# US 12,218,118 B2 · Electronic device

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- Number: US 12,218,118 B2
- Document ID: US12218118B2
- Status: Granted
- Kind: B2
- Application number: 18/508,255
- Filed: 2023-11-14
- Published: 2024-03-14
- Granted: 2025-02-04
- Earliest claimed: 2019-05-29
- Assignees: Innolux Corporation
- Applicants: InnoLux Corporation
- Inventors: Jui-Jen Yueh; Kuan-Feng Lee
- Web page: https://patentgrep.com/patent/US12218118B2

## CPC

- H10F 39/8053: {Colour filters}
- H10W 90/00: Package configurations
- H10D 86/441: {Interconnections, e.g. scanning lines}
- H10D 86/411: {characterised by materials, geometry or structure of the substrates}
- H10D 86/60: wherein the TFTs are in active matrices
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES

## Abstract

An electronic device is disclosed. The electronic device includes a substrate, a first conductive element disposed above the substrate, a transistor disposed above the first conductive element and the substrate, a first electronic unit disposed above the substrate and electrically connected to the transistor, a second electronic unit disposed above the substrate; and a connection electrode disposed above the first conductive element, the first conductive element is electrically connected to the first electronic unit and the second electronic unit through the connection electrode.

## Claims

### Claim 1

An electronic device, comprising:
a substrate;
a first conductive element disposed above the substrate;
a transistor disposed above the first conductive element and the substrate;
a first electronic unit disposed above the substrate and electrically connected to the transistor;
a second electronic unit disposed above the substrate; and
a connection electrode disposed above the first conductive element;
wherein the first conductive element is electrically connected to the first electronic unit and the second electronic unit through the connection electrode.

### Claim 2 (depends on 1)

The electronic device of claim 1, further an insulating layer disposed above the first conductive element, wherein the insulating layer comprises a plurality of openings, a portion of the first electronic unit (EU1) is disposed in one of the plurality of openings, and the connection electrode is disposed between the first conductive element and the insulating layer.

### Claim 3 (depends on 1)

The electronic device of claim 1, wherein in a top view of the electronic device, a projection area of the connection electrode to the substrate is located in a projection area of the first conductive element to substrate.

### Claim 4 (depends on 1)

The electronic device of claim 1, wherein in a top view of the electronic device, a size of the connection electrode is less than a size of the first conductive element.

### Claim 5 (depends on 1)

The electronic device of claim 1, further comprising a second conductive element electrically connected to the first electronic unit, wherein the transistor is disposed above the second conductive element.

### Claim 6 (depends on 5)

The electronic device of claim 5, wherein the first conductive element transmits a voltage VSS, and the second conductive element transmits a voltage VDD.

### Claim 7 (depends on 1)

The electronic device of claim 1, wherein in a top view of the electronic device, the first conductive element and the connection electrode is disposed between the first electronic unit and the second electronic unit.

### Claim 8 (depends on 7)

The electronic device of claim 7, wherein the first conductive element transmits a constant voltage.

### Claim 9 (depends on 1)

The electronic device of claim 1, wherein the first electronic unit and the second electronic unit include diode, antenna units, sensor unit, light emitting unit, or display unit.

### Claim 10 (depends on 1)

The electronic device of claim 1, wherein the first electronic unit is in a sub-pixel, and the second electronic unit is in another sub-pixel.