of manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,218,165 B2 - Document ID: US12218165B2 - Status: Granted - Kind: B2 - Application number: 17/351,228 - Filed: 2021-06-18 - Published: 2022-12-22 - Granted: 2025-02-04 - Earliest claimed: 2021-06-18 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Company Ltd. - Inventors: Min-Feng Kao; Dun-Nian Yaung; Jen-Cheng Liu; Hsing-Chih Lin; Che-Wei Chen - Web page: https://patentgrep.com/patent/US12218165B2 ## CPC - H10F 39/807: {Pixel isolation structures} - H10F 39/024: {of coatings or optical elements} - H10F 39/8067: {Reflectors} - H10F 39/811: {Interconnections} - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION ## Abstract An image sensor includes a substrate including a first surface and a second surface opposite to the first surface; a plurality of pixel sensors disposed in the substrate, a sensor isolation feature disposed in the substrate defining an active region, and a dielectric layer between the sensor isolation feature and the substrate, wherein the sensor isolation feature comprises a conductive material. ## Claims ### Claim 1 An image sensor, comprising: a substrate comprising a first surface and a second surface opposite to the first surface; a plurality of pixel sensors disposed in the substrate; a sensor isolation feature disposed in the substrate defining an active region; a dielectric layer between the sensor isolation feature and the substrate; a periphery connecting feature disposed in the substrate at a periphery region outside the active region; and a conductive grid disposed on the second surface and over the sensor isolation feature, wherein the sensor isolation feature comprises a conductive material, wherein the dielectric layer is disposed in a bottom of the sensor isolation feature and is inserted into an isolation region disposed in the substrate, and wherein a portion of the isolation region is present between the dielectric layer disposed in the bottom of the sensor isolation feature and the first surface of the substrate, wherein the conductive grid connects the sensor isolation feature to the periphery connecting feature, and wherein the periphery connecting feature penetrates through the first surface of the substrate, an etch stop layer formed on the first surface of the substrate, and an inter-layer dielectric layer formed on the etch stop layer. ### Claim 2 (depends on 1) The image sensor according to claim 1, wherein the periphery connecting feature comprises the conductive material of the sensor isolation feature. ### Claim 3 (depends on 1) The image sensor according to claim 1, wherein the conductive grid exposes the plurality of pixel sensors. ### Claim 4 (depends on 1) The image sensor according to claim 1, wherein the periphery connecting feature extends through the substrate to contact with an interconnect feature disposed on the inter-layer dielectric layer. ### Claim 5 (depends on 1) The image sensor according to claim 1, wherein the sensor isolation feature has a first depth and the plurality of pixel sensors have a pixel depth, and wherein the first depth is deeper than the pixel depth. ### Claim 6 (depends on 1) The image sensor of claim 1, wherein the sensor isolation feature is formed adjacent to the second surface of the substrate. ### Claim 7 (depends on 6) The image sensor of claim 6, wherein a portion of the sensor isolation feature is within the isolation region. ### Claim 8 (depends on 1) The image sensor according to claim 1, wherein the dielectric layer comprises one or more dielectric films. ### Claim 9 (depends on 1) The image sensor of claim 1, wherein the sensor isolation feature includes a conductive material. ### Claim 10 An image sensor, comprising: a substrate comprising a first surface and a second surface opposite to the first surface; a sensor isolation feature disposed within the substrate extending from the second surface toward the first surface; a periphery connecting feature disposed within the substrate extending from the second surface of the substrate; a dielectric layer disposed over sidewalls and a bottom of the sensor isolation feature and sidewall of the periphery connecting feature; and a conductive grid disposed on the second surface and over the sensor isolation feature, wherein the dielectric layer is disposed in the bottom of the sensor isolation feature and is inserted into an isolation region disposed in the substrate, wherein a portion of the isolation region is present between the dielectric layer disposed in the bottom of the sensor isolation feature and the first surface of the substrate, wherein the conductive grid connects the sensor isolation feature to the periphery connecting feature, and wherein the periphery connecting feature penetrates through the first surface of the substrate, an etch stop layer formed on the first surface of the substrate, and an inter-layer dielectric layer formed on the etch stop layer. ### Claim 11 (depends on 10) The image sensor according to claim 10, wherein the sensor isolation feature is electrically connected to the periphery connecting feature. ### Claim 12 (depends on 10) The image sensor according to claim 10, wherein a width of the periphery connecting feature is larger than a width of the sensor isolation feature. ### Claim 13 (depends on 10) The image sensor according to claim 10, wherein a portion of the sensor isolation feature is within the isolation region. ### Claim 14 (depends on 10) The image sensor according to claim 10, wherein the dielectric layer comprises one or more dielectric films. ### Claim 15 (depends on 10) The image sensor of claim 10, wherein the sensor isolation feature includes a conductive material. ### Claim 16 An image sensor, comprising: a substrate comprising a first surface and a second surface opposite to the first surface; a sensor isolation feature disposed within the substrate extending from the second surface toward the first surface, wherein the sensor isolation feature has a first depth; a periphery connecting feature disposed within the substrate extending from the second surface of the substrate, wherein the periphery connecting feature has a second depth; a dielectric layer disposed over sidewalls and a bottom of the sensor isolation feature and sidewall of the periphery connecting feature; and a conductive grid disposed on the second surface and over the sensor isolation feature, wherein the first depth is smaller than the second depth, wherein the dielectric layer is disposed in the bottom of the sensor isolation feature and is inserted into an isolation region disposed in the substrate, wherein a portion of the isolation region is present between the dielectric layer disposed in the bottom of the sensor isolation feature and the first surface of the substrate, wherein the conductive grid connects the sensor isolation feature to the periphery connecting feature, and wherein the periphery connecting feature penetrates through the first surface of the substrate, an etch stop layer formed on the first surface of the substrate, and an inter-layer dielectric layer formed on the etch stop layer. ### Claim 17 (depends on 16) The image sensor of claim 16, wherein the sensor isolation feature is electrically connected to the periphery connecting feature. ### Claim 18 (depends on 16) The image sensor of claim 16, wherein a width of the periphery connecting feature is larger than a width of the sensor isolation feature. ### Claim 19 (depends on 16) The image sensor of claim 16, wherein the sensor isolation feature includes a conductive material. ### Claim 20 (depends on 19) The image sensor of claim 19, wherein the conductive material comprises a metal, a metal alloy or a combination thereof.