# US 12,218,019 B2 · Method for manufacturing electronic component device, and electronic component device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,218,019 B2 - Document ID: US12218019B2 - Status: Granted - Kind: B2 - Application number: 17/612,316 - Filed: 2020-05-21 - Published: 2022-08-04 - Granted: 2025-02-04 - Earliest claimed: 2019-07-30 - Assignees: Resonac Corporation - Applicants: Showa Denko Materials Co., Ltd. - Inventors: Tomoaki Shibata; Tsuyoshi Ogawa; Xinrong Li - Web page: https://patentgrep.com/patent/US12218019B2 ## CPC - H10W 74/117: {the substrate having spherical bumps for external connection} - H10P 72/74: {using temporarily an auxiliary support} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H10W 70/611: {for connecting multiple chips together} - H10W 70/685: comprising multiple insulating layers - H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10P 72/7424: {used as a support during the manufacture of self-supporting substrates} - H10W 72/0198: {batch processes} - H10W 72/072: {of bump connectors} - H10W 72/222: {Multilayered bumps, e.g. a coating on top and side surfaces of a bump core} - H10W 72/241: {Dispositions, e.g. layouts} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/00: Package configurations - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract Disclosed is a method for manufacturing an electronic component device, including: preparing a sealing structure including a sealing layer having two opposing main surfaces, an electronic component, and a connection portion, the connection portion being exposed on a circuit surface that is one main surface of the sealing layer; preparing a rewiring structure including a rewiring portion having two opposing main surfaces, and a plurality of bumps; and bonding the sealing structure and the rewiring structure in a direction that the circuit surface and the plurality of bumps face each other, with an insulating adhesive layer intervening, and thereby connecting the sealing structure and the rewiring structure. ## Claims ### Claim 1 A method for manufacturing an electronic component device, the method comprising: preparing a sealing structure comprising a sealing layer having two opposing main surfaces, an electronic component sealed in the sealing layer, and a connection portion connected to the electronic component, the connection portion being exposed on a circuit surface that is one main surface of the sealing layer; preparing a rewiring structure comprising a rewiring portion having two opposing main surfaces, and a plurality of bumps provided on one main surface of the rewiring portion, the rewiring portion comprising rewiring connected to the plurality of bumps, and an insulating layer, wherein preparing the rewiring structure includes: preparing a carrier base material comprising a support and a temporary fixing material layer provided on the support; forming the rewiring portion on the temporary fixing material layer; and forming the plurality of bumps connected to the rewiring on the main surface of the rewiring portion on a side opposite to the carrier base material; bonding the sealing structure and the rewiring structure in a direction that the circuit surface and the plurality of bumps face each other, with an insulating adhesive layer intervening, such that the connection portion and at least a part of the plurality of bumps are connected, thereby connecting the sealing structure and the rewiring structure; and peeling off the carrier base material from the rewiring structure connected to the sealing structure. ### Claim 2 (depends on 1) The method according to claim 1, wherein when the rewiring structure is connected to the sealing structure, the rewiring portion protrudes to an outside from an end portion of the sealing structure. ### Claim 3 (depends on 2) The method according to claim 2, wherein a part of the plurality of bumps is disposed on the rewiring portion in a portion protruding to the outside from the end portion of the sealing structure when the rewiring structure is connected to the sealing structure. ### Claim 4 (depends on 3) The method according to claim 3, further comprising: forming a conductive shield film covering a portion not in contact with the insulating adhesive layer on an outer surface of the sealing structure connected to the rewiring structure, and the portion protruding to the outside from the end portion of the sealing structure on the main surface of the rewiring portion on the sealing structure side, wherein the conductive shield film is connected to at least one of the bumps disposed on the rewiring portion in the portion protruding to the outside from the end portion of the sealing structure. ### Claim 5 (depends on 1) The method according to claim 1, wherein the sealing structure comprises a plurality of electronic components, and the plurality of electronic components comprise an integrated circuit chip and a chip type passive component. ### Claim 6 (depends on 1) The method according to claim 1, wherein connecting the sealing structure and the rewiring structure includes: preliminarily connecting the sealing structure and the rewiring structure such that the connection portion and at least a part of the plurality of bumps are in contact with each other, by pressure-bonding the sealing structure and the rewiring structure, with the insulating adhesive layer intervening, while heating at a temperature lower than a melting point of the plurality of bumps; and joining the connection portion and the at least a part of the plurality of bumps by pressurizing the sealing structure and the rewiring structure while heating at a temperature higher than the melting point of the plurality of bumps, in this order. ### Claim 7 A method for manufacturing an electronic component device, the method comprising: preparing a sealing structure comprising a sealing layer having two opposing main surfaces, an electronic component sealed in the sealing layer, and a connection portion connected to the electronic component, the connection portion being exposed on a circuit surface that is one main surface of the sealing layer; preparing a rewiring structure comprising a rewiring portion having two opposing main surfaces, and a plurality of bumps provided on one main surface of the rewiring portion, the rewiring portion comprising rewiring connected to the plurality of bumps, and an insulating layer; bonding the sealing structure and the rewiring structure in a direction that the circuit surface and the plurality of bumps face each other, with an insulating adhesive layer intervening, such that the connection portion and at least a part of the plurality of bumps are connected, thereby connecting the sealing structure and the rewiring structure; and forming a conductive shield film covering a portion not in contact with the insulating adhesive layer on an outer surface of the sealing structure connected to the rewiring structure. ### Claim 8 A method for manufacturing an electronic component device, the method comprising: preparing a sealing structure comprising a sealing layer having two opposing main surfaces, an electronic component sealed in the sealing layer, and a connection portion connected to the electronic component, the connection portion being exposed on a circuit surface that is one main surface of the sealing layer, wherein preparing the sealing structure includes: preparing a composite carrier base material including a support, a temporary fixing material layer, and a curable adhesive layer, which are laminated in this order; disposing the electronic component on the adhesive layer of the composite carrier base material, with interposing the connection portion in contact with the adhesive layer between the adhesive layer and the electronic component; fixing the electronic component to the composite carrier base material by curing the adhesive layer; forming the sealing layer sealing the electronic component on the adhesive layer; curing the sealing layer; obtaining the sealing structure comprising the adhesive layer, the electronic component, and the sealing layer, by peeling off the temporary fixing material layer from the adhesive layer; and forming the circuit surface on which the connection portion is exposed by grinding the sealing structure from the adhesive layer side, in this order; preparing a rewiring structure comprising a rewiring portion having two opposing main surfaces, and a plurality of bumps provided on one main surface of the rewiring portion, the rewiring portion comprising rewiring connected to the plurality of bumps, and an insulating layer; and bonding the sealing structure and the rewiring structure in a direction that the circuit surface and the plurality of bumps face each other, with an insulating adhesive layer intervening, such that the connection portion and at least a part of the plurality of bumps are connected, thereby connecting the sealing structure and the rewiring structure.