# US 12,218,038 B2 · Leadframe, semiconductor package and method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,218,038 B2 - Document ID: US12218038B2 - Status: Granted - Kind: B2 - Application number: 16/533,315 - Filed: 2019-08-06 - Published: 2020-02-13 - Granted: 2025-02-04 - Earliest claimed: 2018-08-07 - Assignees: Infineon Technologies Austria AG - Applicants: Infineon Technologies Austria AG - Inventors: Chau Fatt Chiang; Paul Armand Asentista Calo; Kok Yau Chua; Josef Hoeglauer; Swee Kah Lee; Khay Chwan Saw - Web page: https://patentgrep.com/patent/US12218038B2 ## CPC - H10W 70/424: {Cross-sectional shapes (H10W70/481 takes precedence)} - H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00} - H10W 70/041: {Connecting or disconnecting interconnections to or from leadframes, e.g. connecting bond wires or bumps} - H10W 70/464: {Additional interconnections in combination with leadframes} - H10W 70/465: {Bumps or wires} - H10W 70/466: {Tape carriers or flat leads} - H10W 90/811: {Multiple chips on leadframes} - H10W 72/5449: {not being orthogonal to a side surface of the chip, e.g. fan-out arrangements} - H10W 72/5475: {multiple bond wires connected to common bond pads at both ends of the wires} - H10W 72/926: {Multiple bond pads having different sizes} - H10W 90/726: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/753: {between laterally-adjacent chips} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/766: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract In an embodiment, a leadframe includes a first electrically conductive part and a second electrically conductive part, each having an outer surface arranged to provide substantially coplanar outer contact areas having a footprint and an inner surface opposing the outer surface, the first part being spaced apart from the second part by a gap, a first recess arranged in the inner surface of the first part, a second recess arranged in the inner surface of the second part, and a first electrically conductive insert that is arranged in, and extends between, the first recess and the second recess and bridges the gap between the first part and the second part. ## Claims ### Claim 1 A leadframe, comprising: a first electrically conductive part and a second electrically conductive part, each having an outer surface arranged to provide substantially coplanar outer contact areas having a footprint and an inner surface opposing the outer surface, the first electrically conductive part being spaced apart from the second electrically conductive part by a gap; a first recess arranged in the inner surface of the first electrically conductive part; a second recess arranged in the inner surface of the second electrically conductive part; and a first electrically conductive insert arranged in, and extending between, the first recess and the second recess and bridging the gap between the first electrically conductive part and the second electrically conductive part. ### Claim 2 (depends on 1) The leadframe of claim 1, wherein an upper surface of the first electrically conductive insert is substantially coplanar with the inner surface of the first electrically conductive part and with the inner surface of the second electrically conductive part of the leadframe. ### Claim 3 (depends on 1) The leadframe of claim 1, further comprising an electrically insulating coating on a lower surface of the first electrically conductive insert, and wherein the lower surface faces towards the inner surface of the first electrically conductive part and the inner surface of the second electrically conductive part. ### Claim 4 (depends on 3) The leadframe of claim 3, wherein the electrically insulating coating is on side faces of the first electrically conductive insert. ### Claim 5 (depends on 1) The leadframe of claim 1, wherein at least one of the first recess and the second recess is coated with an electrically insulating coating. ### Claim 6 (depends on 1) The leadframe of claim 1, wherein the first electrically conductive insert is mechanically attached to and electrically insulated from the first electrically conductive part and the second electrically conductive part. ### Claim 7 (depends on 1) The leadframe of claim 1, wherein the first electrically conductive insert is mechanically attached to and electrically connected to the first electrically conductive part and the second electrically conductive part. ### Claim 8 (depends on 1) The leadframe of claim 1, wherein the first electrically conductive insert comprises a first lateral end that is disposed within the first recess, a second lateral end that is disposed within the second recess, and a planar lower surface that extends along a single plane between the first and second lateral end. ### Claim 9 (depends on 8) The leadframe of claim 8, wherein the first electrically conductive insert comprises a planar upper surface opposite from the planar lower surface, and wherein the planar upper surface of the first electrically conductive insert extends along a second single plane between the first and second lateral ends, the second single plane being parallel to and spaced apart from the single plane. ### Claim 10 (depends on 8) The leadframe of claim 8, wherein the planar lower surface of the first electrically conductive insert is mechanically attached and/or electrically connected to the inner surface of the first electrically conductive part in the first recess, and wherein the planar lower surface of the first electrically conductive insert is mechanically attached and/or electrically connected to the inner surface of the second electrically conductive part in the second recess. ### Claim 11 (depends on 1) The leadframe of claim 1, wherein the first electrically conductive part comprises a step shaped transition from a thicker portion of the first electrically conductive part to the first recess, wherein the thicker portion of the first electrically conductive part has a uniform thickness and extends from the step shaped transition of the first part to an outer lateral