# US 12,218,101 B2 · Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,218,101 B2
- Document ID: US12218101B2
- Status: Granted
- Kind: B2
- Application number: 17/697,141
- Filed: 2022-03-17
- Published: 2022-06-30
- Granted: 2025-02-04
- Earliest claimed: 2019-06-13
- Assignees: Micron Technology, Inc.
- Applicants: Micron Technology, Inc.
- Inventors: Owen R. Fay; Chan H. Yoo; Mark E. Tuttle
- Web page: https://patentgrep.com/patent/US12218101B2

## CPC

- H10W 90/00: Package configurations
- H10W 20/425: {Barrier, adhesion or liner layers}
- H10W 72/0198: {batch processes}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 74/014: {using batch processing}
- H10W 74/137: {the encapsulations being directly on the semiconductor body (H10W74/134 takes precedence)}
- H10W 70/652: Cross-sectional shapes
- H10W 70/6528: {of the portions that connect to chips, wafers or package parts}
- H10W 72/01: {Manufacture or treatment}
- H10W 72/01323: {in liquid form, e.g. by dispensing droplets or by screen printing}
- H10W 72/01336: {in solid form, e.g. by using a powder or by laminating a foil}
- H10W 72/072: {of bump connectors}
- H10W 72/07255: {changes in materials}
- H10W 72/073: {of die-attach connectors}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/242: {relative to the surface, e.g. recessed, protruding}
- H10W 72/251: {Materials}
- H10W 72/29: Bond pads specially adapted therefor
- H10W 72/9415: {relative to the surface, e.g. recessed, protruding}
- H10W 90/20: Configurations of stacked chips
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Semiconductor device packages and associated assemblies are disclosed herein. In some embodiments, the semiconductor device package includes a substrate having a first side and a second side opposite the first side, a first metallization layer positioned at the first side of the substrate, and a second metallization layer in the substrate and electrically coupled to the first metallization layer. The semiconductor device package further includes a metal bump electrically coupled to the first metallization layer and a divot formed at the second side of the substrate and aligned with the metal bump. The divot exposes a portion of the second metallization layer and enables the portion to electrically couple to another semiconductor device package.

## Claims

### Claim 1

A semiconductor device package, comprising:
a semiconductor substrate having an active side and a backside opposite the active side, the substrate including a metallization layer at least partially embedded in the substrate such that portions of the metallization layer remain uncovered by the substrate on both the active side and backside of the substrate,
wherein the backside of the substrate includes a divot defined by sidewalls, wherein a portion of the metallization layer is uncovered within the divot for providing an electrical connection between an external device and the metallization layer;
a dielectric layer over the semiconductor substrate, wherein portions of the dielectric layer is within the divot and on the sidewalls; and a metal bump located with the divot, protruding away from the backside, the metal bump directly contacting the metallization layer through the dielectric layer and including at least a pair of opposing peripheral surfaces that are separated from the portions of the dielectric layer on the sidewalls of the divot.

### Claim 2 (depends on 1)

The semiconductor device package of claim 1, wherein the substrate has a depth of 15 μm or less.

### Claim 3 (depends on 1)

The semiconductor device package of claim 1, wherein:
the metallization layer comprises a second metallization layer;
the substrate further includes a first metallization layer positioned closer to the active side than the backside and separated along a vertical distance from the second metallization layer;
the second metallization layer is electrically coupled directly to the first metallization layer without using a through-silicon via (TSV).

### Claim 4 (depends on 3)

The semiconductor device package of claim 3, wherein the first and second metallization layers are integrally connected to vertical extensions that are configured to provide one or more electrical connections across a thickness of the semiconductor substrate instead of the TSV, wherein the thickness is measured between opposing surfaces of the substrate.

### Claim 5 (depends on 3)

The semiconductor device package of claim 3, further comprising:
a passivation layer positioned at the active side of the substrate.

### Claim 6 (depends on 3)

The semiconductor device package of claim 3, wherein:
the semiconductor device package is a first package;
the metal bump is a first bump;
the portion of the metallization layer is configure to directly attach to a second bump that electrically connects the first package to a second package; and
the first and second packages comprising a stacked semiconductor assembly.

