# US 12,217,939 B2 · RF tuning systems including tuning circuits having impedances for setting and adjusting parameters of electrodes in electrostatic chucks > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,217,939 B2 - Document ID: US12217939B2 - Status: Granted - Kind: B2 - Application number: 17/451,975 - Filed: 2021-10-22 - Published: 2022-02-10 - Granted: 2025-02-04 - Earliest claimed: 2018-08-02 - Assignees: Lam Research Corporation - Applicants: Lam Research Corporation - Inventors: David French; Vincent E. Burkhart; Karl Frederick Leeser; Liang Meng - Web page: https://patentgrep.com/patent/US12217939B2 ## CPC - H01J 37/32183: {Matching circuits} - C23C 16/45565: {Shower nozzles} - C23C 16/4586: {Elements in the interior of the support, e.g. electrodes, heating or cooling devices} - C23C 16/5096: {Flat-bed apparatus} - H01J 37/32458: {Vessel} - H01J 37/32541: {Shape} - H01J 37/32568: {Relative arrangement or disposition of electrodes; moving means} - H01J 37/32577: {Electrical connecting means} - H01J 37/32697: {Electrostatic control} - H01J 37/32724: {Temperature} - H05B 1/02: Automatic switching arrangements specially adapted to apparatus {; Control of heating devices} (thermally-actuated switches H01H37/00) - H10P 72/722: {Details of electrostatic chucks} - H01J 2237/334: Etching - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A substrate processing system for processing a substrate within a processing chamber is provided and includes a source terminal, a substrate support, and a tuning circuit. The substrate support holds the substrate and includes first and second electrodes, which receive power from a power source via the source terminal. The tuning circuit is connected to the first electrode or the second electrode. The tuning circuit is allocated for tuning signals provided to the first electrode. The tuning circuit includes at least one of a first impedance set or a second impedance set. The first impedance set is serially connected between the first electrode and the power source and receives a first signal from the power source via the source terminal. The second impedance set is connected between an output of the power source and a reference terminal and receives the first signal from the power source via the source terminal. ## Claims ### Claim 1 A substrate processing system, the substrate processing system comprising: a substrate support configured to support the substrate, wherein the substrate support comprises a first one or more electrodes; and a first tuning circuit connected to the first one or more electrodes and a ground reference terminal and comprising: a series impedance set comprising a first impedance and a second impedance connected in series with the first impedance, and a parallel impedance set connected to the series impedance set and comprising a third impedance and a fourth impedance connected in parallel with the third impedance. ### Claim 2 (depends on 1) The substrate processing system of claim 1, wherein the series impedance set is connected between the first one or more electrodes and the parallel impedance set. ### Claim 3 (depends on 1) The substrate processing system of claim 1, wherein the first tuning circuit is connected in series with the first one or more electrodes and the ground reference terminal. ### Claim 4 (depends on 1) The substrate processing system of claim 1, wherein the parallel impedance set is connected in series with the series impedance set. ### Claim 5 (depends on 1) The substrate processing system of claim 1, wherein: the first one or more electrodes comprise a first electrode and a second electrode; and the first tuning circuit is connected to the first electrode and the second electrode. ### Claim 6 (depends on 1) The substrate processing system of claim 1, further comprising a second tuning circuit, wherein: the substrate support comprises a second one or more electrodes; and the second tuning circuit is connected to the second one or more electrodes and the ground reference terminal and comprises a series impedance set comprising a first impedance and a second impedance connected in series with the first impedance of the second tuning circuit, and a parallel impedance set connected to the series impedance set of the second tuning circuit and comprising a third impedance and a fourth impedance connected in parallel with the third impedance of the second tuning circuit. ### Claim 7 (depends on 6) The substrate processing system of claim 6, wherein: the substrate support comprises a top plate and a baseplate; the first one or more electrodes are disposed in the top plate; and the second one or more electrodes are disposed in the baseplate. ### Claim 8 (depends on 6) The substrate processing system of claim 6, wherein the first one or more electrodes and the second one or more electrodes are concentrically disposed. ### Claim 9 (depends on 6) The substrate processing system of claim 6, wherein: the first one or more electrodes are circular-shaped; and the second one or more electrodes are annular-shaped. ### Claim 10 (depends on 1) The substrate processing system of claim 1, wherein: the substrate support comprises a top plate and a baseplate; and the first one or more electrodes are disposed in the top plate. ### Claim 11 (depends on 1) The substrate processing system of claim 1, wherein: the substrate support comprises a top plate and a baseplate; and the first one or more electrodes are disposed in the baseplate. ### Claim 12 (depends on 1) The substrate processing system of claim 1, wherein: the substrate support comprises a top plate and a baseplate; one or more of the first one or more electrodes are disposed in the top plate; and a remainder of the first one or more electrodes are disposed in the baseplate. ### Claim 13 (depends on 1) The substrate processing system of claim 1, wherein the first one or more electrodes are concentrically disposed. ### Claim 14 (depends on 1) The substrate processing system of claim 1, wherein: the first one or more electrodes comprise a first electrode and a second electrode; the first electrode and the second electrode are concentrically disposed; the first electrode is circular-shaped; and the second electrode is annular-shaped. ### Claim 15 (depends on 1) The substrate processing system of claim 1, wherein: the first one or more electrodes comprise a clamping electrode and a first bias electrode; the clamping electrode is circular-shaped; and the first bias electrode is at least one of circular-shaped or annular-shaped. ### Claim 16 (depends on 1) The substrate processing system of claim 1, wherein the first one or more electrodes comprise a second bias electrode that is annular-shaped.