# US 12,218,080 B2 · Package structure with reinforced element

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- Number: US 12,218,080 B2
- Document ID: US12218080B2
- Status: Granted
- Kind: B2
- Application number: 18/182,728
- Filed: 2023-03-13
- Published: 2023-07-13
- Granted: 2025-02-04
- Earliest claimed: 2020-08-06
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Shin-Puu Jeng; Po-Yao Lin; Shuo-Mao Chen; Chia-Hsiang Lin
- Web page: https://patentgrep.com/patent/US12218080B2

## CPC

- H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
- H10W 70/698: Semiconductor materials that are electrically insulating, e.g. undoped silicon
- H10P 72/74: {using temporarily an auxiliary support}
- H10W 44/601: {Capacitive arrangements (H10W44/20 takes precedence)}
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/095: {of vias therein}
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/635: {Through-vias}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/685: comprising multiple insulating layers
- H10W 74/016: {using moulds}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation}
- H10W 90/00: Package configurations
- H10P 72/7418: {of passive members, e.g. a chip mounting substrate}
- H10P 72/7424: {used as a support during the manufacture of self-supporting substrates}
- H10P 72/7436: {used to support a device or a wafer when forming electrical connections thereto}
- H10W 40/10: Arrangements for heating
- H10W 72/0198: {batch processes}
- H10W 72/072: {of bump connectors}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/353: {not comprising solid metals or solid metalloids, e.g. ceramics}
- H10W 72/354: {comprising polymers}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/733: {between laterally-adjacent chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A package structure is provided. The package structure includes a reinforced plate and multiple conductive structures penetrating through the reinforced plate. The package structure also includes a redistribution structure over the reinforced plate. The redistribution structure has multiple polymer-containing layers and multiple conductive features. The package structure further includes multiple chip structures bonded to the redistribution structure through multiple solder bumps. In addition, the package structure includes a protective layer surrounding the chip structures.

## Claims

### Claim 1

A package structure, comprising:
a reinforced plate;
a plurality of conductive structures penetrating through the reinforced plate;
a redistribution structure over the reinforced plate, wherein the redistribution structure comprises a plurality of polymer-containing layers and a plurality of conductive features, the reinforced plate is thinner than the redistribution structure, and a thickness ratio of a thickness of the reinforced plate to a thickness of the redistribution structure is greater than about 0.5;
a plurality of chip structures bonded to the redistribution structure through a plurality of solder bumps;
an underfill structure surrounding the solder bumps, wherein a portion of the underfill structure is between the redistribution structure and the chip structures; and
a protective layer surrounding the chip structures, wherein the underfill structure separates at least one of the chip structures from the protective layer.

### Claim 2 (depends on 1)

The package structure as claimed in claim 1, further comprising:
a dielectric layer extending along a top surface of the reinforced plate and extending along sidewalls of the conductive structures.

### Claim 3 (depends on 1)

The package structure as claimed in claim 1, further comprising:
an interconnection structure between the reinforced plate and the redistribution structure, wherein the interconnection structure comprises a passivation layer, a plurality of silicon-containing oxide layers, and a plurality of second conductive features, and the passivation layer is thinner than the plurality of silicon-containing oxide layers.

### Claim 4 (depends on 3)

The package structure as claimed in claim 3, wherein the passivation layer is in direct contact with the redistribution structure.

### Claim 5 (depends on 1)

The package structure as claimed in claim 1, further comprising:
a second redistribution structure, wherein the reinforced plate is between the second redistribution structure and the redistribution structure, and the second redistribution structure comprises a plurality of second polymer-containing layers and a plurality of second conductive features.

### Claim 6 (depends on 1)

The package structure as claimed in claim 1, wherein the reinforced plate is made of a glass material.

### Claim 7 (depends on 1)

The package structure as claimed in claim 1, wherein the reinforced plate is made of a semiconductor material.

### Claim 8 (depends on 1)

The package structure as claimed in claim 1, wherein the reinforced plate is in direct contact with a polymer-containing layer of the polymer-containing layers of the redistribution structure.

### Claim 9 (depends on 1)

The package structure as claimed in claim 1, further comprising:
a thermal conductive structure extending across opposite edges of the chip structures, wherein the thermal conductive structure is in direct contact with the underfill structure.

### Claim 10 (depends on 1)

The package structure as claimed in claim 1, further comprising:
a thermal conductive structure over the chip structures, wherein the thermal conductive structure extends across opposite edges of the chip structures.

### Claim 11

A package structure, comprising:
a reinforced plate;
a redistribution structure over the reinforced plate, wherein the redistribution structure comprises a plurality of polymer-containing layers and a plurality of first conductive features;
an interconnection structure between the reinforced plate and the redistribution structure, wherein the interconnection structure comprises a passivation layer, a plurality of silicon-containing oxide layers, and a plurality of second conductive features, wherein the passivation layer is in direct contact with the redistribution structure;
a plurality of chip structures bonded to the redistribution structure through a plurality of solder bumps;
a protective layer surrounding the chip structures; and
a thermal conductive structure directly on the chip structures.

### Claim 12 (depends on 11)

The package structure as claimed in claim 11, wherein the reinforced plate is as wide as the redistribution structure.

### Claim 13 (depends on 11)

The package structure as claimed in claim 11, wherein the reinforced plate is as wide as the protective layer.

### Claim 14 (depends on 11)

The package structure as claimed in claim 11, further comprising:
a first electrode layer, a capacitor dielectric layer, and a second electrode layer extending into the reinforced plate from a top surface of the reinforced plate.

### Claim 15 (depends on 11)

The package structure as claimed in claim 11, further comprising:
a second redistribution structure in direct contact with a bottom surface of the reinforced plate.

### Claim 16

A package structure, comprising:
a reinforced plate;
a redistribution structure over the reinforced plate, wherein the redistribution structure comprises a plurality of polymer-containing layers and a plurality of first conductive features;
an interconnection structure between the reinforced plate and the redistribution structure, wherein the interconnection structure comprises a plurality of silicon-containing oxide layers and a plurality of second conductive features, wherein the interconnection structure is thinner than the redistribution structure;
a plurality of chip structures bonded to the redistribution structure through a plurality of solder bumps;
a protective layer surrounding the chip structures; and
a thermal conductive structure extending across opposite edges of the chip structures, wherein the thermal conductive structure is in direct contact with the protective layer.

### Claim 17 (depends on 16)

The package structure as claimed in claim 16, wherein the interconnection structure is in direct contact with the redistribution structure.

### Claim 18 (depends on 16)

The package structure as claimed in claim 16, further comprising:
a second redistribution structure, wherein the reinforced plate is between the second redistribution structure and the redistribution structure, and the second redistribution structure comprises a plurality of second polymer-containing layers and a plurality of third conductive features.

### Claim 19 (depends on 18)

The package structure as claimed in claim 18, wherein the second redistribution structure is in direct contact with the reinforced plate.

### Claim 20 (depends on 16)

The package structure as claimed in claim 16, further comprising:
a plurality of conductive vias penetrating through the reinforced plate.