end of the first electrically conductive part, wherein the second electrically conductive part comprises a step shaped transition from a thicker portion of the second electrically conductive part to the second recess, wherein the thicker portion of the second electrically conductive part has a uniform thickness and extends from the step shaped transition of the second electrically conductive part to an outer lateral end of the second part. ### Claim 12 A semiconductor package, comprising: a first semiconductor device; and a leadframe comprising: a first electrically conductive part and a second electrically conductive part, each having an outer surface arranged to provide substantially coplanar outer contact areas having a footprint and an inner surface opposing the outer surface, the first electrically conductive part being spaced apart from the second electrically conductive part by a gap; a first recess arranged in the inner surface of the first electrically conductive part; a second recess arranged in the inner surface of the second electrically conductive part; and a first electrically conductive insert arranged in, and extending between, the first recess and the second recess and bridging the gap between the first electrically conductive part and the second electrically conductive part; and wherein the first electrically conductive insert forms a portion of an internal electrically conductive redistribution structure between the first semiconductor device and an outer contact area of the leadframe. ### Claim 13 (depends on 12) The semiconductor package of claim 12, wherein the first semiconductor device is mounted on the first electrically conductive part and on the first electrically conductive insert of the leadframe. ### Claim 14 (depends on 13) The semiconductor package of claim 13, wherein the first semiconductor device is a transistor device having a source contact pad and a gate contact pad, wherein the first electrically conductive insert is mechanically attached to and electrically insulated from the first electrically conductive part of the leadframe and is mechanically attached to and electrically connected to the second electrically conductive part of the leadframe, and wherein the source contact pad of the transistor device is mounted on and electrically connected to the first electrically conductive part of the leadframe and the gate contact pad of the transistor device is mounted on and electrically connected to the first electrically conductive insert. ### Claim 15 (depends on 12) The semiconductor package of claim 12, further comprising a second semiconductor device, wherein the first semiconductor device is mounted on the first electrically conductive part of the leadframe and the second semiconductor device is mounted on the second electrically conductive part of the leadframe. ### Claim 16 (depends on 15) The semiconductor package of claim 15, wherein the first electrically conductive insert is mechanically attached to and electrically connected to the first electrically conductive part and to the second electrically conductive part of the leadframe, wherein the first semiconductor device is electrically coupled to the first electrically conductive insert by a bond wire, wherein the second semiconductor device is a transistor device having a source pad, wherein the source pad of the transistor device is mounted on and electrically coupled to the second electrically conductive part of the leadframe and is electrically coupled to the first electrically conductive insert. ### Claim 17 (depends on 15) The semiconductor package of claim 15, wherein the first electrically conductive insert is mechanically attached to and electrically insulated from the first electrically conductive part and from the second electrically conductive part of the leadframe and is mechanically attached to and electrically connected to a fourth part of the leadframe, the fourth part of the leadframe being spaced apart from the first electrically conductive part and the second electrically conductive part of the leadframe. ### Claim 18 (depends on 12) The semiconductor package of claim 12, wherein the first electrically conductive insert is mechanically attached to and electrically insulated from the first electrically conductive part and the second electrically conductive part of the leadframe, wherein the first semiconductor device is electrically coupled to the first electrically conductive insert by one or more bond wires, and wherein the first electrically conductive insert is electrically coupled to a third electrically conductive part of the leadframe by one or more bond wires, the third electrically conductive part of the leadframe being spaced apart from the first electrically conductive part and the second electrically conductive part of the leadframe. ### Claim 19 (depends on 18) The semiconductor package of claim 18, wherein the first electrically conductive insert is mechanically attached to and electrically insulated from the first electrically conductive part and from the second electrically conductive part of the leadframe and is mechanically attached to and electrically connected to a fourth part of the leadframe, the fourth part of the leadframe being spaced apart from the first electrically conductive part and the second electrically conductive part of the leadframe. ### Claim 20 (depends on 18) The semiconductor package of claim 18, further comprising a second electrically conductive insert mechanically attached to and electrically insulated from the second electrically conductive part of the leadframe and mechanically attached to and electrically connected to a fourth part of the leadframe, wherein the fourth part of the leadframe is spaced apart from the first electrically conductive part, the second electrically conductive part and the third electrically conductive part of the leadframe, and wherein a contact pad of the first semiconductor device is electrically coupled to the second electrically conductive insert and the fourth part of the leadframe.