# US 12,217,979 B2 · Temperature controlled substrate carrier and polishing components > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,217,979 B2 - Document ID: US12217979B2 - Status: Granted - Kind: B2 - Application number: 16/913,252 - Filed: 2020-06-26 - Published: 2021-01-07 - Granted: 2025-02-04 - Earliest claimed: 2019-07-01 - Assignees: Axus Technology, LLC - Applicants: Axus Technology, LLC - Inventors: Daniel Ray Trojan; John Kevin Shugrue - Web page: https://patentgrep.com/patent/US12217979B2 ## CPC - H10P 72/0432: {mainly by conduction} - B24B 37/015: Temperature control - B24B 37/04: designed for working plane surfaces - B24B 37/30: for single side lapping of plane surfaces - B24B 37/32: Retaining rings - B24B 55/02: Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant (cooling or lubricating during dressing operation B24B53/095; incorporated in grinding wheels B24D) - H10P 52/402: {of semiconductor materials} - H10P 52/403: {of conductive or resistive materials} - H10P 72/7616: {characterised by a coating, a hardness or a material} - H10P 50/00: Etching of wafers, substrates or parts of devices - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ## Abstract Temperature controlled polishing pads are disclosed. In one aspect, a CMP system includes the use of any type of atomizing system to cool or remove energy and/or heat from the polishing pad of a CMP system. The atomizing system can use of any liquid medium in combination of any compressed gas through an orifice to cool or remove the energy and/or heat from the pad, thereby allowing for higher removal rates during CMP. ## Claims ### Claim 1 A substrate carrier head, comprising: a carrier body; a substrate retainer attached to the carrier body, the substrate retainer comprising an aperture configured to receive a substrate; a resilient membrane having a first surface configured to contact a surface of the substrate and a second surface opposing the first surface; a membrane cavity formed along the second surface of the resilient membrane; an inlet configured to allow liquid to flow into the membrane cavity; an outlet configured to allow liquid to flow from the membrane cavity; a regulator upstream of the inlet and configured to regulate a flow-rate of the liquid through the membrane cavity; and a liquid flow controller including a control processor configured to control the regulator to regulate the flow of the liquid through the membrane cavity during planarization of the substrate such that the flow-rate of the liquid is sufficient through the membrane cavity to adjust a temperature of the substrate during processing of the substrate. ### Claim 2 (depends on 1) The substrate carrier head of claim 1, wherein the outlet is located at a farther radial position from a center of the carrier body than the inlet. ### Claim 3 (depends on 2) The substrate carrier head of claim 2, wherein the inlet is located at approximately the center of the carrier body. ### Claim 4 (depends on 1) The substrate carrier head of claim 1, further comprising: a secondary resilient membrane having a width that is less than a width of the resilient membrane. ### Claim 5 (depends on 1) The substrate carrier head of claim 1, further comprising a liquid tight seal between the resilient membrane and the carrier body. ### Claim 6 (depends on 1) The substrate carrier head of claim 1, wherein the control processor is further configured to control the flow of the liquid to have a sufficient flow-rate through the membrane cavity to remove excess heat generated during the processing of the substrate. ### Claim 7 (depends on 1) The substrate carrier head of claim 1, further comprising: a heat exchanger configured to cool the liquid before the liquid is provided to the inlet in order to cool the substrate. ### Claim 8 (depends on 1) The substrate carrier head of claim 1, further comprising: a heat exchanger configured to heat the liquid before the liquid is provided to the inlet in order to heat the substrate. ### Claim 9 A substrate carrier system, comprising: a substrate carrier head, comprising: a carrier body; a substrate retainer attached to the carrier body, the substrate retainer configured to retain a substrate on the carrier body; a resilient membrane having a first surface configured to contact a surface of the substrate and a second surface opposing the first surface; and a membrane cavity formed along the second surface of the resilient membrane, the membrane cavity configured to allow a liquid to flow along the second surface; one or more regulators upstream of the membrane cavity; and a control system including a control processor configured to control a temperature of the substrate to within a threshold of a target temperature by controlling the one or more regulators to regulate a flow-rate of the liquid through the membrane cavity during processing of the substrate. ### Claim 10 (depends on 9) The substrate carrier system of claim 9, wherein the substrate carrier head further comprises: an inlet configured to allow liquid to flow into the membrane cavity; and an outlet configured to allow liquid to flow from the membrane cavity. ### Claim 11 (depends on 10) The substrate carrier system of claim 10, wherein the outlet is further configured to recirculate the liquid back into the inlet. ### Claim 12 (depends on 10) The substrate carrier system of claim 10, wherein the outlet is located at a farther radial position from a center of the carrier body than the inlet. ### Claim 13 (depends on 12) The substrate carrier system of claim 12, wherein the inlet is located at approximately the center of the carrier body. ### Claim 14 (depends on 9) The substrate carrier system of claim 9, further comprising: a heat exchanger configured to cool the liquid below an ambient temperature. ### Claim 15 (depends on 9) The substrate carrier system of claim 9, further comprising: a liquid source fluidly connected to the membrane cavity via a first one of the one or more regulators. ### Claim 16 (depends on 9) The substrate carrier system of claim 9, wherein the substrate carrier head further comprises: a secondary resilient membrane having a width that is less than a width of the resilient membrane. ### Claim 17 (depends on 16) The substrate carrier system of claim 16, wherein the resilient membrane is substantially entirely imperforated. ### Claim 18 (depends on 9) The substrate carrier system of claim 9, further comprising: a fluid back pressure regulator downstream of the membrane cavity and configured to control a liquid pressure of the liquid within the membrane cavity to control a pressure applied to the substrate during processing of the substrate. ### Claim 19 (depends on 9) The substrate carrier system of claim 9, further comprising: a pressure ring configured to form the membrane cavity, the pressure ring including one or more channels through which the liquid flows from a first side of the pressure ring to a second side of the pressure ring. ### Claim 20 (depends on 9) The substrate carrier system of claim 9, wherein the control system is further configured to: i) measure the flow-rate of the liquid, a pressure of the liquid, and/or a temperature of the liquid, and ii) control the one or more regulators to regulate the flow-rate of the liquid based on the measured flow-rate of the liquid, the measure pressure of the liquid, and/or the measured temperature of the liquid. ### Claim 21 A method for cooling a substrate during chemical mechanical polishing (CMP) of the substrate, the method comprising: retaining a substrate within an aperture of a substrate retainer, the substrate retainer attached to a carrier body of a carrier head including a resilient membrane; supplying a liquid to a membrane cavity within the carrier head, the membrane cavity formed along a surface of the resilient membrane; and using a regulator located upstream of the membrane cavity to control a flow-rate of the liquid through the membrane cavity during the CMP of the substrate such that the flow-rate of the liquid through the membrane cavity is sufficient to adjust a temperature of the substrate during processing of the substrate. ### Claim 22 (depends on 21) The method of claim 21, further comprising: flowing the liquid through an inlet into the membrane cavity; and flowing the liquid through an outlet from the membrane cavity. ### Claim 23 (depends on 22) The method of claim 22, further comprising: recirculating the liquid from the outlet back into the inlet. ### Claim 24 (depends on 21) The method of claim 21, further comprising: cooling the liquid below an ambient temperature.