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US 12,218,042 B2Granted
Via plug resistor
AssigneeIntel Corporation
InventorsSantosh Gangal, Tin Poay Chuah
Life of this patent
Estimating the term…
Abstract
Disclosed herein are via plug resistors for incorporation into electronic substrates, and related methods and devices. Exemplary via plug resistor structures include a resistive element within and on a surface of a via extending at least partially through an electronic substrate and first and second electrodes coupled to the resistive element.
Claims22
An apparatus, comprising:
- an electronic substrate comprising a via extending at least partially between a first side and an opposing second side of the electronic substrate, wherein a surface of the via comprises one or more layers of the electronic substrate;
- a resistive element comprising a resistive material within the via, the resistive element on the surface of the via, and the resistive material comprising one or more of nickel and chromium, ruthenium and oxygen, iridium and oxygen, rhenium and oxygen, gold, tin, or a carbon nanotube epoxy;
- and
- first and second electrodes coupled to the resistive element.
1 more element
A method, comprising:
- providing a first via and a second via each at least partially through an electronic substrate, wherein a first surface of the first via and a second surface of the second via each comprise one or more layers of the electronic substrate;
- forming a first resistive element within the first via and a second resistive element within the second via, the first resistive element on the first surface of the first via and the second resistive element on the second surface of the second via, and the first resistive element comprising a first resistive material, wherein:
- the first resistive material comprises one or more of copper and nickel, nickel and chromium, ruthenium and oxygen, iridium and oxygen, rhenium and oxygen, gold, tin, or a carbon nanotube epoxy;
- or
- the second resistive element comprises a second resistive material other than the first resistive material;
- and
- coupling first and second electrodes to the first resistive element to form a first resistor comprising the first and second electrodes and the first resistive element and coupling third and fourth electrodes to the second resistive element to form a second resistor comprising the third and fourth electrodes and the second resistive element.
4 more elements
An apparatus, comprising:
- an electronic substrate comprising a first via and a second via each extending at least partially between a first side and an opposing second side of the electronic substrate, wherein a first surface of the first via and a second surface of the second via each comprise one or more layers of the electronic substrate;
- a first resistive element comprising a first resistive material within the first via, the first resistive element on the first surface of the first via;
- a second resistive element comprising a second resistive material within the second via, the second resistive element on the second surface of the second via;
- first and second electrodes coupled to the first resistive element;
- and
- third and fourth electrodes coupled to the second resistive element.
3 more elements
Dependencies are inferred from the claim text.