# US 12,217,944 B2 · High power cable for heated components in RF environment > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,217,944 B2 - Document ID: US12217944B2 - Status: Granted - Kind: B2 - Application number: 18/526,215 - Filed: 2023-12-01 - Published: 2024-03-28 - Granted: 2025-02-04 - Earliest claimed: 2017-07-31 - Assignees: Lam Research Corporation - Applicants: Lam Research Corporation - Inventors: Seyed Jafar Jafarian-Tehrani; Kenneth Walter Finnegan; Sean O'Brien; Benson Q. Tong - Web page: https://patentgrep.com/patent/US12217944B2 ## CPC - H01J 37/32724: {Temperature} - H01B 9/00: Power cables - H01B 9/006: {Constructional features relating to the conductors} - H01J 37/32577: {Electrical connecting means} - H01J 37/32642: {Focus rings} - H03H 7/01: Frequency selective two-port networks - H10P 72/0432: {mainly by conduction} - H10P 72/722: {Details of electrostatic chucks} - H01J 2237/2001: Maintaining constant desired temperature - H10P 72/70: for supporting or gripping - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A substrate support includes an edge ring, a heater element arranged within the edge ring, a ceramic layer, at least one heating element arranged within the ceramic layer, and a cable configured to provide power from a power source to the heater element and the at least one heating element. The cable includes a first plurality of wires connected to the heater element, a second plurality of wires connected to the at least one heating element, a filter module, and an isolation device connected only to the first plurality of wires between the filter module and the heater element. The first and second pluralities of wires are twisted together within the filter module. The isolation device is configured to compensate for a resonance frequency generated during operation of the heater element and the at least one heating element. ## Claims ### Claim 1 A substrate support, comprising: an edge ring; a heater element arranged within the edge ring; a ceramic layer; at least one heating element arranged within the ceramic layer; and a cable configured to provide power from a power source to the heater element within the edge ring and the at least one heating element within the ceramic layer, wherein the cable includes, within the cable: a first plurality of wires connected to the heater element within the edge ring; a second plurality of wires connected to the at least one heating element within the ceramic layer; a filter module, wherein the first plurality of wires and the second plurality of wires are twisted together within the filter module; and an isolation device connected only to the first plurality of wires between the filter module and the heater element within the edge ring, wherein the isolation device is configured to compensate for a resonance frequency generated during operation of the heater element within the edge ring and the at least one heating element within the ceramic layer. ### Claim 2 (depends on 1) The substrate support of claim 1, wherein the first plurality of wires includes a pair of wires configured to provide the power from the power source to the heater element within the edge ring. ### Claim 3 (depends on 1) The substrate support of claim 1, wherein the at least one heating element comprises to a plurality of heating elements, and the second plurality of wires includes a plurality of pairs of wires each configured to provide the power from the power source to a respective heating element of the plurality of heating elements. ### Claim 4 (depends on 1) The substrate support of claim 1, wherein, to compensate for the resonance frequency, the isolation device is configured to cancel the resonance frequency. ### Claim 5 (depends on 1) The substrate support of claim 1, wherein, to compensate for the resonance frequency, the isolation device is configured to shift the resonance frequency relative to operating frequencies of radio frequency power provided to the substrate support. ### Claim 6 (depends on 1) The substrate support of claim 1, wherein, to compensate for the resonance frequency, the isolation device has an impedance that is selected in accordance with the resonance frequency. ### Claim 7 (depends on 1) The substrate support of claim 1, wherein the isolation device includes a transformer. ### Claim 8 (depends on 1) The substrate support of claim 1, wherein the isolation device includes at least one of a ferrite bead and ferrite bead material. ### Claim 9 (depends on 1) The substrate support of claim 1, wherein the first plurality of wires and the second plurality of wires are twisted together and wound around a core to form a filtering inductor within the filter module. ### Claim 10 (depends on 1) The substrate support of claim 1, wherein the isolation device includes an inductor. ### Claim 11 (depends on 10) The substrate support of claim 10, wherein the inductor is formed around an inductor core. ### Claim 12 (depends on 11) The substrate support of claim 11, wherein the inductor core is a dielectric core. ### Claim 13 (depends on 11) The substrate support of claim 11, wherein the inductor core is conductive. ### Claim 14 (depends on 12) The substrate support of claim 12, wherein the inductor core includes one of ferrite and iron. ### Claim 15 (depends on 10) The substrate support of claim 10, wherein the inductor is air wound.