# US 12,218,025 B2 · Electronic device

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- Number: US 12,218,025 B2
- Document ID: US12218025B2
- Status: Granted
- Kind: B2
- Application number: 17/656,158
- Filed: 2022-03-23
- Published: 2022-07-07
- Granted: 2025-02-04
- Earliest claimed: 2019-09-27
- Assignees: Denso Corporation
- Applicants: Denso Corporation
- Inventors: Syuhei Miyachi
- Web page: https://patentgrep.com/patent/US12218025B2

## CPC

- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation}
- H10W 90/00: Package configurations
- H10W 40/251: {Organics}
- H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)}
- H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W 72/50: Bond wires
- H10W 72/534: {being rectangular}
- H10W 72/551: {Materials of bond wires}
- H10W 72/60: Strap connectors, e.g. thick copper clips for grounding of power devices
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/886: {Die-attach connectors and strap connectors}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 74/473: {containing a filler}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An electronic device includes a semiconductor device, a wiring board, a heat dissipating member, and a housing. The semiconductor device includes a semiconductor element, a conductive member electrically connected to the semiconductor element, and a resin mold sealing the semiconductor element. The wiring board includes a wiring portion on which the semiconductor device is mounted, and a resist portion disposed around the wiring portion. The heat dissipating member is in thermal contact with at least one of surfaces of the semiconductor device. The housing is in thermal contact with the semiconductor device through the heat dissipating member. Each of the resin mold and the heat dissipating member has a thermal conductivity higher than that of the resist portion.

## Claims

### Claim 1

An electronic device, comprising:
a semiconductor device including:
a semiconductor element;
a conductive member electrically connected to the semiconductor element; and
a resin mold sealing the semiconductor element;
a wiring board including:
a wiring portion on which the semiconductor device is mounted; and
a resist portion disposed around the wiring portion;
a heat dissipating member in thermal contact with at least one of surfaces of the semiconductor device; and
a housing in thermal contact with the semiconductor device through the heat dissipating member, wherein
each of the resin mold and the heat dissipating member has a thermal conductivity higher than that of the resist portion.

### Claim 2 (depends on 1)

The electronic device according to claim 1, wherein
at least a part of the resin mold is in contact with the housing.

### Claim 3 (depends on 1)

The electronic device according to claim 1, wherein
the housing includes:
a flat surface portion disposed at a position facing an upper surface or a lower surface of the semiconductor device; and
a side surface portion disposed at a position facing at least one of side surfaces of the semiconductor device that are not parallel with the upper surface and the lower surface.

### Claim 4 (depends on 3)

The electronic device according to claim 3, wherein
the side surface portion protrudes from the flat surface portion, and
a height of the side surface portion is higher than a height of the semiconductor device between the upper surface and the lower surface.

### Claim 5 (depends on 1)

The electronic device according to claim 1, wherein
the heat dissipating member is disposed between a side surface portion of the housing and the wiring board.

### Claim 6 (depends on 1)

The electronic device according to claim 1, wherein
the conductive member has an exposed part that is not covered with the resin mold.

### Claim 7 (depends on 6)

The electronic device according to claim 6, wherein
a surface of the exposed part of the conductive member is insulated by insulation plating.