### Claim 7 (depends on 3)

The semiconductor device package of claim 3, further comprising a third metallization layer positioned between and electrically coupled to the first and second metallization layers.

### Claim 8 (depends on 1)

The semiconductor device package of claim 1, wherein the metal bump is configured to electrically couple the semiconductor device package to a circuit opposite the active side without using a through-silicon via (TSV).

### Claim 9 (depends on 8)

The semiconductor device package of claim 8, wherein:
the semiconductor device package is a first semiconductor device package;
the circuit opposite the active side is a second semiconductor package or a substrate attached facing the backside of the first semiconductor package; and
the metal bump is configured to electrically couple circuitry on the active side of the first semiconductor device package to the second semiconductor device package or the substrate.

### Claim 10 (depends on 1)

The semiconductor device package of claim 1, wherein the metal bump includes an indium metal bump.

### Claim 11

A semiconductor package assembly, comprising:
a base substrate having a base contact area;
a first metal bump contacting the base contact area; and
a semiconductor package stacked on the base substrate, the semiconductor package having
a metallization layer at least partially embedded in the semiconductor package with portions of the metallization layer uncovered by the semiconductor package, an active side facing the base substrate, the active side partially uncovering the metallization layer and including a package contact area contacting the first metal bump and electrically coupling the semiconductor package to the base substrate,
a back side opposite the active side, the backside having a divot, wherein a portion of the metallization layer is uncovered within the divot for electrically connecting the metallization layer to an external circuit,
a dielectric layer located over the semiconductor package, wherein a portion of the dielectric layer is within the divot, and
a second metal bump located within the divot, protruding away from the back side and directly contacting the metallization layer through the dielectric layer and including at least a pair of opposing peripheral surfaces that are separated from the portion of the dielectric layer within the divot.

### Claim 12 (depends on 11)

The semiconductor package assembly of claim 11, wherein:
the semiconductor package is a first package;
the metal bump is a first bump;
further comprising:
a second bump attached in the divot of the first package and contacting the metallization layer thereof, and
a second package stacked over the first package, wherein the second package is directly attached to the second bump and electrically coupled to the first package, the base substrate, or both through the second bump.

### Claim 13

A semiconductor package, comprising:
a semiconductor substrate having a mount-support side and a backside opposite the mount-support side, wherein one of the mount-support side and the mount-support side includes a divot defined by sidewalls;
a dielectric layer on the semiconductor, wherein portions of the dielectric layer are within the divot and on opposing sidewalls; and
a conductive structure embedded in the substrate and partially uncovered on both the mount-support side and backside of the substrate and between the portions of the dielectric layer on the opposing sidewalls, wherein the conductive structure is configured to provide electrical connection through a thickness of the substrate and includes
at least one vertical portion extending below the mount-support side and toward the backside;
a first layer integral with and extending away from the at least one vertical portion, wherein the first layer extends parallel to and below the mount-support side;
a second layer integral with and extending away from the at least one vertical portion, wherein the second layer is separate from and below the first layer and extends parallel to the first layer.

### Claim 14 (depends on 13)

The semiconductor package of claim 13, wherein the conductive structure has a shape characteristic of being formed during a back-end-of-line (BEOL) process.

### Claim 15 (depends on 13)

The semiconductor package of claim 13, wherein the conductive structure is configured to provide an electrical connection along a vertical direction through the substrate instead of or without using a Through-Silicon-Via (TSV).

### Claim 16 (depends on 13)

The semiconductor package of claim 13, wherein the semiconductor substrate includes a divot on the backside, wherein the second layer is exposed through the divot for connecting to external circuitry.

### Claim 17 (depends on 16)

The semiconductor package of claim 16, wherein:
the semiconductor package comprises a first package;
further comprising:
a metal bump attached to the first package in the divot, wherein the metal bump is directly connected to the exposed portion of the second layer of the first package; and
a second package stacked over the first package, wherein the second package is attached and electrically coupled to the metal bump.