Multi-layer vacuum electron device and method of manufacture
AssigneeElve Inc.
InventorDiana Gamzina Daugherty
Life of this patent
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Abstract
Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.
Claims20
A vacuum electron device, comprising:
- a first non-magnetic conductor plate having a first external surface and a first internal surface;
- a second non-magnetic conductor plate having a second external surface and an second internal surface;
- and
- a plurality of non-magnetic interaction structure forming plates disposed between the first internal surface of the first non-magnetic conductor plate and the second internal surface of the second non-magnetic conductor plate, the plurality of non-magnetic interaction structure forming plates together forming a radio-frequency (RF) interaction structure housing an RF interaction region for transmitting an electron beam,
- the first non-magnetic conductor plate, the second non-magnetic conductor plate and the plurality of non-magnetic interaction structure forming plates being bonded together.
A method for fabricating one or more vacuum electron devices, the method comprising:
- forming from a first non-magnetic electrically conductive material a first non-magnetic conductor plate having a first external surface and a first internal surface;
- forming from a second non-magnetic electrically conductive material a second non-magnetic conductor plate having a second external surface and an second internal surface;
- forming a radio-frequency (RF) interaction zone in each of a plurality of electrically conductive non-magnetic interaction structure forming plates;
- stacking the plurality of electrically conductive non-magnetic interaction structure forming plates to form an RF interaction structure, the RF interaction zones together forming an RF interaction region for transmitting an electron beam;
- disposing the first non-magnetic conductor plate, the RF interaction structure, and the second non-magnetic conductor plate in a stack such that the first external surface of the non-magnetic conductor plate and the second external surface of the second non-magnetic conductor plate are outside of the stack;
- and
- bonding the first non-magnetic conductor plate, the RF interaction structure, and the second non-magnetic conductor plate together.
Dependencies are inferred from the claim text.