# US 12,217,963 B2 · Bonding apparatus, bonding system, and bonding method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,217,963 B2 - Document ID: US12217963B2 - Status: Granted - Kind: B2 - Application number: 17/594,973 - Filed: 2020-04-27 - Published: 2022-09-01 - Granted: 2025-02-04 - Earliest claimed: 2019-05-08 - Assignees: Tokyo Electron Limited - Applicants: Tokyo Electron Limited - Inventors: Yutaka Yamasaki; Takashi Terada - Web page: https://patentgrep.com/patent/US12217963B2 ## CPC - H10P 10/128: {by direct semiconductor to semiconductor bonding} - B23K 20/02: by means of a press {; Diffusion bonding} - B23K 20/233: without ferrous layer - B23K 20/24: Preliminary treatment - H10P 72/0428: {Apparatus for mechanical treatment or grinding or cutting} - H10P 72/53: {using optical controlling means} - H10P 72/7612: {characterised by lifting arrangements, e.g. lift pins} - H10P 72/7618: {characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel} - H10W 46/00: Marks applied to devices, e.g. for alignment or identification - B23K 2101/40: Semiconductor devices - H10W 46/101: {characterised by the type of information, e.g. logos or symbols} - H10W 46/301: {for alignment} - H10W 46/501: {for use before dicing} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A bonding apparatus configured to bond a first substrate and a second substrate includes: a first holder configured to hold the first substrate; a second holder disposed to face the first holder in a vertical direction, and configured to hold the second substrate; a processing vessel accommodating the first holder and the second holder therein; and a horizontal position adjuster provided outside the processing vessel and connected to the first holder via a support supporting the first holder, the horizontal position adjuster being configured to adjust a horizontal position of the first holder. ## Claims ### Claim 1 A bonding apparatus configured to bond a first substrate and a second substrate, comprising: a first holder configured to hold the first substrate; a second holder disposed to face the first holder in a vertical direction, and configured to hold the second substrate; a processing vessel accommodating the first holder and the second holder therein; a horizontal position adjuster provided outside the processing vessel and connected to the first holder via a support supporting the first holder, the horizontal position adjuster being configured to adjust a horizontal position of the first holder; and a pressing unit provided outside the processing vessel and connected to a central portion of the first holder, the pressing unit being configured to allow the first holder to approach the second holder to press the first substrate against the second substrate, wherein the processing vessel comprises a first chamber provided at a first holder side and a second chamber provided at a second holder side, and is configured to be hermetically sealed by bringing the first chamber and the second chamber into contact with each other, the bonding apparatus further comprises an elevating mechanism configured to move the first chamber up and down, and a load applied to the first holder by the pressing unit in a state that the processing vessel is decompressed to be in a vacuum state is borne by a reaction force by the elevating mechanism and a pressure difference between an atmospheric pressure outside the processing vessel and a vacuum pressure inside the processing vessel. ### Claim 2 (depends on 1) The bonding apparatus of claim 1, further comprising: a vertical position adjuster provided outside the processing vessel and connected to the first holder via the support, the vertical position adjuster being configured to adjust a vertical position of the first holder. ### Claim 3 (depends on 1) The bonding apparatus of claim 1, wherein the support comprises: a moving plate provided outside the processing vessel and connected with the horizontal position adjuster; and a transmission shaft penetrating the processing vessel to connect the moving plate and the first holder. ### Claim 4 (depends on 1) The bonding apparatus of claim 1, wherein the horizontal position adjuster comprises a UVW stage having a U-axis, a V-axis and a W-axis as driving axes. ### Claim 5 (depends on 1) The bonding apparatus of claim 1, wherein the pressing unit comprises: a pressing mechanism configured to press the first substrate against the second substrate; and a measuring mechanism configured to measure a load between the pressing mechanism and the first holder. ### Claim 6 (depends on 5) The bonding apparatus of claim 5, wherein the pressing mechanism is a hydraulic cylinder or a pneumatic cylinder. ### Claim 7 (depends on 1) The bonding apparatus of claim 1, further comprising: an imaging unit comprising a first imaging device configured to image a first alignment mark formed on a bonding surface of the first substrate, and a second imaging device configured to image a second alignment mark formed on a bonding surface of the second substrate; and a moving mechanism configured to move the imaging unit in a first direction and in a second direction orthogonal to the first direction in a planar region between the first holder and the second holder. ### Claim 8 (depends on 1) A bonding system configured to bond a first substrate and a second substrate, comprising: a processing station comprising a bonding apparatus according to claim 1; and a carry-in/out station configured to carry the first substrate, the second substrate, and a combined substrate in which the first substrate and the second substrate are bonded to each other to/from the processing station. ### Claim 9 A bonding method of bonding a first substrate and a second substrate, comprising: holding the first substrate by a first holder provided within a processing vessel; holding the second substrate by a second holder disposed within the processing vessel to face the first holder in a vertical direction; adjusting a horizontal position of the first holder by a horizontal position adjuster provided outside the processing vessel and connected to the first holder via a support supporting the first holder; and allowing the first holder to approach the second holder to press the first substrate against the second substrate by a pressing unit provided outside the processing vessel and connected to a central portion of the first holder, wherein the processing vessel comprises a first chamber provided at a first holder side and a second chamber provided at a second holder side, and is configured to be hermetically sealed by bringing the first chamber and the second chamber into contact with each other, and a load applied to the first holder by the pressing unit in a state that the processing vessel is decompressed to be in a vacuum state is borne by a reaction force by an elevating mechanism configured to move the first chamber up and down and a pressure difference between an atmospheric pressure outside the processing vessel and a vacuum pressure inside the processing vessel.