# US 12,218,112 B2 · Method of forming light-emitting diodes with light coupling and conversion layers > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,218,112 B2 - Document ID: US12218112B2 - Status: Granted - Kind: B2 - Application number: 18/323,201 - Filed: 2023-05-24 - Published: 2023-11-02 - Granted: 2025-02-04 - Earliest claimed: 2018-08-09 - Assignees: Kateeva, Inc. - Applicants: Kateeva, Inc. - Inventors: Florian Pschenitzka - Web page: https://patentgrep.com/patent/US12218112B2 ## CPC - H10W 90/00: Package configurations - H10H 20/825: containing nitrogen, e.g. GaN - H10H 20/8513: {having two or more wavelength conversion materials} - H10H 20/8514: {characterised by their shape, e.g. plate or foil} - H10H 20/8516: {having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient} - H10H 20/0361: {of wavelength conversion means} - H10H 20/8515: {not being in contact with the bodies} - H10H 20/882: {Scattering means (H10H20/82 takes precedence)} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract Light-emitting sub-pixels and pixels for micro-light-emitting diode-based displays are provided. Also provided are methods of fabricating individual sub-pixels, pixels, and arrays of the pixels. The sub-pixels include a double-layered film that includes a coupling layer disposed over a light-emitting diode and a light-emission layer disposed over the coupling layer. ## Claims ### Claim 1 A method, comprising: forming a first confinement feature over a first light-emitting diode of a substrate; forming a first scattering layer comprising scattering particles over the first light-emitting diode; forming a red light-emission layer comprising red-emitting particles and scattering particles over the first scattering layer; forming a second confinement feature over a second light-emitting diode of the substrate; forming a second scattering layer comprising scattering particles over the second light-emitting diode; and forming a green light-emission layer comprising green-emitting particles and scattering particles over the second scattering layer. ### Claim 2 (depends on 1) The method of claim 1, wherein at least one of the first scattering layer, the red light-emission layer, the second scattering layer, and the green light-emission layer is formed using inkjet printing. ### Claim 3 (depends on 1) The method of claim 1, wherein each of the first light-emitting diode and the second light-emitting diode is a gallium nitride-based light-emitting diode integrated into the substrate. ### Claim 4 (depends on 1) The method of claim 1, wherein each of the first light-emitting diode and the second light-emitting diode is a blue light-emitting diode. ### Claim 5 (depends on 1) The method of claim 1, wherein each of the first light-emitting diode and the second light-emitting diode is an ultraviolet light-emitting diode. ### Claim 6 (depends on 5) The method of claim 5, further comprising: forming a third confinement feature over a third light-emitting diode of the substrate; forming a coupling layer over the third-light emitting diode; and forming a blue light-emission layer comprising blue-emitting particles and scattering particles over the coupling layer. ### Claim 7 (depends on 6) The method of claim 6, wherein the first scattering layer forms a curved interface with the red light-emission layer, the second scattering layer forms a curved interface with the green light-emission layer, the coupling layer forms a curved interface with the blue light-emission layer, or a combination thereof. ### Claim 8 (depends on 1) The method of claim 1, further comprising forming a protective layer over the red light-emission layer and the green light-emission layer. ### Claim 9 (depends on 1) A method of forming a color conversion display device, the method comprising forming a plurality of pixels on a display device substrate using the method of claim 1. ### Claim 10 A method of forming a display, the method comprising: forming a plurality of pixels on a semiconductor substrate each pixel comprising a red sub-pixel, a green sub-pixel, and a blue sub-pixel, and each pixel formed by: forming a first light-emitting diode, a second light-emitting diode, and a third light-emitting diode on the semiconductor substrate; forming a first confinement feature over the first light-emitting diode; forming a second confinement feature over the second light-emitting diode; forming a red light emission-layer comprising red-emitting particles and scattering particles over the first light-emitting diode to provide the red sub-pixel; forming a green light emission layer comprising green-emitting particles and scattering particles over the second light-emitting to provide the green sub-pixel; and forming a blue light emission layer comprising blue light-emitting particles and scattering particles over the third light-emitting to provide the blue sub-pixel. ### Claim 11 (depends on 10) The method of claim 10, wherein each of the first, second, and third light-emitting diodes is a gallium nitride-based light-emitting diode integrated into the substrate. ### Claim 12 (depends on 10) The method of claim 10, wherein the green sub-pixels have emission surface areas that are larger than emission surface areas of the red sub-pixels and the emission surface areas of the blue sub-pixels. ### Claim 13 (depends on 10) The method of claim 10, wherein at least one of the red light-emission layer, the green light-emission layer, and the blue light-emission layer is formed using inkjet printing. ### Claim 14 A method, comprising: forming a first confinement feature over a first light-emitting diode of a substrate; forming a first scattering layer comprising scattering particles over the first light-emitting diode; forming a red light-emission layer comprising red-emitting quantum dots and scattering particles over the first scattering layer, the red-emitting quantum dots having a graded concentration in at least a portion of the red light-emission layer; forming a second confinement feature over a second light-emitting diode of the substrate; forming a second scattering layer comprising scattering particles over the second light-emitting diode; and forming a green light-emission layer comprising green-emitting quantum dots and scattering particles over the second scattering layer, the green-emitting quantum dots having a graded concentration in at least a portion of the green light-emission layer. ### Claim 15 (depends on 14) The method of claim 14, wherein at least one of the red light-emission layer and the green light-emission layer is formed using inkjet printing. ### Claim 16 (depends on 14) The method of claim 14, wherein each of the first light-emitting diode and the second light-emitting diode is a gallium nitride-based light-emitting diode integrated into the substrate. ### Claim 17 (depends on 14) The method of claim 14, wherein each of the first light-emitting diode and the second light-emitting diode is a blue light-emitting diode. ### Claim 18 (depends on 14) The method of claim 14, wherein each of the first light-emitting diode and the second light-emitting diode is an ultraviolet light-emitting diode. ### Claim 19 (depends on 18) The method of claim 18, further comprising: forming a third confinement feature over the third light-emitting diode; and forming a blue light-emission layer comprising scattering particles over the third light-emitting diode. ### Claim 20 (depends on 14) The method of claim 14, further comprising forming a protective layer over the red light-emission layer and the green light-emission layer.